Katagiri; Mitsuaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Katagiri; Mitsuaki.The latest application filed is for "stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods, devices and apparatuses".
Company Profile
5.73.78
- Katagiri; Mitsuaki - Tokyo JP
- Katagiri; Mitsuaki - Tokyo Nishitokyo JP
- KATAGIRI; Mitsuaki - Chuo-ku Tokyo JP
- Katagiri; Mitsuaki - Chuo-ku N/A JP
- Katagiri; Mitsuaki - Nishitokyo JP
- Katagiri; Mitsuaki - Nishi-Tokyo JP
- Katagiri; Mitsuaki - Koganei JP
- Katagiri; Mitsuaki - Higashimurayama JP
Patent Activity
| Patent | Date |
|---|---|
| Stacked Die Package Including A First Die Coupled To A Substrate Through Direct Chip Attachment And A Second Die Coupled To The Substrate Through Wire Bonding, And Related Methods, Devices And Apparatuses App 20210327856 - Fujisawa; Hiroki ; et al. | 2021-10-21 |
| Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses Grant 11,081,468 - Fujisawa , et al. August 3, 2 | 2021-08-03 |
| Stacked Die Package Including Wire Bonding And Direct Chip Attachment, And Related Methods, Devices And Apparatuses App 20210066247 - Fujisawa; Hiroki ; et al. | 2021-03-04 |
| Apparatuses comprising semiconductor dies in face-to-face arrangements Grant 10,600,762 - Sasaki , et al. | 2020-03-24 |
| Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements App 20190304955 - Sasaki; Dai ; et al. | 2019-10-03 |
| Apparatuses comprising semiconductor dies in face-to-face arrangements Grant 10,431,566 - Sasaki , et al. O | 2019-10-01 |
| Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements App 20190013294 - Sasaki; Dai ; et al. | 2019-01-10 |
| Apparatuses comprising semiconductor dies in face-to-face arrangements Grant 10,115,709 - Sasaki , et al. October 30, 2 | 2018-10-30 |
| Semiconductor package with bonding wires of reduced loop inductance Grant 9,595,489 - Katagiri , et al. March 14, 2 | 2017-03-14 |
| Semiconductor device Grant 9,589,921 - Katagiri , et al. March 7, 2 | 2017-03-07 |
| Semiconductor device Grant 9,418,967 - Koshiishi , et al. August 16, 2 | 2016-08-16 |
| Semiconductor Device App 20160027754 - Katagiri; Mitsuaki ; et al. | 2016-01-28 |
| Semiconductor Device App 20160027758 - Katagiri; Mitsuaki ; et al. | 2016-01-28 |
| Semiconductor Device App 20150262974 - Koshiishi; Kazutaka ; et al. | 2015-09-17 |
| Device having electrodes formed from bumps with different diameters Grant 9,048,221 - Hasegawa , et al. June 2, 2 | 2015-06-02 |
| Semiconductor device stack with bonding layer and wire retaining member Grant 8,970,052 - Hasegawa , et al. March 3, 2 | 2015-03-03 |
| Semiconductor device Grant 8,941,237 - Hasegawa , et al. January 27, 2 | 2015-01-27 |
| Semiconductor Device App 20150022255 - KATAGIRI; Mitsuaki ; et al. | 2015-01-22 |
| Semiconductor device Grant 8,853,822 - Katagiri , et al. October 7, 2 | 2014-10-07 |
| Semiconductor device Grant 8,796,077 - Takeda , et al. August 5, 2 | 2014-08-05 |
| Semiconductor Package With Bonding Wires Of Reduced Loop Inductance App 20140103542 - KATAGIRI; Mitsuaki ; et al. | 2014-04-17 |
| Semiconductor Device App 20140094000 - TAKEDA; Hiromasa ; et al. | 2014-04-03 |
| Test method and interposer used therefor Grant 8,680,881 - Uematsu , et al. March 25, 2 | 2014-03-25 |
| Semiconductor Device Stack With Bonding Layer And Wire Retaining Member App 20140035166 - HASEGAWA; Yu ; et al. | 2014-02-06 |
| Semiconductor package with bonding wires of reduced loop inductance Grant 8,633,596 - Katagiri , et al. January 21, 2 | 2014-01-21 |
| Semiconductor device having wiring layers with power-supply plane and ground plane Grant 8,604,601 - Isa , et al. December 10, 2 | 2013-12-10 |
| Semiconductor device that suppresses malfunctions due to noise generated in internal circuit Grant 8,587,097 - Takeda , et al. November 19, 2 | 2013-11-19 |
| Semiconductor device stack with bonding layer and wire retaining member Grant 8,581,417 - Hasegawa , et al. November 12, 2 | 2013-11-12 |
| Semiconductor device Grant 8,569,898 - Takeda , et al. October 29, 2 | 2013-10-29 |
