Kataishi; Takumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kataishi; Takumi.The latest application filed is for "thermally conductive silicone gel composition".

Company Profile

2.4.5

Kataishi; Takumi - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat-conductive sheet, mounting method using same and bonding method using same Grant 11,450,589 - Kikuchi , et al. September 20, 2	2022-09-20
Thermally Conductive Silicone Gel Composition App 20220169857 - KATAISHI; Takumi ; et al.	2022-06-02
Composite Resin Granules And Method For Producing The Same, And Thermally Conductive Resin Molded Body Using Composite Resin Granules And Method For Producing Thermally Conductive Resin Molded Body App 20200377728 - TOMINAGA; Yuichi ; et al.	2020-12-03
Heat-conductive Sheet, Mounting Method Using Same And Bonding Method Using Same App 20200176350 - KIKUCHI; Setsuo ; et al.	2020-06-04
Phosphor-containing identification substance and method for producing the same Grant 10,017,000 - Saruyama , et al. July 10, 2	2018-07-10
Phosphor-containing Identification Substance And Method For Producing The Same App 20160144650 - SARUYAMA; Toshio ; et al.	2016-05-26
Wire array rubber connector and method for producing the same Grant 9,160,094 - Yamada , et al. October 13, 2	2015-10-13
Wire Array Rubber Connector And Method For Producing The Same App 20120322315 - Yamada; Shinji ; et al.	2012-12-20

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