Patent | Date |
---|
Process Solutions Containing Surfactants App 20080063984 - Zhang; Peng ;   et al. | 2008-03-13 |
Materials And Methods Of Forming Controlled Void App 20080038934 - VRTIS; RAYMOND NICHOLAS ;   et al. | 2008-02-14 |
Curing Dielectric Films Under A Reducing Atmosphere App 20070299239 - Weigel; Scott Jeffrey ;   et al. | 2007-12-27 |
Use Of Hypofluorites, Fluoroperoxides, And/Or Fluorotrioxides As Oxidizing Agent In Fluorocarbon Etch Plasmas App 20070224829 - Ji; Bing ;   et al. | 2007-09-27 |
Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment App 20070131736 - Dong; Chun Christine ;   et al. | 2007-06-14 |
Selective etching of titanium nitride with xenon difluoride App 20070117396 - Wu; Dingjun ;   et al. | 2007-05-24 |
Process solutions containing surfactants App 20070010409 - Zhang; Peng ;   et al. | 2007-01-11 |
Process solutions containing surfactants App 20070010412 - Zhang; Peng ;   et al. | 2007-01-11 |
Method and process for reactive gas cleaning of tool parts App 20060254613 - Wu; Dingjun ;   et al. | 2006-11-16 |
Method for removing a residue from a chamber App 20060196525 - Vrtis; Raymond Nicholas ;   et al. | 2006-09-07 |
Method for defining a feature on a substrate App 20060183055 - O'Neill; Mark Leonard ;   et al. | 2006-08-17 |
Xenon recovery system App 20060107831 - Karwacki; Eugene Joseph JR. ;   et al. | 2006-05-25 |
Porous low dielectric constant compositions and methods for making and using same App 20060078676 - Lukas; Aaron Scott ;   et al. | 2006-04-13 |
Method to protect internal components of semiconductor processing equipment using layered superlattice materials App 20060040508 - Ji; Bing ;   et al. | 2006-02-23 |
Method for removing carbon-containing residues from a substrate App 20060027249 - Johnson; Andrew David ;   et al. | 2006-02-09 |
Process for titanium nitride removal App 20060016783 - Wu; Dingjun ;   et al. | 2006-01-26 |
Method for enhancing fluorine utilization App 20060017043 - Wu; Dingjun ;   et al. | 2006-01-26 |
Method for removing titanium dioxide deposits from a reactor App 20050202167 - Wu, Dingjun ;   et al. | 2005-09-15 |
Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture App 20050176605 - Lassila, Kevin Rodney ;   et al. | 2005-08-11 |
Method for cleaning deposition chambers for high dielectric constant materials App 20050108892 - Wu, Dingjun ;   et al. | 2005-05-26 |
Removal of transition metal ternary and/or quaternary barrier materials from a substrate App 20050112901 - Ji, Bing ;   et al. | 2005-05-26 |
Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas App 20050014383 - Ji, Bing ;   et al. | 2005-01-20 |
Unsaturated oxygenated fluorocarbons for selective aniostropic etch applications App 20050011859 - Ji, Bing ;   et al. | 2005-01-20 |
Process solutions containing surfactants App 20040204328 - Zhang, Peng ;   et al. | 2004-10-14 |
Method for enhancing deposition rate of chemical vapor deposition films App 20040197474 - Vrtis, Raymond Nicholas ;   et al. | 2004-10-07 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure App 20040175501 - Lukas, Aaron Scott ;   et al. | 2004-09-09 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure App 20040175957 - Lukas, Aaron Scott ;   et al. | 2004-09-09 |
Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials App 20040129671 - Ji, Bing ;   et al. | 2004-07-08 |
Non-thermal process for forming porous low dielectric constant films App 20040096593 - Lukas, Aaron Scott ;   et al. | 2004-05-20 |
Non-thermal process for forming porous low dielectric constant films App 20040096672 - Lukas, Aaron Scott ;   et al. | 2004-05-20 |
Process solutions containing surfactants App 20040053800 - Zhang, Peng ;   et al. | 2004-03-18 |
Acetylenic diol surfactant solutions and methods of using same App 20040053172 - Zhang, Peng ;   et al. | 2004-03-18 |
Cleaning of processing chambers with dilute NF3 plasmas App 20040045577 - Ji, Bing ;   et al. | 2004-03-11 |
Process solutions containing surfactants App 20040029396 - Zhang, Peng ;   et al. | 2004-02-12 |
Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials App 20040014327 - Ji, Bing ;   et al. | 2004-01-22 |
Glass-coating reactor cleaning with a reactive gas App 20040011385 - Henderson, Philip Bruce ;   et al. | 2004-01-22 |
Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials App 20040011380 - Ji, Bing ;   et al. | 2004-01-22 |
Halogen addition for improved adhesion of CVD copper to barrier App 20030104695 - Ciotti, Ralph J. ;   et al. | 2003-06-05 |
On-line UV-Visible light halogen gas analyzer for semiconductor processing effluent monitoring App 20030098419 - Ji, Bing ;   et al. | 2003-05-29 |