KATAKABE; ICHIRO

Patent Applications and Registrations

Patent applications and USPTO patent grants for KATAKABE; ICHIRO.The latest application filed is for "substrate processing method".

Company Profile

0.10.16

KATAKABE; ICHIRO - KANAGAWA-KEN JP
Katakabe; Ichiro - Tokyo JP
Katakabe; Ichiro - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Processing Method App 20100043839 - HAMADA; SATOMI ; et al.	2010-02-25
Apparatus for and method of processing substrate Grant 7,578,887 - Kajita , et al. August 25, 2	2009-08-25
Substrate processing apparatus, substrate processing method, and substrate holding apparatus Grant 7,578,886 - Yamada , et al. August 25, 2	2009-08-25
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20090026068 - Hongo; Akihisa ; et al.	2009-01-29
Substrate Processing Apparatus and Method App 20080110861 - Kajita; Shinji ; et al.	2008-05-15
Apparatus for cleaning a substrate having metal interconnects App 20080017220 - Kodera; Masako ; et al.	2008-01-24
Substrate processing method Grant 7,309,449 - Ono , et al. December 18, 2	2007-12-18
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20070113977 - Hongo; Akihisa ; et al.	2007-05-24
Substrate processing apparatus, substrate processing method, and substrate holding apparatus App 20060234503 - Yamada; Kaoru ; et al.	2006-10-19
Revolution member supporting apparatus and semiconductor substrate processing apparatus Grant 6,921,466 - Hongo , et al. July 26, 2	2005-07-26
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20050087441 - Hongo, Akihisa ; et al.	2005-04-28
Substrate processing apparatus and substrate processing method App 20050026455 - Hamada, Satomi ; et al.	2005-02-03
Electroless plating apparatus and post-electroless plating cleaning method App 20040245214 - Katakabe, Ichiro ; et al.	2004-12-09
Substrate processing method App 20040226915 - Ono, Haruko ; et al.	2004-11-18
Apparatus for and method of processing substrate App 20040211959 - Kajita, Shinji ; et al.	2004-10-28
Apparatus for cleaning a substrate having metal interconnects App 20040177655 - Kodera, Masako ; et al.	2004-09-16
Method and apparatus for etching ruthenium films Grant 6,776,919 - Fukunaga , et al. August 17, 2	2004-08-17
Method of and apparatus for cleaning substrate Grant 6,745,784 - Katakabe , et al. June 8, 2	2004-06-08
Method of and apparatus for cleaning substrate App 20030168089 - Katakabe, Ichiro ; et al.	2003-09-11
Substrate processing apparatus and method App 20030092264 - Kajita, Shinji ; et al.	2003-05-15
Method of and apparatus for cleaning substrate Grant 6,558,478 - Katakabe , et al. May 6, 2	2003-05-06
Method and apparatus for etching ruthenium films App 20020060202 - Fukunaga, Akira ; et al.	2002-05-23
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20020006876 - Hongo, Akihisa ; et al.	2002-01-17
Heat treatment apparatus for semiconductor wafers Grant 5,878,191 - Miyashita , et al. March 2, 1	1999-03-02
Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer Grant 5,643,046 - Katakabe , et al. July 1, 1	1997-07-01
Polishing apparatus of semiconductor wafer Grant 5,605,488 - Ohashi , et al. February 25, 1	1997-02-25

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