Patent | Date |
---|
Precision high-frequency capacitor formed on semiconductor substrate Grant 9,136,060 - Goldberger , et al. September 15, 2 | 2015-09-15 |
Precision high-frequency capacitor formed on semiconductor substrate Grant 8,324,711 - Goldberger , et al. December 4, 2 | 2012-12-04 |
Precision high-frequency capacitor formed on semiconductor substrate Grant 8,004,063 - Goldberger , et al. August 23, 2 | 2011-08-23 |
Precision High-frequency Capacitor Formed On Semiconductor Substrate App 20110176247 - Goldberger; Haim ;   et al. | 2011-07-21 |
Precision high-frequency capacitor formed on semiconductor substrate App 20100295152 - Goldberger; Haim ;   et al. | 2010-11-25 |
Chip Scale Surface Mount Package For Semiconductor Device And Process Of Fabricating The Same App 20090278179 - Zandman; Felix ;   et al. | 2009-11-12 |
Semiconductor Packaging Techniques App 20090256246 - Chang; Mike ;   et al. | 2009-10-15 |
Semiconductor die package including cup-shaped leadframe Grant 7,595,547 - Chang , et al. September 29, 2 | 2009-09-29 |
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 7,589,396 - Zandman , et al. September 15, 2 | 2009-09-15 |
Precision High-frequency Capacitor Formed On Semiconductor Substrate App 20080108202 - Goldberger; Haim ;   et al. | 2008-05-08 |
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20070235774 - Zandman; Felix ;   et al. | 2007-10-11 |
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 7,211,877 - Zandman , et al. May 1, 2 | 2007-05-01 |
Precision high-frequency capacitor formed on semiconductor substrate Grant 7,151,036 - Goldberger , et al. December 19, 2 | 2006-12-19 |
Semiconductor assembly with package using cup-shaped lead-frame Grant 6,909,170 - Chang , et al. June 21, 2 | 2005-06-21 |
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 6,876,061 - Zandman , et al. April 5, 2 | 2005-04-05 |
Semiconductor die package including cup-shaped leadframe Grant 6,744,124 - Chang , et al. June 1, 2 | 2004-06-01 |
Precision high-frequency capacitor on semiconductor substrate Grant 6,621,143 - Goldberger , et al. September 16, 2 | 2003-09-16 |
Precision high-frequency capacitor formed on semiconductor substrate Grant 6,621,142 - Goldberger , et al. September 16, 2 | 2003-09-16 |
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 6,562,647 - Zandman , et al. May 13, 2 | 2003-05-13 |
Precision high-frequency capacitor formed on semiconductor substrate App 20030057517 - Goldberger, Haim ;   et al. | 2003-03-27 |
Semiconductor assembly with package using cup-shaped lead frame App 20030057532 - Chang, Mike ;   et al. | 2003-03-27 |
Precision high-frequency capacitor on semiconductor substrate App 20030030125 - Goldberger, Haim ;   et al. | 2003-02-13 |
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20020185710 - Zandman, Felix ;   et al. | 2002-12-12 |
Chip scale surface mount package for semiconductor device and process of fabricating the same Grant 6,441,475 - Zandman , et al. August 27, 2 | 2002-08-27 |
Vertical structure for semiconductor wafer-level chip scale packages Grant 6,392,290 - Kasem , et al. May 21, 2 | 2002-05-21 |
Chip scale surface mount packages for semiconductor device and process of fabricating the same Grant 6,316,287 - Zandman , et al. November 13, 2 | 2001-11-13 |
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20010016369 - Zandman, Felix ;   et al. | 2001-08-23 |
Process of fabricating a chip scale surface mount package for semiconductor device Grant 6,271,060 - Zandman , et al. August 7, 2 | 2001-08-07 |
Chip scale surface mount packages for semiconductor device App 20010009298 - Zandman, Felix ;   et al. | 2001-07-26 |
Chip scale surface mount package for semiconductor device and process of fabricating the same App 20010000631 - Zandman, Felix ;   et al. | 2001-05-03 |
Separate circuit devices in an intra-package configuration and assembly techniques Grant 6,066,890 - Tsui , et al. May 23, 2 | 2000-05-23 |