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name:-0.058184862136841
name:-0.096952199935913
name:-0.0012121200561523
Kasai; Junichi Patent Filings

Kasai; Junichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kasai; Junichi.The latest application filed is for "semiconductor device and method of manufacturing the same".

Company Profile
0.83.40
  • Kasai; Junichi - Kanagawa JP
  • Kasai; Junichi - Tokyo JP
  • Kasai; Junichi - Kawasaki JP
  • Kasai; Junichi - Fujisawa JP
  • Kasai; Junichi - Miyamae-ku JP
  • Kasai; Junichi - Fujisawa-shi JP
  • Kasai, Junichi - Kawasaki-shi JP
  • Kasai; Junichi - Yokohama JP
  • Kasai; Junichi - Yokosuka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and method of manufacturing the same
Grant 11,018,105 - Onodera , et al. May 25, 2
2021-05-25
Semiconductor Device And Method Of Manufacturing The Same
App 20200058610 - Onodera; Masanori ;   et al.
2020-02-20
Vehicle guidance device and vehicle guidance method
Grant 10,152,885 - Shimodaira , et al. Dec
2018-12-11
Vehicle Guidance Device And Vehicle Guidance Method
App 20180158330 - Shimodaira; Seiji ;   et al.
2018-06-07
Semiconductor Device And Method Of Manufacturing The Same
App 20170092606 - Onodera; Masanori ;   et al.
2017-03-30
Semiconductor device and method of manufacturing the same
Grant 9,508,651 - Onodera , et al. November 29, 2
2016-11-29
Semiconductor device and method for manufacturing thereof
Grant 9,397,025 - Meghro , et al. July 19, 2
2016-07-19
Method of fabricating a semiconductor device used in a stacked-type semiconductor device
Grant 9,368,424 - Shinma , et al. June 14, 2
2016-06-14
Semiconductor device and method of manufacturing the same
Grant 9,293,441 - Hoshino , et al. March 22, 2
2016-03-22
Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
Grant 9,142,440 - Onodera , et al. September 22, 2
2015-09-22
Semiconductor Device And Method For Manufacturing Thereof
App 20140077347 - MEGHRO; Kouichi ;   et al.
2014-03-20
Semiconductor device and manufacturing method therefor
Grant 8,481,366 - Harayama , et al. July 9, 2
2013-07-09
System and method for stacking a plurality of electrically coupled semiconductor chips with a conductive pin
Grant 8,421,241 - Meghro , et al. April 16, 2
2013-04-16
Manufacturing stacked semiconductor device
Grant 8,367,466 - Hoshino , et al. February 5, 2
2013-02-05
Structure, method and system for assessing bonding of electrodes in FCB packaging
Grant 8,274,158 - Kasai , et al. September 25, 2
2012-09-25
Semiconductor Device And Method Of Manufacturing The Same
App 20120025364 - HOSHINO; Masataka ;   et al.
2012-02-02
Semiconductor device and manufacturing method therefor
Grant 8,039,943 - Harayama , et al. October 18, 2
2011-10-18
Semiconductor device and method of manufacturing the same
Grant 8,030,179 - Hoshino , et al. October 4, 2
2011-10-04
Semiconductor Device And Manufacturing Method Therefor
App 20110201152 - HARAYAMA; Masahiko ;   et al.
2011-08-18
Semiconductor device and method of fabricating the same
Grant 7,968,990 - Tanaka , et al. June 28, 2
2011-06-28
Structure, Method And System For Assessing Bonding Of Electrodes In Fcb Packaging
App 20110057309 - KASAI; Junichi ;   et al.
