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Patent applications and USPTO patent grants for KATAGIRI; Yasushi.The latest application filed is for "processing apparatus".
Patent | Date |
---|---|
Processing Apparatus App 20200238570 - RIKIISHI; Toshiyasu ;   et al. | 2020-07-30 |
Method for controlling inkjet printing apparatus Grant 10,093,095 - Izawa , et al. October 9, 2 | 2018-10-09 |
Method for controlling inkjet printing apparatus Grant 9,925,772 - Izawa , et al. March 27, 2 | 2018-03-27 |
Method For Controlling Inkjet Printing Apparatus App 20170274657 - IZAWA; Hideo ;   et al. | 2017-09-28 |
Method For Controlling Inkjet Printing Apparatus App 20170274656 - IZAWA; Hideo ;   et al. | 2017-09-28 |
Method for controlling inkjet printing apparatus Grant 9,707,755 - Izawa , et al. July 18, 2 | 2017-07-18 |
Method For Controlling Inkjet Printing Apparatus App 20160263891 - IZAWA; Hideo ;   et al. | 2016-09-15 |
Inkjet recording apparatus Grant 9,290,013 - Izawa , et al. March 22, 2 | 2016-03-22 |
Inkjet Recording Apparatus App 20150375531 - IZAWA; Hideo ;   et al. | 2015-12-31 |
Ink jet recording apparatus Grant 9,090,093 - Izawa , et al. July 28, 2 | 2015-07-28 |
Method and apparatus for correcting print images in an electrophotographic printer Grant 8,189,026 - Izawa , et al. May 29, 2 | 2012-05-29 |
Method And Apparatus For Correcting Print Images In An Electrophotographic Printer App 20110199452 - Izawa; Hideo ;   et al. | 2011-08-18 |
Electronic photograph printer Grant 7,792,442 - Izawa , et al. September 7, 2 | 2010-09-07 |
Ink Jet Recording Apparatus App 20100194814 - Izawa; Hideo ;   et al. | 2010-08-05 |
Electronic Photograph Printer App 20090208231 - IZAWA; Hideo ;   et al. | 2009-08-20 |
Method for cutting semiconductor wafer protecting sheet Grant 6,910,403 - Ishikawa , et al. June 28, 2 | 2005-06-28 |
Planarization apparatus and method Grant 6,910,943 - Ishikawa , et al. June 28, 2 | 2005-06-28 |
Printing machine Grant 6,782,817 - Izawa , et al. August 31, 2 | 2004-08-31 |
Printing machine App 20030167943 - Izawa, Hideo ;   et al. | 2003-09-11 |
Method for manufacturing semiconductor chips Grant 6,583,032 - Ishikawa , et al. June 24, 2 | 2003-06-24 |
Wafer surface machining apparatus Grant 6,517,420 - Ishikawa , et al. February 11, 2 | 2003-02-11 |
Planarization apparatus and method App 20020160691 - Ishikawa, Toshihiko ;   et al. | 2002-10-31 |
Planarization apparatus Grant 6,431,949 - Ishikawa , et al. August 13, 2 | 2002-08-13 |
Wafer surface machining apparatus App 20010024936 - Ishikawa, Toshihiko ;   et al. | 2001-09-27 |
Wafer surface machining apparatus Grant 6,257,966 - Ishikawa , et al. July 10, 2 | 2001-07-10 |
Titanium Dioxide-containing Synthetic Filament Having Improved Properties, Textile Products Made Therefrom And Method Of Imparting Said Improved Properties Grant 3,616,184 - Katagiri , et al. October 26, 1 | 1971-10-26 |
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