| Semiconductor Device App 20130277835 - HASEGAWA; Yu ; et al. | 2013-10-24 |
| Semiconductor device and stacked semiconductor device Grant 8,513,803 - Sasaki , et al. August 20, 2 | 2013-08-20 |
| Semiconductor device Grant 8,487,433 - Hasegawa , et al. July 16, 2 | 2013-07-16 |
| Semiconductor Device App 20130140674 - KATAGIRI; Mitsuaki ; et al. | 2013-06-06 |
| Device App 20130127048 - HASEGAWA; Yu ; et al. | 2013-05-23 |
| Semiconductor Device App 20130114223 - ITAYA; Satoshi ; et al. | 2013-05-09 |
| Semiconductor device Grant 8,426,983 - Takeda , et al. April 23, 2 | 2013-04-23 |
| Semiconductor Device And Stacked Semiconductor Device App 20130093083 - SASAKI; Dai ; et al. | 2013-04-18 |
| Semiconductor device including semiconductor chips with different thickness Grant 8,372,693 - Katagiri , et al. February 12, 2 | 2013-02-12 |
| Fine pitch grid array type semiconductor device Grant 8,362,614 - Katagiri , et al. January 29, 2 | 2013-01-29 |
| Semiconductor device including plural electrode pads Grant 8,331,182 - Takeda , et al. December 11, 2 | 2012-12-11 |
| Semiconductor Device Including Semiconductor Chips With Different Thickness App 20120302007 - KATAGIRI; Mitsuaki ; et al. | 2012-11-29 |
| Semiconductor device with additional power supply paths Grant 8,243,465 - Itaya , et al. August 14, 2 | 2012-08-14 |
| Semiconductor Device App 20120200159 - KATAGIRI; Mitsuaki ; et al. | 2012-08-09 |
| Semiconductor device including semiconductor chips with different thickness Grant 8,237,251 - Katagiri , et al. August 7, 2 | 2012-08-07 |
| BGA semiconductor device having a dummy bump Grant 8,222,737 - Watanabe , et al. July 17, 2 | 2012-07-17 |
| Semiconductor Device And Method Of Fabricating The Same App 20120146242 - Fujishima; Hiroyuki ; et al. | 2012-06-14 |
| Semiconductor Package With Bonding Wires Of Reduced Loop Inductance App 20120119387 - KATAGIRI; Mitsuaki ; et al. | 2012-05-17 |
| BGA semiconductor device having a dummy bump Grant 8,164,186 - Watanabe , et al. April 24, 2 | 2012-04-24 |
| Semiconductor Device App 20120061826 - HASEGAWA; Yu ; et al. | 2012-03-15 |
| Semiconductor device Grant 8,063,476 - Koshiishi , et al. November 22, 2 | 2011-11-22 |
| Test Method And Interposer Used Therefor App 20110234249 - UEMATSU; Yutaka ; et al. | 2011-09-29 |
| Semiconductor Device App 20110180934 - TAKEDA; Hiromasa ; et al. | 2011-07-28 |
| Semiconductor device having improved solder joint and internal lead lifetimes Grant 7,960,846 - Katagiri , et al. June 14, 2 | 2011-06-14 |
| Semiconductor device Grant 7,956,470 - Isa , et al. June 7, 2 | 2011-06-07 |
| Semiconductor device Grant 7,944,026 - Koshiishi , et al. May 17, 2 | 2011-05-17 |
| Semiconductor package substrate and semiconductor device having the same App 20110084395 - Takeda; Hiromasa ; et al. | 2011-04-14 |
| Semiconductor Device Including Plural Electrode Pads App 20110063936 - Takeda; Hiromasa ; et al. | 2011-03-17 |
| Semiconductor device Grant 7,875,986 - Isa , et al. January 25, 2 | 2011-01-25 |
| Semiconductor Device That Suppresses Malfunctions Due To Noise Generated In Internal Circuit App 20100314779 - TAKEDA; Hiromasa ; et al. | 2010-12-16 |
| Multichip package or system-in package Grant 7,851,898 - Nakamura , et al. December 14, 2 | 2010-12-14 |
| Semiconductor device including semiconductor chip with two pad rows Grant 7,847,377 - Osanai , et al. December 7, 2 | 2010-12-07 |
| Bga Semiconductor Device Having A Dummy Bump App 20100295179 - Watanabe; Yuji ; et al. | 2010-11-25 |
| Semiconductor device App 20100295162 - Katagiri; Mitsuaki ; et al. | 2010-11-25 |
| Semiconductor Device App 20100289141 - Takeda; Hiromasa ; et al. | 2010-11-18 |
| Inductance analysis system and method and program therefor Grant 7,823,096 - Katagiri , et al. October 26, 2 | 2010-10-26 |
| Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes Grant 7,816,768 - Koshiishi , et al. October 19, 2 | 2010-10-19 |
| Semiconductor Device And Stacked Semiconductor Device In Which Circuit Board And Semiconductor Chip Are Connected By Leads App 20100224984 - SASAKI; Dai ; et al. | 2010-09-09 |
