Kariya; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kariya; Takashi.The latest application filed is for "engine exhaust gas recirculation system".

Company Profile

1.121.108

Kariya; Takashi - Tokyo JP
Kariya; Takashi - Aki-gun JP
Kariya; Takashi - Ogaki JP
KARIYA; Takashi - Ogaki-shi JP
Kariya; Takashi - Ibi-gun JP
Kariya; Takashi - Gifu JP
Kariya; Takashi - Hashima JP
Kariya; Takashi - Hashima-gun JP
Kariya; Takashi - Hitachi JP
Kariya; Takashi - Cincinnati OH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed wiring board and method for manufacturing the same Grant 11,382,218 - Morita , et al. July 5, 2	2022-07-05
Engine Exhaust Gas Recirculation System App 20220128019 - Nishida; Tomonori ; et al.	2022-04-28
EGR system of engine Grant 11,168,650 - Fujihira , et al. November 9, 2	2021-11-09
Egr System Of Engine App 20210310447 - Fujihira; Shinji ; et al.	2021-10-07
EGR system of engine Grant 11,111,886 - Fujihira , et al. September 7, 2	2021-09-07
Printed wiring board and method for manufacturing the same Grant 10,905,013 - Morita , et al. January 26, 2	2021-01-26
Device-embedded Board And Method Of Manufacturing The Same App 20200315034 - MORITA; Takaaki ; et al.	2020-10-01
Printed Wiring Board And Method For Manufacturing The Same App 20190373739 - MORITA; Takaaki ; et al.	2019-12-05
Printed Wiring Board And Method For Manufacturing The Same App 20190373742 - Morita; Takaaki ; et al.	2019-12-05
Printed wiring board for package-on-package Grant 9,935,029 - Kariya , et al. April 3, 2	2018-04-03
Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same Grant 9,893,016 - Sakamoto , et al. February 13, 2	2018-02-13
Printed wiring board, method for manufacturing the same and semiconductor device Grant 9,706,663 - Sakamoto , et al. July 11, 2	2017-07-11
Printed wiring board, method for manufacturing printed wiring board and package-on-package Grant 9,693,458 - Yoshikawa , et al. June 27, 2	2017-06-27
Printed wiring board, method for manufacturing printed wiring board and package-on-package Grant 9,578,745 - Yoshikawa , et al. February 21, 2	2017-02-21
Printed wiring board, method for manufacturing printed wiring board, and package-on-package Grant 9,572,256 - Yoshikawa , et al. February 14, 2	2017-02-14
Printed wiring board and method for manufacturing printed wiring board Grant 9,532,468 - Kunieda , et al. December 27, 2	2016-12-27
Printed wiring board Grant 9,497,849 - Kariya , et al. November 15, 2	2016-11-15
Flex-rigid wiring board and method for manufacturing flex-rigid wiring board Grant 9,480,173 - Ishihara , et al. October 25, 2	2016-10-25
Printed Wiring Board For Package-on-package App 20160268188 - KARIYA; Takashi ; et al.	2016-09-15
Inductor Component And Printed Wiring Board App 20160217911 - MANO; Yasuhiko ; et al.	2016-07-28
Multilayer Wiring Board And Method For Manufacturing The Same App 20160105960 - SAKAMOTO; Hajime ; et al.	2016-04-14
Printed wiring board and method for manufacturing printed wiring board Grant 9,307,645 - Mano , et al. April 5, 2	2016-04-05
Printed wiring board, inductor component, and method for manufacturing inductor component Grant 9,287,034 - Mano , et al. March 15, 2	2016-03-15
Printed Wiring Board, Method For Manufacturing The Same And Semiconductor Device App 20160066422 - Sakamoto; Hajime ; et al.	2016-03-03
Inductor component and printed wiring board incorporating inductor component and method for manufacturing inductor component Grant 9,265,158 - Mano , et al. February 16, 2	2016-02-16
