Kasulke; Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kasulke; Paul.The latest application filed is for "method and device for applying material to a workpiece".

Company Profile

0.10.4

Kasulke; Paul - Berlin DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device for removing solder material from a soldered joint Grant 7,829,817 - Zakel , et al. November 9, 2	2010-11-09
Method and device for applying material to a workpiece Grant 7,121,449 - Zakel , et al. October 17, 2	2006-10-17
Process for the formation of a spatial chip arrangement and spatial chip arrangement Grant 7,087,442 - Oppermann , et al. August 8, 2	2006-08-08
Method and device for applying pieces of material to a workpiece Grant 7,021,517 - Zakel , et al. April 4, 2	2006-04-04
Device for positioning a tool in relation to a workpiece Grant 6,955,284 - Zakel , et al. October 18, 2	2005-10-18
Method and device for applying material to a workpiece App 20050031776 - Zakel, Elke ; et al.	2005-02-10
Device for positioning a tool in relation to a workpiece App 20040129756 - Zakel, Elke ; et al.	2004-07-08
Device for removing solder material from a soldered joint App 20040026383 - Zakel, Elke ; et al.	2004-02-12
Method for producing contactless chip cards and corresponding contactless chip card Grant 6,651,891 - Zakel , et al. November 25, 2	2003-11-25
Process for the formation of a spatial chip arrangement and spatial chip arrangement App 20020009828 - Oppermann, Hans-Hermann ; et al.	2002-01-24
Chips arranged in plurality of planes and electrically connected to one another Grant 6,281,577 - Oppermann , et al. August 28, 2	2001-08-28
Method and apparatus for testing chips Grant 6,211,571 - Zakel , et al. April 3, 2	2001-04-03
Method of attaching a component to a plate-shaped support Grant 6,056,188 - Azdasht , et al. May 2, 2	2000-05-02
Thermal connecting structure for connecting materials with different expansion coefficients Grant 6,043,985 - Azdasht , et al. March 28, 2	2000-03-28

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