KASAI; Ryohei

Patent Applications and Registrations

Patent applications and USPTO patent grants for KASAI; Ryohei.The latest application filed is for "wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and metho".

Company Profile

3.3.4

KASAI; Ryohei - Tokyo-to JP
Kasai; Ryohei - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring Structure And Method Of Manufacturing The Same, Semiconductor Device, Multilayer Wiring Structure And Method Of Manufacturing The Same, Semiconductor Element Mounting Substrate, Method Of Forming Pattern Structure, Imprint Mold And Method Of Manufacturing The Same, Imprint Mold Set, And Metho App 20220046801 - KASAI; Ryohei ; et al.	2022-02-10
Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and metho Grant 11,191,164 - Kasai , et al. November 30, 2	2021-11-30
Mounting component and electronic device Grant 10,672,722 - Kasai , et al.	2020-06-02
Mounting Component And Electronic Device App 20190206808 - Kasai; Ryohei ; et al.	2019-07-04
Mounting component, wiring substrate, electronic device and manufacturing method thereof Grant 10,276,515 - Kasai , et al.	2019-04-30
Wiring Structure And Method Of Manufacturing The Same, Semiconductor Device, Multilayer Wiring Structure And Method Of Manufacturing The Same, Semiconductor Element Mounting Substrate, Method Of Forming Pattern Structure, Imprint Mold And Method Of Manufacturing The Same, Imprint Mold Set, And Metho App 20180310413 - KASAI; Ryohei ; et al.	2018-10-25
Mounting Component, Wiring Substrate, Electronic Device And Manufacturing Method Thereof App 20180240760 - KASAI; Ryohei ; et al.	2018-08-23

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