Patent | Date |
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In-Situ Metrology And Process Control App 20220181179 - Krishnamurthy; Ramesh ;   et al. | 2022-06-09 |
In-situ metrology and process control Grant 11,289,352 - Krishnamurthy , et al. March 29, 2 | 2022-03-29 |
In-Situ Metrology And Process Control App 20200335369 - Krishnamurthy; Ramesh ;   et al. | 2020-10-22 |
Systems and methods for substrate polishing end point detection using improved friction measurement Grant 9,862,070 - Chang , et al. January 9, 2 | 2018-01-09 |
Methods and apparatus for post-chemical mechanical planarization substrate cleaning Grant 9,711,381 - Ko , et al. July 18, 2 | 2017-07-18 |
Disk-brush cleaner module with fluid jet Grant 9,646,859 - Chen , et al. May 9, 2 | 2017-05-09 |
Feedback control using detection of clearance and adjustment for uniform topography Grant 9,472,475 - Xu , et al. October 18, 2 | 2016-10-18 |
Semiconductor device processing tools and methods for patterning substrates Grant 9,431,267 - Trivedi , et al. August 30, 2 | 2016-08-30 |
Feedback control of polishing using optical detection of clearance Grant 9,073,169 - Xu , et al. July 7, 2 | 2015-07-07 |
Systems and methods for substrate polishing end point detection using improved friction measurement Grant 9,061,394 - Chang , et al. June 23, 2 | 2015-06-23 |
Apparatus And Methods For Brush And Pad Conditioning App 20140360976 - KO; Sen-Hou ;   et al. | 2014-12-11 |
Spectrographic monitoring of a substrate during processing using index values Grant 8,874,250 - David , et al. October 28, 2 | 2014-10-28 |
Apparatus and methods for brush and pad conditioning Grant 8,813,293 - Ko , et al. August 26, 2 | 2014-08-26 |
Methods And Apparatus For Post-chemical Mechanical Planarization Substrate Cleaning App 20140209239 - Ko; Sen-Hou ;   et al. | 2014-07-31 |
Cryogenic Liquid Cleaning Apparatus And Methods App 20140196749 - Tang; Jianshe ;   et al. | 2014-07-17 |
Semiconductor Device Processing Tools And Methods For Patterning Substrates App 20140154887 - Trivedi; Mayur ;   et al. | 2014-06-05 |
Spectrographic Monitoring Of A Substrate During Processing Using Index Values App 20140039660 - David; Jeffrey Drue ;   et al. | 2014-02-06 |
In-line wafer thickness sensing Grant 8,628,376 - Sin , et al. January 14, 2 | 2014-01-14 |
Chemical planarization of copper wafer polishing Grant 8,586,481 - Wang , et al. November 19, 2 | 2013-11-19 |
Methods And Apparatus For Active Substrate Precession During Chemical Mechanical Polishing App 20130288577 - Chen; Hung ;   et al. | 2013-10-31 |
Spectrographic monitoring of a substrate during processing using index values Grant 8,554,351 - David , et al. October 8, 2 | 2013-10-08 |
Apparatus And Methods For Brush And Pad Conditioning App 20130247314 - KO; Sen-Hou ;   et al. | 2013-09-26 |
Feedback Control Using Detection Of Clearance And Adjustment For Uniform Topography App 20130224890 - Xu; Kun ;   et al. | 2013-08-29 |
Cleaning Module And Process For Particle Reduction App 20130185884 - Ko; Sen-Hou ;   et al. | 2013-07-25 |
Slurry For Cobalt Applications App 20130186850 - Wang; You ;   et al. | 2013-07-25 |
Slurry For Planarizing Photoresist App 20130189843 - Wang; You ;   et al. | 2013-07-25 |
Apparatus and methods for brush and pad conditioning Grant 8,458,843 - Ko , et al. June 11, 2 | 2013-06-11 |
Systems And Methods For Substrate Polishing End Point Detection Using Improved Friction Measurement App 20130122782 - Chang; Shou-Sung ;   et al. | 2013-05-16 |
Systems And Methods For Substrate Polishing End Point Detection Using Improved Friction Measurement App 20130122788 - Chang; Shou-Sung ;   et al. | 2013-05-16 |
Brush Box Module For Chemical Mechanical Polishing Cleaner App 20130111678 - Chen; Hui ;   et al. | 2013-05-09 |