| Semiconductor Device App 20100213611 - Isa; Satoshi ; et al. | 2010-08-26 |
| Semiconductor Device App 20100208443 - ITAYA; Satoshi ; et al. | 2010-08-19 |
| Semiconductor stack package having wiring extension part which has hole for wiring Grant 7,777,350 - Sasaki , et al. August 17, 2 | 2010-08-17 |
| Semiconductor Device And Method Of Manufacturing The Semiconductor Device App 20100193933 - HASEGAWA; Yu ; et al. | 2010-08-05 |
| Semiconductor Device App 20100193929 - IWAKURA; Ken ; et al. | 2010-08-05 |
| Semiconductor Device That Supresses Malfunctions Due To Voltage Reduction App 20100188878 - TAKEDA; Hiromasa ; et al. | 2010-07-29 |
| Stacked-type semiconductor package Grant 7,714,424 - Katagiri , et al. May 11, 2 | 2010-05-11 |
| Electromagnetic Field Analysis Of Semiconductor Package With Semiconductor Chip Mounted Thereon App 20100095257 - Koshiishi; Kazutaka ; et al. | 2010-04-15 |
| Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor Grant 7,694,245 - Katagiri , et al. April 6, 2 | 2010-04-06 |
| Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package Grant 7,689,944 - Katagiri , et al. March 30, 2 | 2010-03-30 |
| Method for designing device, system for aiding to design device, and computer program product therefor Grant 7,681,154 - Katagiri , et al. March 16, 2 | 2010-03-16 |
| Semiconductor device or printed wiring board design method and design support system that implements settings by using a semiconductor device model that expresses parasitic elements that occur when packaged App 20090327981 - Nakamura; Satoshi ; et al. | 2009-12-31 |
| Semiconductor device App 20090250801 - Isa; Satoshi ; et al. | 2009-10-08 |
| Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same Grant 7,569,428 - Isa , et al. August 4, 2 | 2009-08-04 |
| Semiconductor Device Including Semiconductor Chips With Different Thickness App 20090184409 - KATAGIRI; Mitsuaki ; et al. | 2009-07-23 |
| DRAM stacked package, DIMM, and semiconductor manufacturing method Grant 7,546,506 - Sonoda , et al. June 9, 2 | 2009-06-09 |
| Semiconductor Device App 20090140409 - Koshiishi; Kazutaka ; et al. | 2009-06-04 |
| Semiconductor Device Having Improved Solder Joint And Internal Lead Lifetimes App 20090140412 - Katagiri; Mitsuaki ; et al. | 2009-06-04 |
| Semiconductor device Grant 7,538,431 - Isa , et al. May 26, 2 | 2009-05-26 |
| Semiconductor device having improved solder joint and internal lead lifetimes Grant 7,504,734 - Katagiri , et al. March 17, 2 | 2009-03-17 |
| Semiconductor stack package having wiring extension part which has hole for wiring App 20090032973 - Sasaki; Dai ; et al. | 2009-02-05 |
| Semiconductor storage device having a plurality of stacked memory chips Grant 7,466,577 - Sekiguchi , et al. December 16, 2 | 2008-12-16 |
| Semiconductor Device App 20080224311 - ISA; Satoshi ; et al. | 2008-09-18 |
| Stacked-type semiconductor package App 20080203584 - Katagiri; Mitsuaki ; et al. | 2008-08-28 |
| Semiconductor device App 20080173987 - Koshiishi; Kazutaka ; et al. | 2008-07-24 |
| Semiconductor Device App 20080164585 - Koshiishi; Kazutaka ; et al. | 2008-07-10 |
| Semiconductor device Grant 7,391,113 - Isa , et al. June 24, 2 | 2008-06-24 |
| Stacked-type semiconductor package Grant 7,375,422 - Katagiri , et al. May 20, 2 | 2008-05-20 |
| Method For Designing Device, System For Aiding To Design Device, And Computer Program Product Therefor App 20080072194 - KATAGIRI; Mitsuaki ; et al. | 2008-03-20 |
| Semiconductor device, noise reduction method, and shield cover Grant 7,345,892 - Imazato , et al. March 18, 2 | 2008-03-18 |
| Semiconductor device App 20080012107 - Isa; Satoshi ; et al. | 2008-01-17 |
| Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor App 20070204251 - Katagiri; Mitsuaki ; et al. | 2007-08-30 |
| Semiconductor Device App 20070164435 - Koshiishi; Kazutaka ; et al. | 2007-07-19 |
| Semiconductor Device App 20070085214 - Isa; Satoshi ; et al. | 2007-04-19 |
