KATAKURA; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KATAKURA; Hideaki.The latest application filed is for "trimming method".

Company Profile

0.13.16

KATAKURA; Hideaki - Matsumoto-city JP
Katakura; Hideaki - Matsumoto JP
KATAKURA; Hideaki - Nagano JP
KATAKURA; Hideaki - Matsumoto-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Trimming Method App 20220068414 - KATAKURA; Hideaki	2022-03-03
Semiconductor integrated circuit Grant 11,133,228 - Katakura September 28, 2	2021-09-28
Semiconductor device and method of manufacturing semiconductor device Grant 10,964,686 - Toyoda , et al. March 30, 2	2021-03-30
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20200335490 - TOYODA; Yoshiaki ; et al.	2020-10-22
Semiconductor Integrated Circuit App 20200303262 - KATAKURA; Hideaki	2020-09-24
Semiconductor device and method of manufacturing semiconductor device Grant 10,720,421 - Toyoda , et al.	2020-07-21
Semiconductor device and semiconductor module Grant 10,580,907 - Toyoda , et al.	2020-03-03
Semiconductor device Grant 10,276,661 - Katakura	2019-04-30
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20190081033 - TOYODA; Yoshiaki ; et al.	2019-03-14
Semiconductor Device App 20190051573 - KATAKURA; Hideaki	2019-02-14
Semiconductor Device And Semiconductor Module App 20190006527 - TOYODA; Yoshiaki ; et al.	2019-01-03
Semiconductor device with protective element portion Grant 10,141,299 - Toyoda , et al. Nov	2018-11-27
Semiconductor Device App 20180076201 - TOYODA; Yoshiaki ; et al.	2018-03-15
Semiconductor device and method for manufacturing the semiconductor device Grant 9,880,203 - Katakura , et al. January 30, 2	2018-01-30
Semiconductor device and method for testing the semiconductor device Grant 9,865,586 - Katakura , et al. January 9, 2	2018-01-09
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20170179109 - TOYODA; Yoshiaki ; et al.	2017-06-22
Semiconductor device and method of manufacturing semiconductor device Grant 9,543,217 - Toyoda , et al. January 10, 2	2017-01-10
Semiconductor device and power conversion device using the same Grant 9,537,486 - Yamaji , et al. January 3, 2	2017-01-03
Semiconductor Device And Method For Testing The Semiconductor Device App 20160276333 - KATAKURA; Hideaki ; et al.	2016-09-22
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20160254198 - TOYODA; Yoshiaki ; et al.	2016-09-01
Semiconductor device Grant 9,419,132 - Toyoda , et al. August 16, 2	2016-08-16
Polysilicon fuse, manufacturing method thereof, and semiconductor device including polysilicon fuse Grant 9,412,694 - Katakura August 9, 2	2016-08-09
Semiconductor Device App 20150357463 - KATAKURA; Hideaki	2015-12-10
Polysilicon fuse, semiconductor device having overlapping polysilicon fuse sections and method of severing polysilicon fuse Grant 9,196,585 - Katakura November 24, 2	2015-11-24
Semiconductor Device App 20150311339 - TOYODA; Yoshiaki ; et al.	2015-10-29
Semiconductor Device And Method For Manufacturing The Semiconductor Device App 20150260760 - KATAKURA; Hideaki ; et al.	2015-09-17
Polysilicon Fuse, Semiconductor Device Having Polysilicon Fuse And Method Of Severing Polysilicon Fuse App 20150155237 - KATAKURA; Hideaki	2015-06-04
Semiconductor Device And Power Conversion Device Using The Same App 20150023082 - YAMAJI; Masaharu ; et al.	2015-01-22
Polysilicon Fuse, Manufacturing Method Thereof, And Semiconductor Device Including Polysilicon Fuse App 20140339675 - KATAKURA; Hideaki	2014-11-20

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