2011-03-10
IC carrie, IC socket and method for testing IC device
Grant 7,884,630 - Osato , et al. February 8, 2
2011-02-08
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
Grant 7,846,771 - Taya , et al. December 7, 2
2010-12-07
Structure, method and system for assessing bonding of electrodes in FCB packaging
Grant 7,816,788 - Kasai , et al. October 19, 2
2010-10-19
Gas treatment device
Grant 7,758,675 - Naito , et al. July 20, 2
2010-07-20
Stacked type semiconductor device and method of fabricating stacked type semiconductor device
Grant 7,696,616 - Shinma , et al. April 13, 2
2010-04-13
Semiconductor device, fabrication method therefor, and film fabrication method
Grant 7,683,473 - Kasai , et al. March 23, 2
2010-03-23
Carrier for stacked type semiconductor device and method of fabricating the same
Grant 7,642,637 - Onodera , et al. January 5, 2
2010-01-05
Semiconductor Device And Method Of Manufacturing The Same
App 20090325346 - HOSHINO; Masataka ;   et al.
2009-12-31
Semiconductor Device And Method For Manufacturing Thereof
App 20090289336 - MEGHRO; Kouichi ;   et al.
2009-11-26
Semiconductor device and method of manufacturing the same
Grant 7,605,457 - Hoshino , et al. October 20, 2
2009-10-20
Semiconductor Device And Manufacturing Method Therefor
App 20090250800 - HARAYAMA; Masahiko ;   et al.
2009-10-08
Manufacturing Stacked Semiconductor Device
App 20090230533 - HOSHINO; Masataka ;   et al.
2009-09-17
Carrier Structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
App 20090093085 - Onodera; Masanori ;   et al.
2009-04-09
Semiconductor Device And Method Of Manufacturing The Same
App 20090072394 - ONODERA; Masanori ;   et al.
2009-03-19
Exhaust gas purification method and exhaust gas purification system
App 20090038300 - Naito; Kenta ;   et al.
2009-02-12
Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
Grant 7,489,029 - Onodera , et al. February 10, 2
2009-02-10
Structure, Method And System For Assessing Bonding Of Electrodes In Fcb Packaging
App 20080303144 - KASAI; Junichi ;   et al.
2008-12-11
Carrier For Stacked Type Semiconductor Device And Method Of Fabricating Stacked Type Semiconductor Devices
App 20080274591 - Taya; Koji ;   et al.
2008-11-06
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
Grant 7,414,305 - Taya , et al. August 19, 2
2008-08-19
Ic Carrier, Ic Socket and Method for Testing Ic Device
App 20080191723 - Osato; Eichi ;   et al.
2008-08-14
Semiconductor device and method of fabricating the same
App 20080169544 - Tanaka; Junji ;   et al.
2008-07-17
Carrier for stacked type semiconductor device and method of fabricating the same
App 20070290320 - Onodera; Masanori ;   et al.
2007-12-20
Gas Treatment Device
App 20070261556 - Kasai; Junichi ;   et al.
2007-11-15
Gas Treatment Device
App 20070245898 - Naito; Kenta ;   et al.
2007-10-25
Carrier for stacked type semiconductor device and method of fabricating the same
Grant 7,285,848 - Onodera , et al. October 23, 2
2007-10-23
Semiconductor device and method of manufacturing the same
App 20070145579 - Hoshino; Masataka ;   et al.
2007-06-28
Semiconductor device, fabrication method therefor, and film fabrication method
App 20070105304 - Kasai; Junichi ;   et al.
2007-05-10
Exhaust gas processing method and exhaust gas processing system
App 20070000236 - Naito; Kenta ;   et al.
2007-01-04
Device having resin package and method of producing the same
Grant 7,144,754 - Yoneda , et al. December 5, 2
2006-12-05
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
App 20060245908 - Taya; Koji ;   et al.
2006-11-02
Stacked-type semiconductor device and method of manufacturing the same
App 20060220208 - Onodera; Masanori ;   et al.
2006-10-05
Stacked type semiconductor device and method of fabricating stacked type semiconductor device
App 20060170090 - Shinma; Yasuhiro ;   et al.
2006-08-03
Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
App 20060043600 - Onodera; Masanori ;   et al.
2006-03-02
Carrier for stacked type semiconductor device and method of fabricating the same
App 20050269682 - Onodera, Masanori ;   et al.
