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Structure, Method And System For Assessing Bonding Of Electrodes In Fcb Packaging App 20110057309 - KASAI; Junichi ;   et al. | 2011-03-10 |
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Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device Grant 7,489,029 - Onodera , et al. February 10, 2 | 2009-02-10 |
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Gas Treatment Device App 20070261556 - Kasai; Junichi ;   et al. | 2007-11-15 |
Gas Treatment Device App 20070245898 - Naito; Kenta ;   et al. | 2007-10-25 |
Carrier for stacked type semiconductor device and method of fabricating the same Grant 7,285,848 - Onodera , et al. October 23, 2 | 2007-10-23 |
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Semiconductor device, fabrication method therefor, and film fabrication method App 20070105304 - Kasai; Junichi ;   et al. | 2007-05-10 |
Exhaust gas processing method and exhaust gas processing system App 20070000236 - Naito; Kenta ;   et al. | 2007-01-04 |
Device having resin package and method of producing the same Grant 7,144,754 - Yoneda , et al. December 5, 2 | 2006-12-05 |
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Carrier for stacked type semiconductor device and method of fabricating the same App 20050269682 - Onodera, Masanori ;   et al. | 2005-12-08 |
Method of fabricating semiconductor device and semiconductor device App 20050263871 - Shinma, Yasuhiro ;   et al. | 2005-12-01 |
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device Grant 6,881,611 - Fukasawa , et al. April 19, 2 | 2005-04-19 |
Device having resin package and method of producing the same Grant 6,856,017 - Yoneda , et al. February 15, 2 | 2005-02-15 |
Device having resin package and method of producing the same App 20040219719 - Yoneda, Yoshiyuki ;   et al. | 2004-11-04 |
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Semiconductor module including a plurality of semiconductor devices detachably App 20030164544 - Sato, Mitsutaka ;   et al. | 2003-09-04 |
Anti-collision support system and method for automotive vehicle Grant 6,566,999 - Iwasaki , et al. May 20, 2 | 2003-05-20 |
Device Having Resin Package And Method Of Producing The Same App 20030006503 - YONEDA, YOSHIYUKI ;   et al. | 2003-01-09 |
Semiconductor device having columnar electrode and method of manufacturing same Grant 6,476,503 - Imamura , et al. November 5, 2 | 2002-11-05 |
Anti-collision support system and method for automotive vehicle App 20020057194 - Iwasaki, Masahiko ;   et al. | 2002-05-16 |
Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device App 20020030258 - Fukasawa, Norio ;   et al. | 2002-03-14 |
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame App 20020027265 - Yoneda, Yoshiyuki ;   et al. | 2002-03-07 |
Semiconductor Module Including A Plurality Of Semiconductor Devices Detachably App 20020000645 - SATO, MITSUTAKA ;   et al. | 2002-01-03 |
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Method And Mold For Manufacturing Semiconductor Device, Semiconductor Device, And Method For Mounting The Device App 20010003049 - FUKASAWA, NORIO ;   et al. | 2001-06-07 |
Semiconductor device having a ball grid array and a fabrication process thereof App 20010001714 - Motooka, Toshiyuki ;   et al. | 2001-05-24 |
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same Grant 6,111,306 - Kawahara , et al. August 29, 2 | 2000-08-29 |
Method for fabricating bump forming plate member Grant 6,090,301 - Mizukoshi , et al. July 18, 2 | 2000-07-18 |
Device having resin package with projections Grant 6,072,239 - Yoneda , et al. June 6, 2 | 2000-06-06 |
Method for fabricating solder bumps by forming solder balls with a solder ball forming member Grant 6,025,258 - Ochiai , et al. February 15, 2 | 2000-02-15 |
Semiconductor device including a frame terminal Grant 6,025,650 - Tsuji , et al. February 15, 2 | 2000-02-15 |
Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit Grant 6,022,759 - Seki , et al. February 8, 2 | 2000-02-08 |
Semiconductor package for surface mounting Grant 5,861,669 - Sono , et al. January 19, 1 | 1999-01-19 |
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method Grant 5,842,628 - Nomoto , et al. December 1, 1 | 1998-12-01 |
Semiconductor device and method of producing the same Grant 5,804,467 - Kawahara , et al. September 8, 1 | 1998-09-08 |