Printed Wiring Board App 20160042861 - MANO; Yasuhiko ; et al.	2016-02-11
Electronic Circuit Apparatus And Method For Manufacturing Electronic Circuit Apparatus App 20150366102 - ISHIHARA; Teruyuki ; et al.	2015-12-17
Wiring Board And Method For Manufacturing The Same App 20150264817 - TERUI; Makoto ; et al.	2015-09-17
Printed Wiring Board, Method For Manufacturing Printed Wiring Board, And Package-on-package App 20150250054 - YOSHIKAWA; Kazuhiro ; et al.	2015-09-03
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20150245485 - TAKAHASHI; Nobuya ; et al.	2015-08-27
Wiring board and method for manufacturing the same Grant 9,119,322 - Mikado , et al. August 25, 2	2015-08-25
Printed Wiring Board App 20150213946 - MANO; Yasuhiko ; et al.	2015-07-30
Wiring board and method for manufacturing the same Grant 9,066,435 - Terui , et al. June 23, 2	2015-06-23
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20150136459 - KUNIEDA; Masatoshi ; et al.	2015-05-21
Flex-rigid Wiring Board And Method For Manufacturing Flex-rigid Wiring Board App 20150114689 - ISHIHARA; Teruyuki ; et al.	2015-04-30
Flex-rigid Wiring Board And Method For Manufacturing Flex-rigid Wiring Board App 20150114690 - ISHIHARA; Teruyuki ; et al.	2015-04-30
Printed Wiring Board, Method For Manufacturing Printed Wiring Board And Package-on-package App 20150098204 - YOSHIKAWA; Kazuhiro ; et al.	2015-04-09
Printed Wiring Board, Method For Manufacturing Printed Wiring Board And Package-on-package App 20150092357 - YOSHIKAWA; Kazuhiro ; et al.	2015-04-02
Printed Wiring Board, Method For Manufacturing Printed Wiring Board And Package-on-package App 20150092356 - YOSHIKAWA; Kazuhiro ; et al.	2015-04-02
Combined Printed Wiring Board And Method For Manufacturing The Same App 20150060124 - TERUI; Makoto ; et al.	2015-03-05
Combined Printed Wiring Board And Method For Manufacturing The Same App 20150060127 - Terui; Makoto ; et al.	2015-03-05
Wiring board and method for manufacturing the same Grant 8,971,053 - Kariya , et al. March 3, 2	2015-03-03
Multilayer Printed Wiring Board App 20150026975 - Kariya; Takashi ; et al.	2015-01-29
Wiring Board And Method For Manufacturing The Same App 20150022982 - MIKADO; Yukinobu ; et al.	2015-01-22
Wiring board and method for manufacturing the same Grant 8,908,387 - Mikado , et al. December 9, 2	2014-12-09
Wiring Board And Method For Manufacturing The Same App 20140347837 - KARIYA; Takashi ; et al.	2014-11-27
High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof Grant 8,837,160 - Kariya , et al. September 16, 2	2014-09-16
Multilayer printed wiring board Grant 8,829,355 - Kariya , et al. September 9, 2	2014-09-09
Inductor Device, Method For Manufacturing The Same, And Printed Wiring Board App 20140159851 - MANO; Yasuhiko ; et al.	2014-06-12
Printed wiring board with capacitor Grant 8,730,647 - Mano , et al. May 20, 2	2014-05-20
Wiring Board And Method For Manufacturing The Same App 20140133119 - Kariya; Takashi ; et al.	2014-05-15
High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof Grant 8,707,552 - Kariya , et al. April 29, 2	2014-04-29
Wiring Board And Method For Manufacturing The Same App 20140102768 - SHIZUNO; Yoshinori ; et al.	2014-04-17
Wiring board and method for manufacturing the same Grant 8,654,538 - Kariya , et al. February 18, 2	2014-02-18
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20140020940 - MANO; Yasuhiko ; et al.	2014-01-23
