loadpatents
Patent applications and USPTO patent grants for Kaskoun; Kenneth.The latest application filed is for "method, devices and systems for sensor with removable nodes".
Patent | Date |
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Method, devices and systems for sensor with removable nodes Grant 11,266,351 - Kaskoun , et al. March 8, 2 | 2022-03-08 |
Method, Devices And Systems For Sensor With Removable Nodes App 20200245941 - Kind Code | 2020-08-06 |
Methods, devices and systems for sensor with removable nodes Grant 10,667,751 - Kaskoun , et al. | 2020-06-02 |
Method, Devices And Systems For Sensor With Removable Nodes App 20200046291 - KASKOUN; Kenneth ;   et al. | 2020-02-13 |
Method, devices and systems for sensor with removable nodes Grant 10,506,977 - Kaskoun , et al. Dec | 2019-12-17 |
Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing Grant 10,271,745 - Gu , et al. | 2019-04-30 |
Wearable dual-ear mobile otoscope Grant 10,182,710 - Sezan , et al. Ja | 2019-01-22 |
Methods, Devices And Systems For Sensor With Removable Nodes App 20180228438 - KASKOUN; Kenneth ;   et al. | 2018-08-16 |
Biometrics for user identification in mobile health systems Grant 10,025,917 - Sezan , et al. July 17, 2 | 2018-07-17 |
Methods, devices and systems for sensor with removable nodes Grant 9,974,484 - Kaskoun , et al. May 22, 2 | 2018-05-22 |
Stethoscope system including a sensor array Grant 9,955,939 - Sezan , et al. May 1, 2 | 2018-05-01 |
Monolithic Integrated Emitter-detector Array In A Flexible Substrate For Biometric Sensing App 20170360316 - GU; Shiqun ;   et al. | 2017-12-21 |
Biometrics For User Identification In Mobile Health Systems App 20170286661 - Sezan; Muhammed Ibrahim ;   et al. | 2017-10-05 |
Stethoscope System Including A Sensor Array App 20170215835 - Sezan; Muhammed Ibrahim ;   et al. | 2017-08-03 |
Biometrics for user identification in mobile health systems Grant 9,721,409 - Sezan , et al. August 1, 2 | 2017-08-01 |
Method, Devices and Systems for Sensor with Removable Nodes App 20170119312 - KASKOUN; Kenneth ;   et al. | 2017-05-04 |
Method, devices and systems for sensor with removable nodes Grant 9,615,794 - Kaskoun , et al. April 11, 2 | 2017-04-11 |
Button sensor Grant 9,572,532 - Matsumori , et al. February 21, 2 | 2017-02-21 |
Wearable Dual-ear Mobile Otoscope App 20170020382 - Sezan; Muhammed Ibrahim ;   et al. | 2017-01-26 |
Methods, Devices and Systems for Sensor with Removable Nodes App 20160324472 - Kaskoun; Kenneth ;   et al. | 2016-11-10 |
Devices, systems and methods using through silicon optical interconnects Grant 9,478,528 - Kaskoun , et al. October 25, 2 | 2016-10-25 |
Methods, devices and systems for self charging sensors Grant 9,385,560 - Taylor , et al. July 5, 2 | 2016-07-05 |
Integrated circuit module with lead frame micro-needles Grant 9,202,705 - Kaskoun , et al. December 1, 2 | 2015-12-01 |
Biometrics For User Identification In Mobile Health Systems App 20150317855 - Sezan; Muhammed Ibrahim ;   et al. | 2015-11-05 |
Integrated circuit module with lead frame micro-needles Grant 9,138,191 - Kaskoun , et al. September 22, 2 | 2015-09-22 |
Method, Devices and Systems for Sensor with Removable Nodes App 20150150505 - KASKOUN; Kenneth ;   et al. | 2015-06-04 |
Methods, Devices And Systems For Self Charging Sensors App 20150128733 - Taylor; Kirk Steven ;   et al. | 2015-05-14 |
Electronically Enabled Removable Dental Device App 20140329192 - Kaskoun; Lucie R. ;   et al. | 2014-11-06 |