Semiconductor device and semiconductor device unit for a stack arrangement Grant 5,801,439 - Fujisawa , et al. September 1, 1 | 1998-09-01 |
Semiconductor device and method of producing the same Grant 5,773,313 - Sato , et al. June 30, 1 | 1998-06-30 |
Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package Grant 5,760,471 - Fujisawa , et al. June 2, 1 | 1998-06-02 |
Semiconductor device, base member for semiconductor device and semiconductor device unit Grant 5,747,874 - Seki , et al. May 5, 1 | 1998-05-05 |
Semiconductor device unit having holder Grant 5,684,675 - Taniguchi , et al. November 4, 1 | 1997-11-04 |
Semiconductor device having resin gate hole through substrate for resin encapsulation Grant 5,679,978 - Kawahara , et al. October 21, 1 | 1997-10-21 |
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device Grant 5,666,064 - Kasai , et al. September 9, 1 | 1997-09-09 |
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device Grant 5,643,831 - Ochiai , et al. July 1, 1 | 1997-07-01 |
Semiconductor device affixed to an upper and a lower leadframe Grant 5,637,915 - Sato , et al. June 10, 1 | 1997-06-10 |
Semiconductor device having a plurality of chips Grant 5,530,292 - Waki , et al. June 25, 1 | 1996-06-25 |
Semiconductor device having improved leads comprising palladium plated nickel Grant 5,521,432 - Tsuji , et al. May 28, 1 | 1996-05-28 |
Semiconductor device and method of producing the same Grant 5,519,251 - Sato , et al. May 21, 1 | 1996-05-21 |
Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package Grant 5,508,565 - Hatakeyama , et al. April 16, 1 | 1996-04-16 |
Semiconductor device having a plurality of chips Grant 5,463,253 - Waki , et al. October 31, 1 | 1995-10-31 |
Semiconductor device with surface mount package adapted for vertical mounting Grant 5,451,815 - Taniguchi , et al. September 19, 1 | 1995-09-19 |
Method of producing semiconductor device having radiation part made of resin containing insulator powders Grant 5,424,251 - Sono , et al. June 13, 1 | 1995-06-13 |
Process of using a jig to align and mount terminal conductors to a semiconductor plastic package Grant 5,403,776 - Tsuji , et al. April 4, 1 | 1995-04-04 |
Semiconductor device and method of producing the same Grant 5,399,804 - Yoneda , et al. March 21, 1 | 1995-03-21 |
Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads Grant 5,361,970 - Kasai , et al. November 8, 1 | 1994-11-08 |
Surface-mounting type semiconductor package having an improved efficiency for heat dissipation Grant 5,305,179 - Sono , et al. April 19, 1 | 1994-04-19 |
Semiconductor device having spherical terminals attached to the lead frame embedded within the package body Grant 5,293,072 - Tsuji , et al. March 8, 1 | 1994-03-08 |
Vehicle alarm system for informing other vehicles of its own presence Grant 5,289,181 - Watanabe , et al. February 22, 1 | 1994-02-22 |
Automotive multi-speaker audio system with different timing reproduction of audio sound Grant 5,129,004 - Imai , et al. July 7, 1 | 1992-07-07 |
Structure of a speaker apparatus Grant 5,067,159 - Kasai , et al. November 19, 1 | 1991-11-19 |
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Audio speaker system for automotive vehicle Grant 4,866,776 - Kasai , et al. September 12, 1 | 1989-09-12 |
Stereo signal reproducing system Grant 4,769,843 - Imai , et al. September 6, 1 | 1988-09-06 |
Woofer system for an automotive audio system with a protecter therefor Grant 4,720,867 - Imai , et al. January 19, 1 | 1988-01-19 |
Stereo signal reproducing system Grant 4,703,502 - Kasai , et al. October 27, 1 | 1987-10-27 |
Automotive multi-speaker audio system with automatic echo-control feature Grant 4,694,497 - Kasai , et al. September 15, 1 | 1987-09-15 |
Audio equipment Grant 4,641,344 - Kasai , et al. February 3, 1 | 1987-02-03 |
Electrical connector Grant 4,592,609 - Kasai , et al. June 3, 1 | 1986-06-03 |
Vehicle panel speaker for automotive audio system utilizing part of a vehicle panel as a sound-producing medium Grant 4,551,849 - Kasai , et al. November 5, 1 | 1985-11-05 |
Driver unit for automotive audio speaker Grant 4,550,428 - Yanagishima , et al. October 29, 1 | 1985-10-29 |
Speaker for automotive vehicle audio system having a vehicle panel serving as sound-amplifying medium Grant 4,514,599 - Yanagishima , et al. April 30, 1 | 1985-04-30 |
Speaker for automotive audio system with vehicle panel utilized as sound amplifying medium Grant 4,499,340 - Kasai , et al. February 12, 1 | 1985-02-12 |