| Patent | Date |
|---|
Semiconductor device including accelerometer devices
Grant 9,233,836 - Karlin , et al. January 12, 2 | 2016-01-12 |
Cavity based packaging for MEMS devices
Grant 9,061,885 - Karlin , et al. June 23, 2 | 2015-06-23 |
Integrated Circuit Having Varying Substrate Depth And Method Of Forming Same
App 20150084138 - Karlin; Lisa H. ; et al. | 2015-03-26 |
Method of forming an integrated circuit having varying substrate depth
Grant 8,921,203 - Karlin , et al. December 30, 2 | 2014-12-30 |
Method of forming an integrated circuit having varying substrate depth
Grant 08921203 - | 2014-12-30 |
Pressure Level Adjustment In A Cavity Of A Semiconductor Die
App 20140225206 - Lin; Yizhen ; et al. | 2014-08-14 |
Attaching a MEMS to a bonding wafer
Grant 8,652,865 - Karlin , et al. February 18, 2 | 2014-02-18 |
Semiconductor Device And Method Of Fabricating Same
App 20140008739 - Karlin; Lisa H. ; et al. | 2014-01-09 |
Integrated Circuit Having Varying Substrate Depth And Method Of Forming Same
App 20130285161 - Karlin; Lisa H. ; et al. | 2013-10-31 |
Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing
Grant 8,551,814 - Karlin , et al. October 8, 2 | 2013-10-08 |
Eutectic flow containment in a semiconductor fabrication process
Grant 8,525,316 - Karlin , et al. September 3, 2 | 2013-09-03 |
Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)
Grant 8,461,656 - Park , et al. June 11, 2 | 2013-06-11 |
Method of making a micro-electro-mechanical-systems (MEMS) device
Grant 8,455,286 - Karlin , et al. June 4, 2 | 2013-06-04 |
Attaching A Mems To A Bonding Wafer
App 20130043564 - KARLIN; LISA H. ; et al. | 2013-02-21 |
Method Of Making A Micro-electro-mechanical-systems (mems) Device
App 20120107993 - Karlin; Lisa H. ; et al. | 2012-05-03 |
Method Of Producing Layered Wafer Structure Having Anti-stiction Bumps
App 20120107992 - Karlin; Lisa H. ; et al. | 2012-05-03 |
Electrical coupling of wafer structures
Grant 8,138,062 - Liu , et al. March 20, 2 | 2012-03-20 |
Method of forming a micro-electromechanical system (MEMS) having a gap stop
Grant 8,119,431 - Park , et al. February 21, 2 | 2012-02-21 |
Methods For Making In-plane And Out-of-plane Sensing Micro-electro-mechanical Systems (mems)
App 20120001277 - Park; Woo Tae ; et al. | 2012-01-05 |
Method for forming a capped micro-electro-mechanical system (MEMS) device
Grant 8,039,312 - Gunturu , et al. October 18, 2 | 2011-10-18 |
Semiconductor Device And Method Of Fabricating Same
App 20110221042 - Karlin; Lisa H. ; et al. | 2011-09-15 |
Electrical Coupling Of Wafer Structures
App 20110143476 - LIU; LIANJUN ; et al. | 2011-06-16 |
Micro Electromechanical Systems (mems) Having A Gap Stop And Method Therefor
App 20110133294 - Park; Woo Tae ; et al. | 2011-06-09 |
Method of producing microelectromechanical device with isolated microstructures
Grant 7,943,525 - Zhang , et al. May 17, 2 | 2011-05-17 |
Eutectic Flow Containment In A Semiconductor Fabrication Process
App 20110042761 - Karlin; Lisa H. ; et al. | 2011-02-24 |
Eutectic flow containment in a semiconductor fabrication process
Grant 7,846,815 - Karlin , et al. December 7, 2 | 2010-12-07 |
Eutectic Flow Containment In A Semiconductor Fabrication Process
App 20100244159 - Karlin; Lisa H. ; et al. | 2010-09-30 |
Microelectromechanical Device With Isolated Microstructures And Method Of Producing Same
App 20100155861 - Zhang; Lisa Z. ; et al. | 2010-06-24 |
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