2005-12-08
Method of fabricating semiconductor device and semiconductor device
App 20050263871 - Shinma, Yasuhiro ;   et al.
2005-12-01
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
Grant 6,881,611 - Fukasawa , et al. April 19, 2
2005-04-19
Device having resin package and method of producing the same
Grant 6,856,017 - Yoneda , et al. February 15, 2
2005-02-15
Device having resin package and method of producing the same
App 20040219719 - Yoneda, Yoshiyuki ;   et al.
2004-11-04
Semiconductor module including a plurality of semiconductor devices detachably
Grant 6,696,754 - Sato , et al. February 24, 2
2004-02-24
Semiconductor module including a plurality of semiconductor devices detachably
App 20030164544 - Sato, Mitsutaka ;   et al.
2003-09-04
Anti-collision support system and method for automotive vehicle
Grant 6,566,999 - Iwasaki , et al. May 20, 2
2003-05-20
Device Having Resin Package And Method Of Producing The Same
App 20030006503 - YONEDA, YOSHIYUKI ;   et al.
2003-01-09
Semiconductor device having columnar electrode and method of manufacturing same
Grant 6,476,503 - Imamura , et al. November 5, 2
2002-11-05
Anti-collision support system and method for automotive vehicle
App 20020057194 - Iwasaki, Masahiko ;   et al.
2002-05-16
Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
App 20020030258 - Fukasawa, Norio ;   et al.
2002-03-14
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
App 20020027265 - Yoneda, Yoshiyuki ;   et al.
2002-03-07
Semiconductor Module Including A Plurality Of Semiconductor Devices Detachably
App 20020000645 - SATO, MITSUTAKA ;   et al.
2002-01-03
Bump-forming method using two plates and electronic device
App 20010018263 - Ochiai, Masayuki ;   et al.
2001-08-30
Method And Mold For Manufacturing Semiconductor Device, Semiconductor Device, And Method For Mounting The Device
App 20010003049 - FUKASAWA, NORIO ;   et al.
2001-06-07
Semiconductor device having a ball grid array and a fabrication process thereof
App 20010001714 - Motooka, Toshiyuki ;   et al.
2001-05-24
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
Grant 6,111,306 - Kawahara , et al. August 29, 2
2000-08-29
Method for fabricating bump forming plate member
Grant 6,090,301 - Mizukoshi , et al. July 18, 2
2000-07-18
Device having resin package with projections
Grant 6,072,239 - Yoneda , et al. June 6, 2
2000-06-06
Method for fabricating solder bumps by forming solder balls with a solder ball forming member
Grant 6,025,258 - Ochiai , et al. February 15, 2
2000-02-15
Semiconductor device including a frame terminal
Grant 6,025,650 - Tsuji , et al. February 15, 2
2000-02-15
Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
Grant 6,022,759 - Seki , et al. February 8, 2
2000-02-08
Semiconductor package for surface mounting
Grant 5,861,669 - Sono , et al. January 19, 1
1999-01-19
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
Grant 5,842,628 - Nomoto , et al. December 1, 1
1998-12-01
Semiconductor device and method of producing the same
Grant 5,804,467 - Kawahara , et al. September 8, 1
1998-09-08
Semiconductor device and semiconductor device unit for a stack arrangement
Grant 5,801,439 - Fujisawa , et al. September 1, 1
1998-09-01
Semiconductor device and method of producing the same
Grant 5,773,313 - Sato , et al. June 30, 1
1998-06-30
Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
Grant 5,760,471 - Fujisawa , et al. June 2, 1
1998-06-02
Semiconductor device, base member for semiconductor device and semiconductor device unit
Grant 5,747,874 - Seki , et al. May 5, 1
1998-05-05
Semiconductor device unit having holder
Grant 5,684,675 - Taniguchi , et al. November 4, 1
1997-11-04
Semiconductor device having resin gate hole through substrate for resin encapsulation