Printed Wiring Board App 20140014399 - KARIYA; Takashi ; et al.	2014-01-16
Printed wiring board with crossing wiring pattern Grant 8,629,550 - Hirose , et al. January 14, 2	2014-01-14
Multilayer printed wiring board Grant 8,563,420 - Kariya , et al. October 22, 2	2013-10-22
Wiring Board And Method For Manufacturing The Same App 20130258625 - Terui; Makoto ; et al.	2013-10-03
Heat resistant substrate incorporated circuit wiring board Grant 8,541,691 - Kariya , et al. September 24, 2	2013-09-24
Printed Wiring Board, Inductor Component, And Method For Manufacturing Inductor Component App 20130223033 - MANO; Yasuhiko ; et al.	2013-08-29
Heat resistant substrate incorporated circuit wiring board Grant 8,507,806 - Kariya , et al. August 13, 2	2013-08-13
Wiring Board And Method For Manufacturing The Same App 20130194764 - MIKADO; Yukinobu ; et al.	2013-08-01
Printed circuit board manufacturing method Grant 8,453,323 - Sakamoto , et al. June 4, 2	2013-06-04
Multilayer printed circuit board and multilayer printed circuit board manufacturing method Grant 8,438,727 - Sakamoto , et al. May 14, 2	2013-05-14
Electronic component and method for manufacturing the same Grant 8,415,781 - Kariya , et al. April 9, 2	2013-04-09
Method of manufacturing printed wiring board with component mounting pin Grant 8,409,461 - Kariya , et al. April 2, 2	2013-04-02
Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor element Grant 8,395,054 - Kariya , et al. March 12, 2	2013-03-12
Electronic component mounting substrate and method for manufacturing electronic component mounting substrate Grant 8,373,069 - Kariya , et al. February 12, 2	2013-02-12
Wiring board with built-in electronic component and method of manufacturing same Grant 8,347,493 - Taniguchi , et al. January 8, 2	2013-01-08
Multilayer printed wiring board Grant 8,334,466 - Kariya December 18, 2	2012-12-18
Multilayer Printed Wiring Board App 20120302010 - KARIYA; Takashi ; et al.	2012-11-29
Multilayer printed wiring board Grant 8,253,030 - Kariya , et al. August 28, 2	2012-08-28
Inductor Component And Printed Wiring Board Incorporating Inductor Component And Method For Manufacturing Inductor Component App 20120212919 - MANO; Yasuhiko ; et al.	2012-08-23
Method for manufacturing board with built-in electronic elements Grant 8,225,503 - Kariya , et al. July 24, 2	2012-07-24
Inductor and electric power supply using it Grant 8,207,811 - Mano , et al. June 26, 2	2012-06-26
Multilayer printed circuit board and multilayer printed circuit board manufacturing method Grant 8,186,045 - Sakamoto , et al. May 29, 2	2012-05-29
Multilayer printed wiring board Grant 8,169,792 - Kariya , et al. May 1, 2	2012-05-01
Printed wiring board Grant 8,164,920 - Kariya April 24, 2	2012-04-24
Multilayer printed wiring board Grant 8,124,882 - Kariya , et al. February 28, 2	2012-02-28
Electronic Component And Method For Manufacturing The Same App 20120032335 - KARIYA; Takashi ; et al.	2012-02-09
Method for manufacturing printed circuit board Grant 8,108,990 - Kariya , et al. February 7, 2	2012-02-07
Printed wiring board and method of manufacturing the same Grant 8,093,508 - Kariya , et al. January 10, 2	2012-01-10
Printed Circuit Board Manufacturing Method App 20120000068 - SAKAMOTO; Hajime ; et al.	2012-01-05
Printed circuit board manufacturing method Grant 8,079,142 - Sakamoto , et al. December 20, 2	2011-12-20
Printed Wiring Board And Manufacturing Method Of Printed Wiring Board App 20110290544 - Hirose; Naohiro ; et al.	2011-12-01
