| Patent | Date |
|---|
Microelectronic Structures Including Bridges
App 20220270998 - Karhade; Omkar G. ; et al. | 2022-08-25 |
Methods of utilizing low temperature solder assisted mounting techniques for package structures
Grant 11,417,592 - Karhade , et al. August 16, 2 | 2022-08-16 |
Low Cost Package Warpage Solution
App 20220230892 - KARHADE; Omkar G. ; et al. | 2022-07-21 |
Microelectronic structures including bridges
Grant 11,373,972 - Karhade , et al. June 28, 2 | 2022-06-28 |
Microelectronic Structures Including Bridges
App 20220199480 - Karhade; Omkar G. ; et al. | 2022-06-23 |
Microelectronic Structures Including Bridges
App 20220199535 - Karhade; Omkar G. ; et al. | 2022-06-23 |
Microelectronic Structures Including Bridges
App 20220199539 - Karhade; Omkar G. ; et al. | 2022-06-23 |
Microelectronic Structures Including Bridges
App 20220199574 - Karhade; Omkar G. ; et al. | 2022-06-23 |
Microelectronic Structures Including Bridges
App 20220199536 - Karhade; Omkar G. ; et al. | 2022-06-23 |
Low cost package warpage solution
Grant 11,328,937 - Karhade , et al. May 10, 2 | 2022-05-10 |
Mold material architecture for package device structures
Grant 11,254,563 - Karhade , et al. February 22, 2 | 2022-02-22 |
Microelectronic Structures Including Bridges
App 20210391268 - Karhade; Omkar G. ; et al. | 2021-12-16 |
Warpage Control For Microelectronics Packages
App 20210391281 - LI; ERIC J. ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391263 - Nie; Bai ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391273 - Dubey; Manish ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391266 - Gamba; Jason M. ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391295 - Karhade; Omkar G. ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391264 - Nie; Bai ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391294 - Karhade; Omkar G. ; et al. | 2021-12-16 |
Methods Of Utilizing Low Temperature Solder Assisted Mounting Techniques For Package Structures
App 20210287974 - Karhade; Omkar G. ; et al. | 2021-09-16 |
Warpage control for microelectronics packages
Grant 11,114,388 - Li , et al. September 7, 2 | 2021-09-07 |
Microelectronic Package With Substrate Cavity For Bridge-attach
App 20210272905 - Karhade; Omkar G. ; et al. | 2021-09-02 |
Tunable Capacitor Arrangements In Integrated Circuit Package Substrates
App 20210066265 - Eid; Feras ; et al. | 2021-03-04 |
Low Cost Package Warpage Solution
App 20200350181 - KARHADE; Omkar G. ; et al. | 2020-11-05 |
Embedded multi-device bridge with through-bridge conductive via signal connection
Grant 10,797,000 - Deshpande , et al. October 6, 2 | 2020-10-06 |
Low cost package warpage solution
Grant 10,741,419 - Karhade , et al. A | 2020-08-11 |
Antenna Boards And Communication Devices
App 20200203839 - Karhade; Omkar G. ; et al. | 2020-06-25 |
Method and materials for warpage thermal and interconnect solutions
Grant 10,672,626 - Karhade , et al. | 2020-06-02 |
Low Cost Package Warpage Solution
App 20190341271 - KARHADE; Omkar G. ; et al. | 2019-11-07 |
Mold Material Architecture For Package Device Structures
App 20190330051 - Karhade; Omkar G. ; et al. | 2019-10-31 |
Integrated Circuit Packages With Plates
App 20190279960 - Karhade; Omkar G. ; et al. | 2019-09-12 |
Low cost package warpage solution
Grant 10,403,512 - Karhade , et al. Sep | 2019-09-03 |
Warpage Control For Microelectronics Packages
App 20190259713 - LI; ERIC J. ; et al. | 2019-08-22 |
Embedded Multi-device Bridge With Through-bridge Conductive Via Signal Connection
App 20190157205 - Deshpande; Nitin A. ; et al. | 2019-05-23 |
Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages
App 20190148268 - KARHADE; Omkar G. ; et al. | 2019-05-16 |
Thermal interfaces for integrated circuit packages
Grant 10,290,561 - Cetegen , et al. | 2019-05-14 |
Warpage control for microelectronics packages
Grant 10,256,198 - Li , et al. | 2019-04-09 |
Embedded multi-device bridge with through-bridge conductive via signal connection
Grant 10,229,882 - Deshpande , et al. | 2019-03-12 |
Underfill material flow control for reduced die-to-die spacing in semiconductor packages
Grant 10,192,810 - Karhade , et al. Ja | 2019-01-29 |
Component stiffener architectures for microelectronic package structures
Grant 10,157,860 - Karhade , et al. Dec | 2018-12-18 |
High bandwidth, low profile multi-die package
Grant 10,109,616 - Karhade October 23, 2 | 2018-10-23 |
Warpage Control For Microelectronics Packages
App 20180277492 - LI; ERIC J. ; et al. | 2018-09-27 |