Grant 5,679,978 - Kawahara , et al. October 21, 1
1997-10-21
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
Grant 5,666,064 - Kasai , et al. September 9, 1
1997-09-09
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
Grant 5,643,831 - Ochiai , et al. July 1, 1
1997-07-01
Semiconductor device affixed to an upper and a lower leadframe
Grant 5,637,915 - Sato , et al. June 10, 1
1997-06-10
Semiconductor device having a plurality of chips
Grant 5,530,292 - Waki , et al. June 25, 1
1996-06-25
Semiconductor device having improved leads comprising palladium plated nickel
Grant 5,521,432 - Tsuji , et al. May 28, 1
1996-05-28
Semiconductor device and method of producing the same
Grant 5,519,251 - Sato , et al. May 21, 1
1996-05-21
Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package
Grant 5,508,565 - Hatakeyama , et al. April 16, 1
1996-04-16
Semiconductor device having a plurality of chips
Grant 5,463,253 - Waki , et al. October 31, 1
1995-10-31
Semiconductor device with surface mount package adapted for vertical mounting
Grant 5,451,815 - Taniguchi , et al. September 19, 1
1995-09-19
Method of producing semiconductor device having radiation part made of resin containing insulator powders
Grant 5,424,251 - Sono , et al. June 13, 1
1995-06-13
Process of using a jig to align and mount terminal conductors to a semiconductor plastic package
Grant 5,403,776 - Tsuji , et al. April 4, 1
1995-04-04
Semiconductor device and method of producing the same
Grant 5,399,804 - Yoneda , et al. March 21, 1
1995-03-21
Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads
Grant 5,361,970 - Kasai , et al. November 8, 1
1994-11-08
Surface-mounting type semiconductor package having an improved efficiency for heat dissipation
Grant 5,305,179 - Sono , et al. April 19, 1
1994-04-19
Semiconductor device having spherical terminals attached to the lead frame embedded within the package body
Grant 5,293,072 - Tsuji , et al. March 8, 1
1994-03-08
Vehicle alarm system for informing other vehicles of its own presence
Grant 5,289,181 - Watanabe , et al. February 22, 1
1994-02-22
Automotive multi-speaker audio system with different timing reproduction of audio sound
Grant 5,129,004 - Imai , et al. July 7, 1
1992-07-07
Structure of a speaker apparatus
Grant 5,067,159 - Kasai , et al. November 19, 1
1991-11-19
Stereo signal reproducing system using reverb unit
Grant 4,953,219 - Kasai , et al. August 28, 1
1990-08-28
Audio speaker system for automotive vehicle
Grant 4,866,776 - Kasai , et al. September 12, 1
1989-09-12
Stereo signal reproducing system
Grant 4,769,843 - Imai , et al. September 6, 1
1988-09-06
Woofer system for an automotive audio system with a protecter therefor
Grant 4,720,867 - Imai , et al. January 19, 1
1988-01-19
Stereo signal reproducing system
Grant 4,703,502 - Kasai , et al. October 27, 1
1987-10-27
Automotive multi-speaker audio system with automatic echo-control feature
Grant 4,694,497 - Kasai , et al. September 15, 1
1987-09-15
Audio equipment
Grant 4,641,344 - Kasai , et al. February 3, 1
1987-02-03
Electrical connector
Grant 4,592,609 - Kasai , et al. June 3, 1
1986-06-03
Vehicle panel speaker for automotive audio system utilizing part of a vehicle panel as a sound-producing medium
Grant 4,551,849 - Kasai , et al. November 5, 1
1985-11-05
Driver unit for automotive audio speaker
Grant 4,550,428 - Yanagishima , et al. October 29, 1
1985-10-29
Speaker for automotive vehicle audio system having a vehicle panel serving as sound-amplifying medium
Grant 4,514,599 - Yanagishima , et al. April 30, 1
1985-04-30
Speaker for automotive audio system with vehicle panel utilized as sound amplifying medium
Grant 4,499,340 - Kasai , et al. February 12, 1
1985-02-12

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