Wafer edge characterization by successive radius measurements Grant 8,337,278 - Palou-Rivera , et al. December 25, 2 | 2012-12-25 |
Spectrographic Monitoring Of A Substrate During Processing Using Index Values App 20120323355 - David; Jeffrey Drue ;   et al. | 2012-12-20 |
Spectrographic monitoring of a substrate during processing using index values Grant 8,260,446 - David , et al. September 4, 2 | 2012-09-04 |
Roller assembly for a brush cleaning device in a cleaning module Grant 8,250,695 - Karuppiah , et al. August 28, 2 | 2012-08-28 |
Polishing System Having A Track App 20120208438 - YILMAZ; ALPAY ;   et al. | 2012-08-16 |
Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications Grant 8,211,325 - Diao , et al. July 3, 2 | 2012-07-03 |
Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery Grant 8,210,900 - Tu , et al. July 3, 2 | 2012-07-03 |
Polishing system having a track Grant 8,172,643 - Yilmaz , et al. May 8, 2 | 2012-05-08 |
Feedback Control of Polishing Using Optical Detection of Clearance App 20120064801 - Xu; Kun ;   et al. | 2012-03-15 |
Determining Physical Property of Substrate App 20110294400 - Ravid; Abraham ;   et al. | 2011-12-01 |
Chemical Planarization Of Copper Wafer Polishing App 20110294293 - Wang; You ;   et al. | 2011-12-01 |
Disk-brush Cleaner Module With Fluid Jet App 20110265816 - Chen; Hui ;   et al. | 2011-11-03 |
Determining physical property of substrate Grant 8,014,004 - Ravid , et al. September 6, 2 | 2011-09-06 |
High throughput measurement system Grant 7,952,708 - Ravid , et al. May 31, 2 | 2011-05-31 |
Apparatus And Methods For Brush And Pad Conditioning App 20110094537 - Ko; Sen-Hou ;   et al. | 2011-04-28 |
Roller Assembly For A Brush Cleaning Device In A Cleaning Module App 20110079245 - Karuppiah; Lakshmanan ;   et al. | 2011-04-07 |
Smart conditioner rinse station Grant 7,914,363 - Yilmaz , et al. March 29, 2 | 2011-03-29 |
Methods And Apparatus For Generating A Library Of Spectra App 20110046918 - Ravid; Abraham ;   et al. | 2011-02-24 |
Methods and apparatus for generating a library of spectra Grant 7,840,375 - Ravid , et al. November 23, 2 | 2010-11-23 |
Process Sequence To Achieve Global Planarity Using A Combination Of Fixed Abrasive And High Selectivity Slurry For Pre-metal Dielectric Cmp Applications App 20100285666 - DIAO; JIE ;   et al. | 2010-11-11 |
Determining Physical Property of Substrate App 20100261413 - Ravid; Abraham ;   et al. | 2010-10-14 |
Spectrographic Monitoring Of A Substrate During Processing Using Index Values App 20100217430 - David; Jeffrey Drue ;   et al. | 2010-08-26 |
Substrate thickness measuring during polishing Grant 7,774,086 - David , et al. August 10, 2 | 2010-08-10 |
Determining physical property of substrate Grant 7,746,485 - Ravid , et al. June 29, 2 | 2010-06-29 |
In-Line Wafer Thickness Sensing App 20100120333 - Sin; Garrett H. ;   et al. | 2010-05-13 |
Dishing And Defect Control Of Chemical Mechanical Polishing Using Real-time Adjustable Additive Delivery App 20100112903 - TU; WEN-CHIANG ;   et al. | 2010-05-06 |
Smart Conditioner Rinse Station App 20100029178 - Yilmaz; Alpay ;   et al. | 2010-02-04 |
Pad Properties Using Nanoparticle Additives App 20090278081 - M'Saad; Hichem ;   et al. | 2009-11-12 |
Polishing System With Three Headed Carousel App 20090280727 - KARUPPIAH; LAKSHMANAN ;   et al. | 2009-11-12 |
Smart conditioner rinse station Grant 7,611,400 - Yilmaz , et al. November 3, 2 | 2009-11-03 |
Polishing System Having A Track App 20090258574 - Yilmaz; Alpay ;   et al. | 2009-10-15 |
Wafer Edge Characterization By Successive Radius Measurements App 20090149115 - Palou-Rivera; Ignacio ;   et al. | 2009-06-11 |
Conductive pad design modification for better wafer-pad contact Grant 7,520,968 - Mavliev , et al. April 21, 2 | 2009-04-21 |
