Karecki; Simon M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Karecki; Simon M..The latest application filed is for "high density thermally matched contacting probe assembly and method for producing same".

Company Profile

0.5.6

Karecki; Simon M. - Brooklyn NY
Karecki; Simon M - Poughkeepsie NY
Karecki; Simon M. - Poughkeepsie NY
Karecki; Simon M. - late of Brooklyn NY
Karecki; Simon M. - late of Poughkeepsie NY
Karecki, Simon M. - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing thermally matched probe assembly Grant 7,546,670 - Dalton , et al. June 16, 2	2009-06-16
Method of forming closed air gap interconnects and structures formed thereby Grant 7,393,776 - Colburn , et al. July 1, 2	2008-07-01
Closed air gap interconnect structure Grant 7,361,991 - Saenger , et al. April 22, 2	2008-04-22
High density thermally matched contacting probe assembly and method for producing same App 20070257689 - Dalton; Timothy J. ; et al.	2007-11-08
Method of forming closed air gap interconnects and structures formed thereby App 20060267208 - Colburn; Matthew E. ; et al.	2006-11-30
Method of forming closed air gap interconnects and structures formed thereby App 20060258147 - Colburn; Matthew E. ; et al.	2006-11-16
Method of forming closed air gap interconnects and structures formed thereby App 20050062165 - Saenger, Katherine L. ; et al.	2005-03-24
Fine-pitch device lithography using a sacrificial hardmask Grant 6,734,096 - Dalton , et al. May 11, 2	2004-05-11
High density raised stud microjoining system and methods of fabricating the same Grant 6,732,908 - Furman , et al. May 11, 2	2004-05-11
High density raised stud microjoining system and methods of fabricating the same App 20030136814 - Furman, Bruce Kenneth ; et al.	2003-07-24
Fine-pitch device lithography using a sacrificial hardmask App 20030134505 - Dalton, Timothy J. ; et al.	2003-07-17

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