| Semiconductor device including semiconductor chip with two pad rows App 20070075440 - Osanai; Fumiyuki ; et al. | 2007-04-05 |
| Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same App 20070069362 - Isa; Satoshi ; et al. | 2007-03-29 |
| Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package App 20070057380 - Katagiri; Mitsuaki ; et al. | 2007-03-15 |
| Inductance analysis system and method and program therefor App 20070033553 - Katagiri; Mitsuaki ; et al. | 2007-02-08 |
| Semiconductor device App 20060249842 - Isa; Satoshi ; et al. | 2006-11-09 |
| Stacked type semiconductor device App 20060249829 - Katagiri; Mitsuaki ; et al. | 2006-11-09 |
| DRAM stacked package, DIMM, and semiconductor manufacturing method App 20060239055 - Sonoda; Yuji ; et al. | 2006-10-26 |
| Semiconductor storage device having a plurality of stacked memory chips App 20060233012 - Sekiguchi; Tomonori ; et al. | 2006-10-19 |
| Multichip package or system-in package App 20060227587 - Nakamura; Satoshi ; et al. | 2006-10-12 |
| Semiconductor device Grant 7,119,428 - Tanie , et al. October 10, 2 | 2006-10-10 |
| Stacked-type semiconductor package App 20060118937 - Katagiri; Mitsuaki ; et al. | 2006-06-08 |
| Fine pitch grid array type semiconductor device App 20060081972 - Katagiri; Mitsuaki ; et al. | 2006-04-20 |
| Semiconductor device, noise reduction method, and shield cover App 20050270758 - Imazato, Masaharu ; et al. | 2005-12-08 |
| Semiconductor device having improved solder joint and internal lead lifetimes App 20050236697 - Katagiri, Mitsuaki ; et al. | 2005-10-27 |
| Semiconductor device App 20050230829 - Watanabe, Yuji ; et al. | 2005-10-20 |
| BGA semiconductor device having a dummy bump App 20050230824 - Watanabe, Yuji ; et al. | 2005-10-20 |
| Semiconductor device and manufacturing method of that Grant 6,946,327 - Miyamoto , et al. September 20, 2 | 2005-09-20 |
| Semiconductor device App 20050189639 - Tanie, Hisashi ; et al. | 2005-09-01 |
| Semiconductor integrated circuit device Grant 6,911,683 - Konishi , et al. June 28, 2 | 2005-06-28 |
| Semiconductor device Grant 6,867,502 - Katagiri , et al. March 15, 2 | 2005-03-15 |
| Semiconductor integrated circuit device and its manufacturing method Grant 6,867,123 - Katagiri , et al. March 15, 2 | 2005-03-15 |
| Wafer level chip size package having rerouting layers Grant 6,861,742 - Miyamoto , et al. March 1, 2 | 2005-03-01 |
| Semiconductor device and a method of manufacturing the same Grant 6,841,881 - Katagiri , et al. January 11, 2 | 2005-01-11 |
| Semiconductor device and a method of manufacturing the same Grant 6,828,174 - Katagiri , et al. December 7, 2 | 2004-12-07 |
| Semiconductor device and a method of manufacturing the same Grant 6,812,565 - Nishimoto , et al. November 2, 2 | 2004-11-02 |
| Semiconductor device and manufacturing method of that App 20040155351 - Miyamoto, Toshio ; et al. | 2004-08-12 |
| Semiconductor integrated circuit device App 20040075157 - Konishi, Satoru ; et al. | 2004-04-22 |
| Semiconductor integrated circuit device and its manufacturing method App 20040023450 - Katagiri, Mitsuaki ; et al. | 2004-02-05 |
| Semiconductor device App 20030168748 - Katagiri, Mitsuaki ; et al. | 2003-09-11 |
| Semiconductor device and a method of manufacturing the same App 20030128602 - Nishimoto, Kenjl ; et al. | 2003-07-10 |
| Semiconductor device and a method of manufacturing the same App 20030111737 - Katagiri, Mitsuaki ; et al. | 2003-06-19 |
| Semiconductor device and a method of manufacturing the same App 20020185744 - Katagiri, Mitsuaki ; et al. | 2002-12-12 |
| Semiconductor device and manufacturing method of that App 20020093082 - Miyamoto, Toshio ; et al. | 2002-07-18 |
| Semiconductor device and method for manufacturing the same Grant 6,297,544 - Nakamura , et al. October 2, 2 | 2001-10-02 |
| Semiconductor integrated circuit Grant 5,986,294 - Miki , et al. November 16, 1 | 1999-11-16 |
| Semiconductor integrated circuit Grant 5,892,276 - Miki , et al. April 6, 1 | 1999-04-06 |
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