Electrochemical method for Ecmp polishing pad conditioning Grant 7,504,018 - Wang , et al. March 17, 2 | 2009-03-17 |
Substrate Thickness Measuring During Polishing App 20090036026 - David; Jeffrey Drue ;   et al. | 2009-02-05 |
Determining Physical Property of Substrate App 20090033942 - Ravid; Abraham ;   et al. | 2009-02-05 |
Determining physical property of substrate Grant 7,444,198 - Ravid , et al. October 28, 2 | 2008-10-28 |
Methods And Apparatus For Generating A Library Of Spectra App 20080243433 - Ravid; Abraham ;   et al. | 2008-10-02 |
High Throughput Measurement System App 20080239308 - Ravid; Abraham ;   et al. | 2008-10-02 |
Method and apparatus for electroprocessing a substrate with edge profile control Grant 7,422,982 - Wang , et al. September 9, 2 | 2008-09-09 |
Substrate thickness measuring during polishing Grant 7,409,260 - David , et al. August 5, 2 | 2008-08-05 |
Platen Assembly For Electrochemical Mechanical Processing App 20080146121 - Ozgun; Omer ;   et al. | 2008-06-19 |
Determining Physical Property Of Substrate App 20080146120 - Ravid; Abraham ;   et al. | 2008-06-19 |
Detection Of Clearance Of Polysilicon Residue App 20080138988 - David; Jeffrey Drue ;   et al. | 2008-06-12 |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing Grant 7,344,432 - Chen , et al. March 18, 2 | 2008-03-18 |
Apparatus For Electroprocessing A Substrate With Edge Profile Control App 20080035474 - Wang; You ;   et al. | 2008-02-14 |
Method for conditioning a polishing pad App 20080020682 - Jia; Renhe ;   et al. | 2008-01-24 |
Method and apparatus for electroprocessing a substrate with edge profile control App 20080014709 - Wang; You ;   et al. | 2008-01-17 |
Conditioning Disk Having Uniform Structures App 20080014845 - Yilmaz; Alpay ;   et al. | 2008-01-17 |
Abrasive Composition For Electrochemical Mechanical Polishing App 20070254485 - Mao; Daxin ;   et al. | 2007-11-01 |
Process for high copper removal rate with good planarization and surface finish App 20070235344 - Jia; Renhe ;   et al. | 2007-10-11 |
Substrate Thickness Measuring During Polishing App 20070224915 - David; Jeffrey Drue ;   et al. | 2007-09-27 |
Smart Conditioner Rinse Station App 20070207704 - YILMAZ; ALPAY ;   et al. | 2007-09-06 |
Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process App 20070181442 - Jia; Renhe ;   et al. | 2007-08-09 |
Methods for electrochemical processing with pre-biased cells App 20070158207 - Diao; Jie ;   et al. | 2007-07-12 |
Apparatus and a method for electrochemical mechanical processing with fluid flow assist elements App 20070151867 - Hu; Yongqi ;   et al. | 2007-07-05 |
Voltage Mode Current Control App 20070108066 - Tsai; Stan D. ;   et al. | 2007-05-17 |
Electrochemical Method For Ecmp Polishing Pad Conditioning App 20070095677 - Wang; You ;   et al. | 2007-05-03 |
Conductive Pad With Ion Exchange Membrane For Electrochemical Mechanical Polishing App 20070099552 - Chen; Liang-Yuh ;   et al. | 2007-05-03 |
Smart conditioner rinse station Grant 7,210,981 - Yilmaz , et al. May 1, 2 | 2007-05-01 |
Smart conditioner rinse station App 20060270322 - Yilmaz; Alpay ;   et al. | 2006-11-30 |
Process and composition for electrochemical mechanical polishing App 20060249395 - Wang; You ;   et al. | 2006-11-09 |
Process and composition for electrochemical mechanical polishing App 20060249394 - Jia; Renhe ;   et al. | 2006-11-09 |
Tungsten electroprocessing App 20060196778 - Jia; Renhe ;   et al. | 2006-09-07 |
Platen assembly utilizing magnetic slip ring App 20060154569 - Doyle; Terry ;   et al. | 2006-07-13 |
Conductive pad design modification for better wafer-pad contact App 20060073768 - Mavliev; Rashid A. ;   et al. | 2006-04-06 |
Methods and systems for exchanging messages in a controller for a substrate processing system App 20040142563 - Fontarensky, Pierre ;   et al. | 2004-07-22 |