Kashiba; Yoshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kashiba; Yoshihiro.The latest application filed is for "semiconductor device and method for manufacturing the same".

Company Profile

0.17.16

Kashiba; Yoshihiro - Chiyoda-ku JP
Kashiba; Yoshihiro - Tokyo JP
Kashiba; Yoshihiro - Amagasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method for manufacturing the same Grant 9,236,316 - Fujino , et al. January 12, 2	2016-01-12
Semiconductor Device And Method For Manufacturing The Same App 20150021750 - Fujino; Junji ; et al.	2015-01-22
Semiconductor device test probe Grant 7,276,923 - Takemoto , et al. October 2, 2	2007-10-02
Semiconductor device test probe Grant 7,274,195 - Takemoto , et al. September 25, 2	2007-09-25
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested Grant 7,112,976 - Tokumo , et al. September 26, 2	2006-09-26
Semiconductor device test probe App 20060038575 - Takemoto; Megumi ; et al.	2006-02-23
Socket for testing a semiconductor device and a connecting sheet used for the same Grant 6,989,681 - Maekawa , et al. January 24, 2	2006-01-24
Power semiconductor device Grant 6,979,843 - Nakajima , et al. December 27, 2	2005-12-27
Semiconductor Device Test Probe Having Improved Tip Portion App 20050189955 - Takemoto, Megumi ; et al.	2005-09-01
Socket for testing a semiconductor device and a connecting sheet used for the same App 20050145842 - Maekawa, Shigeki ; et al.	2005-07-07
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Grant 6,888,344 - Maekawa , et al. May 3, 2	2005-05-03
Probe card, and testing apparatus having the same Grant 6,885,204 - Takemoto , et al. April 26, 2	2005-04-26
Vehicle AC generator with rectifier diode package disposed between cooling plates Grant 6,882,069 - Kashihara , et al. April 19, 2	2005-04-19
Semiconductor device Grant 6,867,484 - Nakajima , et al. March 15, 2	2005-03-15
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested App 20040209491 - Tokumo, Yasushi ; et al.	2004-10-21
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested Grant 6,794,890 - Tokumo , et al. September 21, 2	2004-09-21
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus Grant 6,741,086 - Maekawa , et al. May 25, 2	2004-05-25
Probe card, and testing apparatus having the same App 20040046580 - Takemoto, Megumi ; et al.	2004-03-11
Socket for testing a semiconductor device and a connecting sheet used for the same App 20040046581 - Maekawa, Shigeki ; et al.	2004-03-11
Probe card, and testing apparatus having the same Grant 6,667,626 - Takemoto , et al. December 23, 2	2003-12-23
Power semiconductor device App 20030213979 - Nakajima, Dai ; et al.	2003-11-20
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Grant 6,646,455 - Maekawa , et al. November 11, 2	2003-11-11
Semiconductor device App 20030197255 - Nakajima, Dai ; et al.	2003-10-23
Semiconductor device test probe having improved tip portion and manufacturing method thereof Grant 6,633,176 - Takemoto , et al. October 14, 2	2003-10-14
Probe card for testing semiconductor integrated circuit and method of manufacturing the same Grant 6,628,127 - Takemoto , et al. September 30, 2	2003-09-30
Probe card, and testing apparatus having the same App 20030160624 - Takemoto, Megumi ; et al.	2003-08-28
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter App 20030090280 - Maekawa, Shigeki ; et al.	2003-05-15
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus App 20020190737 - Maekawa, Shigeki ; et al.	2002-12-19
Test Probe For Semiconductor Devices, Method Of Manufacturing Of The Same, And Member For Removing Foreign Matter App 20020097060 - MAEKAWA, SHIGEKI ; et al.	2002-07-25
Semiconductor device test probe, manufacturing method therefor and semiconductor device tested by the probe App 20010046715 - Takemoto, Megumi ; et al.	2001-11-29
Apparatus for manufacturing liquid crystal panel and method thereof App 20010018948 - Tada, Masahiko ; et al.	2001-09-06
Probe card for testing semiconductor integrated circuit and method of manufacturing the same App 20010015650 - Takemoto, Megumi ; et al.	2001-08-23
Ceramic-metal composite substrate and method for producing the same Grant 5,251,803 - Kashiba , et al. October 12, 1	1993-10-12

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