Method for manufacturing multilayer printed circuit board Grant 8,046,914 - Sakamoto , et al. November 1, 2	2011-11-01
High-dielectric Sheet, A Printed Circuit Board Having The High-dielectric Sheet And Production Methods Thereof App 20110259629 - KARIYA; Takashi ; et al.	2011-10-27
Wiring Board And Method For Manufacturing The Same App 20110240357 - Kariya; Takashi ; et al.	2011-10-06
Printed wiring board with notched conductive traces Grant 8,018,046 - Hirose , et al. September 13, 2	2011-09-13
Heat resistant substrate incorporated circuit wiring board Grant 8,008,583 - Kariya , et al. August 30, 2	2011-08-30
Heat resistant substrate incorporated circuit wiring board Grant 7,994,432 - Kariya , et al. August 9, 2	2011-08-09
Multilayer printed wiring board Grant 7,982,139 - Kariya , et al. July 19, 2	2011-07-19
Method of manufacturing a multilayer printed wiring board Grant 7,971,354 - Kariya , et al. July 5, 2	2011-07-05
Multilayer Printed Wiring Board App 20110100700 - KARIYA; Takashi ; et al.	2011-05-05
Inductor And Electric Power Supply Using It App 20110102122 - MANO; Yasuhiko ; et al.	2011-05-05
Multilayer Printed Wiring Board App 20110063811 - KARIYA; Takashi ; et al.	2011-03-17
Heat Resistant Substrate Incorporated Circuit Wiring Board App 20110063806 - KARIYA; Takashi ; et al.	2011-03-17
Printed board with component mounting pin Grant 7,891,089 - Kariya , et al. February 22, 2	2011-02-22
Multilayer printed wiring board Grant 7,894,203 - Kariya , et al. February 22, 2	2011-02-22
Printed circuit board Grant 7,888,803 - Kariya , et al. February 15, 2	2011-02-15
Multilayer printed circuit board Grant 7,888,605 - Sakamoto , et al. February 15, 2	2011-02-15
Multilayer printed circuit board Grant 7,888,606 - Sakamoto , et al. February 15, 2	2011-02-15
Multilayer printed circuit board Grant 7,884,286 - Sakamoto , et al. February 8, 2	2011-02-08
Multilayer printed wiring board Grant 7,881,071 - Kariya , et al. February 1, 2	2011-02-01
Inductor and electric power supply using it Grant 7,868,728 - Mano , et al. January 11, 2	2011-01-11
Method of manufacturing printed wiring board Grant 7,856,710 - Kariya , et al. December 28, 2	2010-12-28
Inductor and electric power supply using it Grant 7,855,626 - Mano , et al. December 21, 2	2010-12-21
Multilayer printed circuit board Grant 7,842,887 - Sakamoto , et al. November 30, 2	2010-11-30
Inductor and electric power supply using it Grant 7,843,302 - Mano , et al. November 30, 2	2010-11-30
Multilayer Printed Wiring Board App 20100288544 - Kariya; Takashi	2010-11-18
Multilayer printed wiring board Grant 7,817,440 - Kariya , et al. October 19, 2	2010-10-19
Inductor and electric power supply using it Grant 7,812,702 - Mano , et al. October 12, 2	2010-10-12
Multilayer Printed Wiring Board App 20100243299 - Kariya; Takashi ; et al.	2010-09-30
Substrate For Mounting Semiconductor Element And Method For Manufacturing Substrate For Mounting Semiconductor Element App 20100230148 - Kariya; Takashi ; et al.	2010-09-16
Multilayer printed wiring board Grant 7,781,681 - Kariya August 24, 2	2010-08-24
High-dielectric Sheet, A Printed Circuit Board Having The High-dielectric Sheet And Production Methods Thereof App 20100200285 - KARIYA; Takashi ; et al.	2010-08-12
Electronic Component Mounting Substrate And Method For Manufacturing Electronic Component Mounting Substrate App 20100200279 - KARIYA; Takashi ; et al.	2010-08-12
