Karpman; Maurice S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Karpman; Maurice S..The latest application filed is for "reconstructed wafer based devices with embedded environmental sensors and process for making same".

Company Profile

3.22.14

Karpman; Maurice S. - Brookline MA
Karpman; Maurice S. - Medford MA
Karpman; Maurice S. - Austin TX
Karpman; Maurice S. - Westwood MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods and devices for improved space utilization in wafer based modules Grant 10,681,821 - Karpman	2020-06-09
Method and apparatus for forming multi-layered vias in sequentially fabricated circuits Grant 10,453,787 - Karpman , et al. Oc	2019-10-22
Reconstructed wafer based devices with embedded environmental sensors and process for making same Grant 10,315,914 - Karpman	2019-06-11
Closely spaced array of penetrating electrodes Grant 10,265,516 - Karpman , et al.	2019-04-23
Devices and methods for detecting counterfeit semiconductor devices Grant 9,941,223 - Karpman April 10, 2	2018-04-10
Reconstructed wafer based devices with embedded environmental sensors and process for making same App 20170369307 - Karpman; Maurice S.	2017-12-28
Closely Spaced Array Of Penetrating Electrodes App 20170165474 - Karpman; Maurice S. ; et al.	2017-06-15
Method And Apparatus For Forming Multi-layered Vias In Sequentially Fabricated Circuits App 20160343652 - Karpman; Maurice S. ; et al.	2016-11-24
Methods And Devices For Improved Space Utilization In Wafer Based Modules App 20160113139 - Karpman; Maurice S.	2016-04-21
Devices And Methods For Detecting Counterfeit Semiconductor Devices App 20160043043 - Karpman; Maurice S.	2016-02-11
Interconnection of through-wafer vias using bridge structures Grant 7,608,534 - Yun , et al. October 27, 2	2009-10-27
Method of producing a MEMS device App 20080225505 - Martin; John R. ; et al.	2008-09-18
Method of producing a MEMS device Grant 7,416,984 - Martin , et al. August 26, 2	2008-08-26
Packaged microchip with premolded-type package Grant 7,166,911 - Karpman , et al. January 23, 2	2007-01-23
Method of producing a MEMS device App 20060027522 - Martin; John R. ; et al.	2006-02-09
Fabricating complex micro-electromechanical systems using a flip bonding technique Grant 6,964,882 - Yun , et al. November 15, 2	2005-11-15
Packaged microchip with isolator having selected modulus of elasticity Grant 6,946,742 - Karpman September 20, 2	2005-09-20
Fabricating integrated micro-electromechanical systems using an intermediate electrode layer Grant 6,933,163 - Yun , et al. August 23, 2	2005-08-23
Shadow mask and method of producing the same Grant 6,893,976 - Karpman , et al. May 17, 2	2005-05-17
Stress sensitive microchip with premolded-type package App 20050056870 - Karpman, Maurice S. ; et al.	2005-03-17
Packaged microchip with premolded-type package App 20050035446 - Karpman, Maurice S. ; et al.	2005-02-17
Packaged microchip with isolator having selected modulus of elasticity App 20040119143 - Karpman, Maurice S.	2004-06-24
Fabricating complex micro-electromechanical systems using a dummy handling substrate App 20040063237 - Yun, Chang-Han ; et al.	2004-04-01
Fabricating complex micro-electromechanical systems using an intermediate electrode layer App 20040063239 - Yun, Chang-Han ; et al.	2004-04-01
Fabricating complex micro-electromechanical systems using a flip bonding technique App 20040061192 - Yun, Chang-Han ; et al.	2004-04-01
Single unit position sensor Grant 6,713,829 - Karpman March 30, 2	2004-03-30
Shadow mask and method of producing the same App 20040048484 - Karpman, Maurice S. ; et al.	2004-03-11
Probe card for testing optical micro electromechanical system devices at wafer level Grant 6,686,993 - Karpman , et al. February 3, 2	2004-02-03
Electrically shielded glass lid for a packaged device Grant 6,555,904 - Karpman April 29, 2	2003-04-29
Cover cap for semiconductor wafer devices Grant 6,534,340 - Karpman , et al. March 18, 2	2003-03-18
Wafer level method of capping multiple MEMS elements Grant 6,448,109 - Karpman September 10, 2	2002-09-10
Apparatus and method for generating full-color images using two light sources Grant 5,657,165 - Karpman , et al. August 12, 1	1997-08-12
Tape automated bonding(tab)semiconductor device and method for making the same Grant 5,289,032 - Higgins, III , et al. February 22, 1	1994-02-22
Elastomeric test probe Grant 5,134,364 - Karpman , et al. July 28, 1	1992-07-28
Semiconductor device having a low temperature UV-cured epoxy seal Grant 5,117,279 - Karpman May 26, 1	1992-05-26
Circuit board thermal contact device Grant 4,825,337 - Karpman April 25, 1	1989-04-25

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