Kasem; Y. Mohammed

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kasem; Y. Mohammed.The latest application filed is for "precision high-frequency capacitor formed on semiconductor substrate".

Company Profile

0.19.13

Kasem; Y. Mohammed - Santa Clara CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Precision high-frequency capacitor formed on semiconductor substrate Grant 9,136,060 - Goldberger , et al. September 15, 2	2015-09-15
Precision high-frequency capacitor formed on semiconductor substrate Grant 8,324,711 - Goldberger , et al. December 4, 2	2012-12-04
Precision high-frequency capacitor formed on semiconductor substrate Grant 8,004,063 - Goldberger , et al. August 23, 2	2011-08-23
Precision High-frequency Capacitor Formed On Semiconductor Substrate App 20110176247 - Goldberger; Haim ; et al.	2011-07-21
Precision high-frequency capacitor formed on semiconductor substrate App 20100295152 - Goldberger; Haim ; et al.	2010-11-25
Chip Scale Surface Mount Package For Semiconductor Device And Process Of Fabricating The Same App 20090278179 - Zandman; Felix ; et al.	2009-11-12
Semiconductor Packaging Techniques App 20090256246 - Chang; Mike ; et al.	2009-10-15
Semiconductor die package including cup-shaped leadframe Grant 7,595,547 - Chang , et al. September 29, 2	2009-09-29
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 7,589,396 - Zandman , et al. September 15, 2	2009-09-15
Precision High-frequency Capacitor Formed On Semiconductor Substrate App 20080108202 - Goldberger; Haim ; et al.	2008-05-08
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20070235774 - Zandman; Felix ; et al.	2007-10-11
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 7,211,877 - Zandman , et al. May 1, 2	2007-05-01
Precision high-frequency capacitor formed on semiconductor substrate Grant 7,151,036 - Goldberger , et al. December 19, 2	2006-12-19
Semiconductor assembly with package using cup-shaped lead-frame Grant 6,909,170 - Chang , et al. June 21, 2	2005-06-21
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 6,876,061 - Zandman , et al. April 5, 2	2005-04-05
Semiconductor die package including cup-shaped leadframe Grant 6,744,124 - Chang , et al. June 1, 2	2004-06-01
Precision high-frequency capacitor on semiconductor substrate Grant 6,621,143 - Goldberger , et al. September 16, 2	2003-09-16
Precision high-frequency capacitor formed on semiconductor substrate Grant 6,621,142 - Goldberger , et al. September 16, 2	2003-09-16
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 6,562,647 - Zandman , et al. May 13, 2	2003-05-13
Precision high-frequency capacitor formed on semiconductor substrate App 20030057517 - Goldberger, Haim ; et al.	2003-03-27
Semiconductor assembly with package using cup-shaped lead frame App 20030057532 - Chang, Mike ; et al.	2003-03-27
Precision high-frequency capacitor on semiconductor substrate App 20030030125 - Goldberger, Haim ; et al.	2003-02-13
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20020185710 - Zandman, Felix ; et al.	2002-12-12
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 6,441,475 - Zandman , et al. August 27, 2	2002-08-27
Vertical structure for semiconductor wafer-level chip scale packages Grant 6,392,290 - Kasem , et al. May 21, 2	2002-05-21
Chip scale surface mount packages for semiconductor device and process of fabricating the same Grant 6,316,287 - Zandman , et al. November 13, 2	2001-11-13
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20010016369 - Zandman, Felix ; et al.	2001-08-23
Process of fabricating a chip scale surface mount package for semiconductor device Grant 6,271,060 - Zandman , et al. August 7, 2	2001-08-07
Chip scale surface mount packages for semiconductor device App 20010009298 - Zandman, Felix ; et al.	2001-07-26
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20010000631 - Zandman, Felix ; et al.	2001-05-03
Separate circuit devices in an intra-package configuration and assembly techniques Grant 6,066,890 - Tsui , et al. May 23, 2	2000-05-23

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