Integrated circuit package with embedded bridge
Grant 10,068,852 - Mahajan , et al. September 4, 2 | 2018-09-04 |
Low Cost Package Warpage Solution
App 20180190510 - Karhade; Omkar G. ; et al. | 2018-07-05 |
High Bandwidth, Low Profile Multi-Die Package
App 20180182744 - Karhade; Omkar G. | 2018-06-28 |
Component Stiffener Architectures For Microelectronic Package Structures
App 20180182718 - Karhade; Omkar G. ; et al. | 2018-06-28 |
Thermal Interfaces For Integrated Circuit Packages
App 20180090411 - Cetegen; Edvin ; et al. | 2018-03-29 |
Low cost package warpage solution
Grant 9,899,238 - Karhade , et al. February 20, 2 | 2018-02-20 |
High density interconnection of microelectronic devices
Grant 9,842,832 - Karhade , et al. December 12, 2 | 2017-12-12 |
Embedded Multi-device Bridge With Through-bridge Conductive Via Signal Connection
App 20170330835 - Deshpande; Nitin A. ; et al. | 2017-11-16 |
Integrated Circuit Package With Embedded Bridge
App 20170301625 - Mahajan; Ravindranath V. ; et al. | 2017-10-19 |
Embedded multi-device bridge with through-bridge conductive via signal connection
Grant 9,754,890 - Deshpande , et al. September 5, 2 | 2017-09-05 |
Methods to form high density through-mold interconnections
Grant 9,741,692 - Karhade , et al. August 22, 2 | 2017-08-22 |
Integrated circuit package with embedded bridge
Grant 9,716,067 - Mahajan , et al. July 25, 2 | 2017-07-25 |
Novel Method And Materials For Warpage Thermal And Interconnect Solutions
App 20170200621 - KARHADE; Omkar G. ; et al. | 2017-07-13 |
Picture frame stiffeners for microelectronic packages
Grant 9,685,388 - Tomita , et al. June 20, 2 | 2017-06-20 |
Method and materials for warpage thermal and interconnect solutions
Grant 9,607,964 - Karhade , et al. March 28, 2 | 2017-03-28 |
Reliable microstrip routing for electronics components
Grant 9,607,947 - Karhade , et al. March 28, 2 | 2017-03-28 |
Picture Frame Stiffeners For Microelectronic Packages
App 20170040238 - Tomita; Yoshihiro ; et al. | 2017-02-09 |
Embedded Multi-device Bridge With Through-bridge Conductive Via Signal Connection
App 20160343666 - Deshpande; Nitin A. ; et al. | 2016-11-24 |
Picture frame stiffeners for microelectronic packages
Grant 9,502,368 - Tomita , et al. November 22, 2 | 2016-11-22 |
Reliable Microstrip Routing For Electronics Components
App 20160300796 - Karhade; Omkar G. ; et al. | 2016-10-13 |
High Density Interconnection Of Microelectronic Devices
App 20160300824 - Karhade; Omkar G. ; et al. | 2016-10-13 |
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks
App 20160268213 - JIANG; Hongjin ; et al. | 2016-09-15 |
Methods To Form High Density Through-mold Interconnections
App 20160268231 - Karhade; Omkar G. ; et al. | 2016-09-15 |
High density interconnection of microelectronic devices
Grant 9,397,071 - Karhade , et al. July 19, 2 | 2016-07-19 |
Reliable microstrip routing for electronics components
Grant 9,391,025 - Karhade , et al. July 12, 2 | 2016-07-12 |
Low Cost Package Warpage Solution
App 20160181218 - Karhade; Omkar G. ; et al. | 2016-06-23 |
Picture Frame Stiffeners For Microelectronic Packages
App 20160172323 - TOMITA; YOSHIHIRO ; et al. | 2016-06-16 |
Integrated Circuit Package With Embedded Bridge
App 20160155705 - Mahajan; Ravindranath V. ; et al. | 2016-06-02 |
Integrated circuit package with embedded bridge
Grant 9,275,955 - Mahajan , et al. March 1, 2 | 2016-03-01 |
Ultrathin Microelectronic Die Packages And Methods Of Fabricating The Same
App 20150318255 - KARHADE; OMKAR G. ; et al. | 2015-11-05 |
Novel Method And Materials For Warpage Thermal And Interconnect Solutions
App 20150279805 - KARHADE; Omkar G. ; et al. | 2015-10-01 |
Die-to-die Bonding And Associated Package Configurations
App 20150255411 - Karhade; Omkar G. ; et al. | 2015-09-10 |
Reliable Microstrip Routing For Electronics Components
App 20150228583 - Karhade; Omkar G. ; et al. | 2015-08-13 |
Integrated Circuit Package With Embedded Bridge
App 20150171015 - Mahajan; Ravindranath V. ; et al. | 2015-06-18 |
High Density Interconnection Of Microelectronic Devices
App 20150163904 - Karhade; Omkar G. ; et al. | 2015-06-11 |
Reliable microstrip routing for electronics components
Grant 9,041,205 - Karhade , et al. May 26, 2 | 2015-05-26 |
Reliable Microstrip Routing For Electronics Components
App 20150001733 - Karhade; Omkar G. ; et al. | 2015-01-01 |
Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages
App 20150001717 - Karhade; Omkar G. ; et al. | 2015-01-01 |
| 