Kassir; Salman M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kassir; Salman M..The latest application filed is for "method for grinding wafers by shaping resilient chuck covering".

Company Profile

0.6.8

Kassir; Salman M. - Paso Robles CA
Kassir; Salman M. - San Luis Obispo CA
Kassir; Salman M - Paso Robles CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Grinding Wafers By Shaping Resilient Chuck Covering App 20160288291 - Kassir; Salman M.	2016-10-06
Method for grinding wafers by shaping resilient chuck covering App 20140057531 - Kassir; Salman M.	2014-02-27
Chuck for supporting wafers with a fluid Grant 7,160,808 - Kassir January 9, 2	2007-01-09
Method of backgrinding wafers while leaving backgrinding tape on a chuck Grant 7,059,942 - Strasbaugh , et al. June 13, 2	2006-06-13
Method of backgrinding wafers while leaving backgrinding tape on a chuck Grant 6,866,564 - Strasbaugh , et al. March 15, 2	2005-03-15
Chuck for supporting wafers with a fluid App 20050009349 - Kassir, Salman M.	2005-01-13
Method of backgrinding wafers while leaving backgrinding tape on a chuck App 20040157536 - Strasbaugh, Alan ; et al.	2004-08-12
Method of spin etching wafers with an alkali solution Grant 6,743,722 - Kassir June 1, 2	2004-06-01
Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers Grant 6,638,389 - Kassir , et al. October 28, 2	2003-10-28
Method of spin etching wafers with an alkali solution App 20030143861 - Kassir, Salman M.	2003-07-31
Method of backgrinding wafers while leaving backgrinding tape on a chuck App 20030134578 - Strasbaugh, Alan ; et al.	2003-07-17
Tool for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers App 20030079828 - Kassir, Salman M. ; et al.	2003-05-01
Grinding process and apparatus for planarizing sawed wafers Grant 5,964,646 - Kassir , et al. October 12, 1	1999-10-12

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