Systems and methods for enabling ESD protection on 3-D stacked devices Grant 8,847,360 - Kaskoun , et al. September 30, 2 | 2014-09-30 |
Through Silicon Optical Interconnects App 20140131549 - Kaskoun; Kenneth ;   et al. | 2014-05-15 |
Integrated tester chip using die packaging technologies Grant 8,717,057 - Kaskoun , et al. May 6, 2 | 2014-05-06 |
Sensor Input Recording And Translation Into Human Linguistic Form App 20140044307 - Kenagy; Jason B. ;   et al. | 2014-02-13 |
3-D integrated circuit lateral heat dissipation Grant 8,502,373 - Kaskoun , et al. August 6, 2 | 2013-08-06 |
Semiconductor memory card Grant 8,258,613 - DiCaprio , et al. September 4, 2 | 2012-09-04 |
Systems and Methods for Enabling Esd Protection on 3-D Stacked Devices App 20120061804 - Kaskoun; Kenneth ;   et al. | 2012-03-15 |
Systems and methods for enabling ESD protection on 3-D stacked devices Grant 8,080,862 - Kaskoun , et al. December 20, 2 | 2011-12-20 |
IC interconnect Grant 8,076,768 - Kaskoun , et al. December 13, 2 | 2011-12-13 |
Method of fabricating via first plus via last IC interconnect Grant 7,985,620 - Kaskoun , et al. July 26, 2 | 2011-07-26 |
Via first plus via last technique for IC interconnects Grant 7,939,926 - Kaskoun , et al. May 10, 2 | 2011-05-10 |
IC Interconnect App 20110042829 - Kaskoun; Kenneth ;   et al. | 2011-02-24 |
Via First Plus Via Last Technique for IC Interconnect App 20100261310 - Kaskoun; Kenneth ;   et al. | 2010-10-14 |
Button Sensor App 20100191072 - Matsumori; Barry Alan ;   et al. | 2010-07-29 |
Wireless Branding App 20100174661 - Kaskoun; Kenneth ;   et al. | 2010-07-08 |
Embedded Through Silicon Stack 3-D Die In A Package Substrate App 20100155931 - Ray; Urmi ;   et al. | 2010-06-24 |
Via First Plus Via Last Technique for IC Interconnects App 20100148371 - Kaskoun; Kenneth ;   et al. | 2010-06-17 |
Antenna Integrated in a Semiconductor Chip App 20100127937 - Chandrasekaran; Arvind ;   et al. | 2010-05-27 |
Systems and Methods for Enabling ESD Protection on 3-D Stacked Devices App 20100059869 - Kaskoun; Kenneth ;   et al. | 2010-03-11 |
Integrated Tester Chip Using Die Packaging Technologies App 20090322366 - Kaskoun; Kenneth ;   et al. | 2009-12-31 |
Integrated Tester Chip Using Die Packaging Technologies App 20090322368 - Kaskoun; Kenneth ;   et al. | 2009-12-31 |
3-D Integrated Circuit Lateral Heat Dissipation App 20090273068 - Kaskoun; Kenneth ;   et al. | 2009-11-05 |
Lead-frame method and assembly for interconnecting circuits within a circuit module Grant 7,176,062 - Miks , et al. February 13, 2 | 2007-02-13 |
Lead-frame connector and circuit module assembly Grant 7,019,387 - Miks , et al. March 28, 2 | 2006-03-28 |
Lead-frame method and assembly for interconnecting circuits within a circuit module Grant 6,900,527 - Miks , et al. May 31, 2 | 2005-05-31 |
Circuit module assembly having an edge-attached vented cover and method for edge-attaching App 20030184978 - LoBianco, Anthony James ;   et al. | 2003-10-02 |
Semiconductor memory cards and method of making same Grant 6,624,005 - DiCaprio , et al. September 23, 2 | 2003-09-23 |
Substrate for transferring bumps and method of use Grant 5,860,585 - Rutledge , et al. January 19, 1 | 1999-01-19 |
Fluxless flip-chip bond and a method for making Grant 5,816,478 - Kaskoun , et al. October 6, 1 | 1998-10-06 |
Electronic component and method of packaging Grant 5,661,088 - Tessier , et al. August 26, 1 | 1997-08-26 |
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