KASAI; Masaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KASAI; Masaki.The latest application filed is for "semiconductor device and method for manufacturing semiconductor device".

Company Profile

2.17.16

KASAI; Masaki - Kyoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20210313245 - MIYATA; Osamu ; et al.	2021-10-07
Semiconductor device and method for manufacturing semiconductor device Grant 11,069,591 - Miyata , et al. July 20, 2	2021-07-20
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20190393116 - MIYATA; Osamu ; et al.	2019-12-26
Semiconductor device and method for manufacturing semiconductor device Grant 10,431,516 - Miyata , et al. O	2019-10-01
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20170162463 - MIYATA; Osamu ; et al.	2017-06-08
Semiconductor device and method for manufacturing semiconductor device Grant 9,601,441 - Miyata , et al. March 21, 2	2017-03-21
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20160181210 - MIYATA; Osamu ; et al.	2016-06-23
Semiconductor device and method for manufacturing semiconductor device Grant 9,312,228 - Miyata , et al. April 12, 2	2016-04-12
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20150311165 - MIYATA; Osamu ; et al.	2015-10-29
Semiconductor device and method for manufacturing semiconductor device Grant 9,111,819 - Miyata , et al. August 18, 2	2015-08-18
Semiconductor device bonding with stress relief connection pads Grant 9,018,762 - Kasai , et al. April 28, 2	2015-04-28
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20150091169 - MIYATA; Osamu ; et al.	2015-04-02
Semiconductor device and method for manufacturing semiconductor device Grant 8,928,156 - Miyata , et al. January 6, 2	2015-01-06
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20140291845 - MIYATA; Osamu ; et al.	2014-10-02
Semiconductor device and method for manufacturing semiconductor device Grant 8,786,106 - Miyata , et al. July 22, 2	2014-07-22
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Grant 8,723,339 - Kasai , et al. May 13, 2	2014-05-13
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20140077373 - MIYATA; Osamu ; et al.	2014-03-20
Semiconductor Device With Front And Back Side Resin Layers Having Different Thermal Expansion Coefficient And Elasticity Modulus App 20140070413 - KASAI; Masaki ; et al.	2014-03-13
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Grant 8,664,779 - Kasai , et al. March 4, 2	2014-03-04
Semiconductor device and method for manufacturing semiconductor device Grant 8,575,764 - Miyata , et al. November 5, 2	2013-11-05
Semiconductor Device Bonding With Stress Relief Connection Pads App 20130234327 - KASAI; Masaki ; et al.	2013-09-12
Semiconductor device bonding with stress relief connection pads Grant 8,446,008 - Kasai , et al. May 21, 2	2013-05-21
Semiconductor Device With Front And Back Side Resin Layers Having Different Thermal Expansion Coefficient And Elasticity Modulus App 20120193766 - Kasai; Masaki ; et al.	2012-08-02
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Grant 8,164,201 - Kasai , et al. April 24, 2	2012-04-24
Semiconductor device and method for manufacturing semiconductor device App 20100187659 - Miyata; Osamu ; et al.	2010-07-29
Semiconductor device and method for manufacturing semiconductor device Grant 7,714,448 - Miyata , et al. May 11, 2	2010-05-11
Semiconductor device App 20100044863 - Kasai; Masaki ; et al.	2010-02-25
Semiconductor Device and Semiconductor Device Assembly App 20090121347 - Kasai; Masaki ; et al.	2009-05-14
Semiconductor Device App 20080272488 - Miyata; Osamu ; et al.	2008-11-06
Semiconductor Device and Method for Manufacturing Semiconductor Device App 20080006910 - Miyata; Osamu ; et al.	2008-01-10

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