Karpman; Maurice

Patent Applications and Registrations

Patent applications and USPTO patent grants for Karpman; Maurice.The latest application filed is for "method and apparatus for using universal cavity wafer in wafer level packaging".

Company Profile

1.12.8

Karpman; Maurice - Cambridge MA
Karpman; Maurice - Brookline MA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for using universal cavity wafer in wafer level packaging Grant 10,418,249 - Karpman , et al. Sept	2019-09-17
Method And Apparatus For Using Universal Cavity Wafer In Wafer Level Packaging App 20180108533 - Karpman; Maurice ; et al.	2018-04-19
Method and apparatus for using universal cavity wafer in wafer level packaging Grant 9,847,230 - Karpman , et al. December 19, 2	2017-12-19
Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules Grant 9,735,128 - Karpman August 15, 2	2017-08-15
Method And Apparatus For Using Universal Cavity Wafer In Wafer Level Packaging App 20160365321 - Karpman; Maurice ; et al.	2016-12-15
Method for interconnecting die and substrate in an electronic package Grant 9,293,440 - Holm , et al. March 22, 2	2016-03-22
Method for embedding a chipset having an intermediary interposer in high density electronic modules Grant 9,257,355 - Smith , et al. February 9, 2	2016-02-09
Method For Interconnecting Die And Substrate In An Electronic Package App 20150179609 - Holm; Michael ; et al.	2015-06-25
Method For Incorporating Stress Sensitive Chip Scale Components Into Reconstructed Wafer Based Modules App 20140227834 - Karpman; Maurice	2014-08-14
Method For Embedding A Chipset Having An Intermediary Interposer In High Density Electronic Modules App 20140225244 - Smith; Brian ; et al.	2014-08-14
Three dimensional microelectronic components and fabrication methods for same Grant 8,785,249 - Karpman July 22, 2	2014-07-22
Static dissipation treatments for optical package windows Grant 7,338,705 - Martin , et al. March 4, 2	2008-03-04
Static dissipation treatments for optical package windows App 20060159911 - Martin; John R. ; et al.	2006-07-20
Static dissipation treatments for optical package windows Grant 7,033,672 - Martin , et al. April 25, 2	2006-04-25
Hermetically sealed microstructure package Grant 6,828,674 - Karpman December 7, 2	2004-12-07
Static dissipation treatments for optical package windows App 20030179986 - Martin, John R. ; et al.	2003-09-25
Optical mirror coatings for high-temperature diffusion barriers and mirror shaping Grant 6,508,561 - Alie , et al. January 21, 2	2003-01-21
Hermetically sealed microstructure package App 20030006502 - Karpman, Maurice	2003-01-09
Hermetically sealed microstructure package Grant 6,441,481 - Karpman August 27, 2	2002-08-27

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