loadpatents
Patent applications and USPTO patent grants for Kashiwazaki; Atsushi.The latest application filed is for "electronic device".
Patent | Date |
---|---|
Electronic device Grant 10,651,118 - Suzuki , et al. | 2020-05-12 |
Electronic Device App 20190244886 - SUZUKI; Kosuke ;   et al. | 2019-08-08 |
Electronic device and method for manufacturing the electronic device Grant 9,795,053 - Sanada , et al. October 17, 2 | 2017-10-17 |
Electronic Device And Method For Manufacturing The Electronic Device App 20160183405 - SANADA; Yuki ;   et al. | 2016-06-23 |
Multi-layer Substrate, Electronic Device Using Multi-layer Substrate, Manufacturing Method For Multilayer Substrate, Substrate, And Electronic Device Using Substrate App 20160105958 - NAKAMURA; Toshihiro ;   et al. | 2016-04-14 |
Electronic device Grant 8,772,912 - Miyawaki , et al. July 8, 2 | 2014-07-08 |
Vehicle control system Grant 8,386,141 - Tanaka , et al. February 26, 2 | 2013-02-26 |
Electronic control device Grant 8,358,514 - Kashiwazaki , et al. January 22, 2 | 2013-01-22 |
Electronic Device And Method Of Manufacturing The Same App 20110180915 - MIYAWAKI; Shotaro ;   et al. | 2011-07-28 |
Electronic control device App 20100097775 - Kashiwazaki; Atsushi ;   et al. | 2010-04-22 |
Electronic controller Grant 7,679,914 - Kashiwazaki March 16, 2 | 2010-03-16 |
Vehicle Control System App 20090171544 - Tanaka; Koutarou ;   et al. | 2009-07-02 |
Electronic controller App 20080074829 - Kashiwazaki; Atsushi | 2008-03-27 |
Electronic control device Grant 7,349,227 - Kashiwazaki March 25, 2 | 2008-03-25 |
Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip Grant 7,221,058 - Kashiwazaki May 22, 2 | 2007-05-22 |
Flip chip packaging structure and related packaging method Grant 7,129,586 - Kashiwazaki October 31, 2 | 2006-10-31 |
Electronic control device App 20050239343 - Kashiwazaki, Atsushi | 2005-10-27 |
Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip App 20050116354 - Kashiwazaki, Atsushi | 2005-06-02 |
Semiconductor package App 20050104196 - Kashiwazaki, Atsushi | 2005-05-19 |
Flip chip packaging structure and related packaging method App 20040262753 - Kashiwazaki, Atsushi | 2004-12-30 |
Solid-state image pickup device and method of producing the same App 20020163589 - Yukawa, Masahiko ;   et al. | 2002-11-07 |
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