Printed wiring board with component mounting pin and electronic device using the same Grant 7,773,388 - Kariya , et al. August 10, 2	2010-08-10
Printed Wiring Board And Method Of Manufacturing The Same App 20100193227 - KARIYA; Takashi ; et al.	2010-08-05
Process for producing multi-layer printed wiring board Grant 7,761,984 - Hiramatsu , et al. July 27, 2	2010-07-27
Package substrate with built-in capacitor and manufacturing method thereof Grant 7,755,166 - Kariya July 13, 2	2010-07-13
Multilayer printed wiring board and method of manufacturing the same Grant 7,754,978 - Kariya , et al. July 13, 2	2010-07-13
Package board integrated with power supply Grant 7,751,205 - Kariya , et al. July 6, 2	2010-07-06
Printed board with component mounting pin Grant 7,731,504 - Kariya , et al. June 8, 2	2010-06-08
Inductor And Electric Power Supply Using It App 20100117779 - MANO; Yasuhiko ; et al.	2010-05-13
Multilayer Printed Wiring Board And Method Of Manufacturing The Same App 20100108637 - KARIYA; Takashi ; et al.	2010-05-06
Package substrate with built-in capacitor and manufacturing method thereof Grant 7,692,267 - Kariya April 6, 2	2010-04-06
Multilayer Printed Wiring Board App 20100064512 - KARIYA; Takashi ; et al.	2010-03-18
Capacitor having adjustable capacitance, and printed wiring board having the same Grant 7,662,694 - Sakamoto , et al. February 16, 2	2010-02-16
Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method App 20100031503 - SAKAMOTO; Hajime ; et al.	2010-02-11
Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module Grant 7,656,032 - Kariya , et al. February 2, 2	2010-02-02
Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method App 20100018049 - SAKAMOTO; Hajime ; et al.	2010-01-28
Multilayer printed wiring board Grant 7,649,748 - Kariya , et al. January 19, 2	2010-01-19
Printed Wiring Board App 20090290316 - Kariya; Takashi	2009-11-26
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Grant RE40,947 - Asai , et al. October 27, 2	2009-10-27
Heat Resistant Substrate Incorporated Circuit Wiring Board App 20090260857 - Kariya; Takashi ; et al.	2009-10-22
Heat Resistant Substrate Incorporated Circuit Wiring Board App 20090255716 - KARIYA; Takashi ; et al.	2009-10-15
Wiring Board With Built-in Electronic Component And Method Of Manufacturing Same App 20090242255 - TANIGUCHI; Hirotaka ; et al.	2009-10-01
Inductor And Electric Power Supply Using It App 20090224863 - Mano; Yasuhiko ; et al.	2009-09-10
Inductor And Electric Power Supply Using It App 20090225525 - Mano; Yasuhiko ; et al.	2009-09-10
Method For Manufacturing Board With Built-in Electronic Elements App 20090199399 - Kariya; Takashi ; et al.	2009-08-13
Package Substrate With Built-in Capacitor And Manufacturing Method Thereof App 20090200639 - KARIYA; Takashi	2009-08-13
Multilayer Printed Wiring Board App 20090200069 - KARIYA; Takashi ; et al.	2009-08-13
Printed Wiring Board With Capacitor App 20090200073 - Mano; Yasuhiko ; et al.	2009-08-13
Package Substrate With Built-in Capacitor And Manufacturing Method Thereof App 20090175011 - KARIYA; Takashi	2009-07-09
Printed Wiring Board And Manufacturing Method Of Printed Wiring Board App 20090159327 - Hirose; Naohiro ; et al.	2009-06-25
Multilayer Printed Wiring Board App 20090129039 - Kariya; Takashi ; et al.	2009-05-21
Package substrate with built-in capacitor and manufacturing method thereof Grant 7,525,175 - Kariya April 28, 2	2009-04-28
