Patent | Date |
---|
Static timing analysis of integrated circuit designs with flexible noise and delay models of circuit stages Grant 9,129,078 - Keller , et al. September 8, 2 | 2015-09-08 |
Static timing analysis methods for integrated circuit designs using a multi-CCC current source model Grant 8,966,421 - Kariat , et al. February 24, 2 | 2015-02-24 |
Method and apparatus for multi-die thermal analysis Grant 8,694,934 - Pramono , et al. April 8, 2 | 2014-04-08 |
Methods, systems, and apparatus for timing and signal integrity analysis of integrated circuits with semiconductor process variations Grant 8,631,369 - Kariat , et al. January 14, 2 | 2014-01-14 |
Flexible noise and delay modeling of circuit stages for static timing analysis of integrated circuit designs Grant 8,595,669 - Keller , et al. November 26, 2 | 2013-11-26 |
Method and apparatus for multi-die thermal analysis Grant 8,566,760 - Pramono , et al. October 22, 2 | 2013-10-22 |
Method and apparatus for thermal analysis of through-silicon via (TSV) Grant 8,543,952 - Kariat , et al. September 24, 2 | 2013-09-24 |
Concurrent noise and delay modeling of circuit stages for static timing analysis of integrated circuit designs Grant 8,543,954 - Keller , et al. September 24, 2 | 2013-09-24 |
Multi-CCC current source models and static timing analysis methods for integrated circuit designs Grant 8,533,644 - Kariat , et al. September 10, 2 | 2013-09-10 |
Sensitivity and static timing analysis for integrated circuit designs using a multi-CCC current source model Grant 8,516,420 - Kariat , et al. August 20, 2 | 2013-08-20 |
Method and apparatus for thermal analysis Grant 8,504,958 - Kariat , et al. August 6, 2 | 2013-08-06 |
Method And Apparatus For Multi-die Thermal Analysis App 20120304137 - Pramono; Eddy ;   et al. | 2012-11-29 |
Method And Apparatus For Multi-die Thermal Analysis App 20120297357 - Pramono; Eddy ;   et al. | 2012-11-22 |
Method And Apparatus For Thermal Analysis Of Through-silicon Via (tsv) App 20120210285 - Kariat; Vinod ;   et al. | 2012-08-16 |
Method and apparatus for multi-die thermal analysis Grant 8,201,113 - Pramono , et al. June 12, 2 | 2012-06-12 |
Method And Apparatus For Thermal Analysis App 20120102449 - Kariat; Vinod ;   et al. | 2012-04-26 |
Method and apparatus for thermal analysis Grant 8,104,007 - Kariat , et al. January 24, 2 | 2012-01-24 |
Method and apparatus for thermal analysis of through-silicon via (TSV) Grant 8,103,996 - Kariat , et al. January 24, 2 | 2012-01-24 |
Method and apparatus for thermal analysis Grant 8,104,006 - Kariat , et al. January 24, 2 | 2012-01-24 |
Method to produce an electrical model of an integrated circuit substrate and related system and article of manufacture Grant 7,900,166 - Kariat , et al. March 1, 2 | 2011-03-01 |
Timing and signal integrity analysis of integrated circuits with semiconductor process variations Grant 7,882,471 - Kariat , et al. February 1, 2 | 2011-02-01 |
Method and apparatus for substrate noise analysis using substrate tile model and tile grid Grant 7,877,713 - Kariat , et al. January 25, 2 | 2011-01-25 |
Method And Apparatus For Multi-die Thermal Analysis App 20100023903 - Pramono; Eddy ;   et al. | 2010-01-28 |
Method And Apparatus For Thermal Analysis Of Through-silicon Via (tsv) App 20090319965 - Kariat; Vinod ;   et al. | 2009-12-24 |
Method And Apparatus For Thermal Analysis App 20090319964 - Kariat; Vinod ;   et al. | 2009-12-24 |
Method And Apparatus For Thermal Analysis App 20090199140 - Kariat; Vinod ;   et al. | 2009-08-06 |
Method To Produce Substrate Noise Model And Related System And Article Of Manufacture App 20090006065 - KARIAT; Vinod ;   et al. | 2009-01-01 |
Method And Apparatus For Substrate Noise Analysis Using Substrate Tile Model And Tile Grid App 20090007032 - KARIAT; Vinod ;   et al. | 2009-01-01 |
Static noise analysis with noise window estimation and propagation Grant 6,836,873 - Tseng , et al. December 28, 2 | 2004-12-28 |