Printed wiring board with wiring pattern having narrow width portion Grant 7,525,190 - Hirose , et al. April 28, 2	2009-04-28
Multilayer Printed Wiring Board App 20090090547 - KARIYA; Takashi ; et al.	2009-04-09
Heat Resistant Substrate Incorporated Circuit Wiring Board App 20090084594 - KARIYA; Takashi ; et al.	2009-04-02
Printed Circuit Board Manufacturing Method App 20090070996 - SAKAMOTO; Hajime ; et al.	2009-03-19
Printed Circuit Board App 20090064493 - KARIYA; Takashi ; et al.	2009-03-12
Printed board with a pin for mounting a component Grant 7,497,694 - Kariya , et al. March 3, 2	2009-03-03
Printed Board With Component Mounting Pin App 20090053910 - Kariya; Takashi ; et al.	2009-02-26
Printed Board With Component Mounting Pin App 20090053911 - KARIYA; Takashi ; et al.	2009-02-26
Multilayer printed wiring board Grant 7,495,332 - Kariya , et al. February 24, 2	2009-02-24
Multilayer printed wiring board Grant 7,489,521 - Kariya , et al. February 10, 2	2009-02-10
Multi-layer Printed Wiring Board Including An Alighment Mark As An Index For A Position Of Via Holes App 20090025216 - HIRAMATSU; Yasuji ; et al.	2009-01-29
Printed wiring board and method of manufacturing the same Grant 7,480,150 - Kariya , et al. January 20, 2	2009-01-20
Multilayer Printed Wiring Board App 20090000812 - KARIYA; Takashi	2009-01-01
Heat resistant substrate incorporated circuit wiring board Grant 7,462,784 - Kariya , et al. December 9, 2	2008-12-09
Multilayer printed circuit board Grant 7,435,910 - Sakamoto , et al. October 14, 2	2008-10-14
Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method App 20080201944 - SAKAMOTO; Hajime ; et al.	2008-08-28
Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method App 20080151517 - Sakamoto; Hajime ; et al.	2008-06-26
Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method App 20080151520 - Sakamoto; Hajime ; et al.	2008-06-26
Multi-layer printed wiring board including an alignment mark as an index for a position of via holes Grant 7,375,289 - Hiramatsu , et al. May 20, 2	2008-05-20
Printed Wiring Board And Method Of Manufacturing The Same App 20080104833 - KARIYA; Takashi ; et al.	2008-05-08
Method of fabricating crossing wiring pattern on a printed circuit board Grant 7,332,816 - Hirose , et al. February 19, 2	2008-02-19
Capacitor having adjustable capacitance, and printed wiring board having the same App 20080024953 - Sakamoto; Hajime ; et al.	2008-01-31
Package board integrated with power supply App 20080007925 - Kariya; Takashi ; et al.	2008-01-10
Multilayer Printed Wiring Board App 20070295532 - KARIYA; Takashi ; et al.	2007-12-27
Heat resistant substrate incorporated circuit wiring board App 20070256858 - Kariya; Takashi ; et al.	2007-11-08
Method Of Manufacturing Printed Wiring Board With Component Mounting Pin App 20070256297 - Kariya; Takashi ; et al.	2007-11-08
Inductor and electric power supply using it App 20070257761 - Mano; Yasuhiko ; et al.	2007-11-08
Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method App 20070227765 - SAKAMOTO; Hajime ; et al.	2007-10-04
Multilayer printed wiring board Grant 7,262,975 - Kariya , et al. August 28, 2	2007-08-28
Printed Board With A Pin For Mounting A Component App 20070190819 - Kariya; Takashi ; et al.	2007-08-16
Printed Wiring Board With A Pin For Mounting A Component And An Electronic Device Using It App 20070187140 - Kariya; Takashi ; et al.	2007-08-16
High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof App 20070134910 - Kariya; Takashi ; et al.	2007-06-14
Printed circuit board App 20070132088 - Kariya; Takashi ; et al.	2007-06-14
Printed Wiring Board And Method Of Manufacturing The Same App 20070105278 - Kariya; Takashi ; et al.	2007-05-10
Multilayer Printed Wiring Board App 20070085203 - Kariya; Takashi ; et al.	2007-04-19
Package substrate with built-in capacitor and manufacturing method thereof App 20060245139 - Kariya; Takashi	2006-11-02
Process for producing a multi-layer printed wiring board Grant 7,127,812 - Hiramatsu , et al. October 31, 2	2006-10-31
Multilayer printed wiring board App 20060237225 - Kariya; Takashi ; et al.	2006-10-26
Multilayer printed wiring board App 20060231290 - Kariya; Takashi ; et al.	2006-10-19
Interposer, and multilayer printed wiring board App 20060202322 - Kariya; Takashi ; et al.	2006-09-14
Multilayer printed wiring board and method of manufacturing the same App 20060180341 - Kariya; Takashi ; et al.	2006-08-17
Multilayer printed wiring board App 20060137905 - Kariya; Takashi ; et al.	2006-06-29
Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module Grant 7,049,528 - Kariya , et al. May 23, 2	2006-05-23
Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module App 20060076671 - Kariya; Takashi ; et al.	2006-04-13
Printed wiring board and manufacturing method of printed wiring board App 20050158553 - Hirose, Naohiro ; et al.	2005-07-21
Multilayer printed wiring board and method for producing multilayer printed wiring board Grant 6,909,054 - Sakamoto , et al. June 21, 2	2005-06-21
Method of manufacturing printed-circuit board Grant 6,889,433 - Enomoto , et al. May 10, 2	2005-05-10
Multilayer printed circuit board and multilayer printed circuit board manufacturing method App 20040168825 - Sakamoto, Hajime ; et al.	2004-09-02
Multilayer printed-circuit board and method of manufacture Grant 6,762,921 - Asai , et al. July 13, 2	2004-07-13
Process for producing a multi-layer printed wiring board App 20030192182 - Hiramatsu, Yasuji ; et al.	2003-10-16
Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module App 20030168254 - Kariya, Takashi ; et al.	2003-09-11
Method of manufacturing multilayer printed wiring board Grant 6,609,297 - Hiramatsu , et al. August 26, 2	2003-08-26
Multilayer printed-circuit board and semiconductor device Grant 6,534,723 - Asai , et al. March 18, 2	2003-03-18
Multilayer printed wiring board and method for producing multilayer printed wiring board App 20030015342 - Sakamoto, Hajime ; et al.	2003-01-23
Printed wiring board and manufacturing method of printed wiring board App 20020189849 - Hirose, Naohiro ; et al.	2002-12-19
Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same Grant 6,440,542 - Kariya August 27, 2	2002-08-27
Printed circuit board and method of production thereof Grant 6,407,345 - Hirose , et al. June 18, 2	2002-06-18
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Grant 6,376,049 - Asai , et al. April 23, 2	2002-04-23
Multilayer printed wiring board and its production process, resin composition for filling through-hole Grant 6,376,052 - Asai , et al. April 23, 2	2002-04-23
Cooling method and apparatus for hermetic type control box Grant 4,495,780 - Kaneko , et al. January 29, 1	1985-01-29
Derivatives Of 1,3-benzodioxole-2-carboxylic Acid Grant 3,872,105 - Grisar , et al. March 18, 1	1975-03-18
Compositions And Methods For Reducing Cholesterol In The Blood Grant 3,626,071 - Kariya , et al. December 7, 1	1971-12-07