Karashima; Seiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Karashima; Seiji.The latest application filed is for "flip chip mounting method and bump forming method".

Company Profile

0.47.47

Karashima; Seiji - Osaka JP
Karashima; Seiji - Hirakata JP
Karashima; Seiji - Hirakata-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component assembly Grant 9,426,899 - Kitae , et al. August 23, 2	2016-08-23
Electrode structure and method for forming bump Grant 8,887,383 - Taniguchi , et al. November 18, 2	2014-11-18
Flip-chip mounting resin composition and bump forming resin composition Grant 8,709,293 - Kitae , et al. April 29, 2	2014-04-29
Flip-chip mounting method and bump formation method Grant 8,691,683 - Hirano , et al. April 8, 2	2014-04-08
Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates Grant 8,501,583 - Kitae , et al. August 6, 2	2013-08-06
Bump forming method using self-assembling resin and a wall surface Grant 8,297,488 - Karashima , et al. October 30, 2	2012-10-30
Flip chip mounting method and bump forming method Grant 8,283,246 - Kitae , et al. October 9, 2	2012-10-09
Flip chip connection structure having powder-like conductive substance and method of producing the same Grant 8,097,958 - Sawada , et al. January 17, 2	2012-01-17
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus Grant 8,071,425 - Nakatani , et al. December 6, 2	2011-12-06
Module with a built-in component, and electronic device with the same Grant 8,064,213 - Asahi , et al. November 22, 2	2011-11-22
Flip chip mounting process and flip chip assembly Grant 8,012,801 - Karashima , et al. September 6, 2	2011-09-06
Flip Chip Mounting Method And Bump Forming Method App 20110201195 - KITAE; Takashi ; et al.	2011-08-18
Flip-chip Mounting Method And Bump Formation Method App 20110162578 - Hirano; Koichi ; et al.	2011-07-07
Metal Particles-dispersed Composition And Flip Chip Mounting Process And Bump-forming Process Using The Same App 20110133137 - Hirano; Koichi ; et al.	2011-06-09
Flip chip mounting method and bump forming method Grant 7,951,700 - Kitae , et al. May 31, 2	2011-05-31
Flip-chip mounting method and bump formation method Grant 7,927,997 - Hirano , et al. April 19, 2	2011-04-19
Electronic component mounting method Grant 7,921,551 - Yamashita , et al. April 12, 2	2011-04-12
Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates Grant 7,919,357 - Sawada , et al. April 5, 2	2011-04-05
Mounted body and method for manufacturing the same Grant 7,911,064 - Komatsu , et al. March 22, 2	2011-03-22
Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same Grant 7,910,403 - Hirano , et al. March 22, 2	2011-03-22
Bump forming method and bump forming apparatus Grant 7,905,011 - Taniguchi , et al. March 15, 2	2011-03-15
Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body Grant 7,875,496 - Nakatani , et al. January 25, 2	2011-01-25
Flip chip mounting method and method for connecting substrates Grant 7,820,021 - Karashima , et al. October 26, 2	2010-10-26
Process for forming bumps and solder bump Grant 7,799,607 - Karashima , et al. September 21, 2	2010-09-21
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus App 20100203675 - NAKATANI; Seiichi ; et al.	2010-08-12
Flip chip mounting process and flip chip assembly Grant 7,759,162 - Karashima , et al. July 20, 2	2010-07-20
Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method Grant 7,754,529 - Tomita , et al. July 13, 2	2010-07-13
Method for producing connection member Grant 7,748,110 - Asahi , et al. July 6, 2	2010-07-06
Flip Chip Mounting Process And Flip Chip Assembly App 20100148376 - Karashima; Seiji ; et al.	2010-06-17
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus Grant 7,732,920 - Nakatani , et al. June 8, 2	2010-06-08
Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei Grant 7,726,545 - Ichiryu , et al. June 1, 2	2010-06-01
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same Grant 7,714,444 - Nakatani , et al. May 11, 2	2010-05-11
System-in-package optical transceiver in optical communication with a plurality of other system-in-package optical transceivers via an optical transmission line Grant 7,689,129 - Karashima , et al. March 30, 2	2010-03-30
Electrode Structure And Method For Forming Bump App 20100044091 - Taniguchi; Yasushi ; et al.	2010-02-25
Electronic Component Assembly, Electric Component With Solder Bump And Process For Producing The Same App 20100011572 - Kitae; Takashi ; et al.	2010-01-21
Package equipped with semiconductor chip and method for producing same Grant 7,649,267 - Shiraishi , et al. January 19, 2	2010-01-19
Method For Connecting Between Substrates, Flip-chip Mounting Structure, And Connection Structure Between Substrates App 20100007033 - KITAE; Takashi ; et al.	2010-01-14
Method For Mutually Connecting Substrates, Flip Chip Mounting Body, And Mutual Connection Structure Between Substrates App 20100001411 - SAWADA; Susumu ; et al.	2010-01-07
Method for forming conductive pattern and wiring board Grant 7,640,659 - Karashima , et al. January 5, 2	2010-01-05
Electronic component transporting method Grant 7,640,654 - Nakatani , et al. January 5, 2	2010-01-05
Flip chip mounting method and bump forming method Grant 7,638,883 - Karashima , et al. December 29, 2	2009-12-29
Bump Forming Method And Bump Forming Apparatus App 20090229120 - Taniguchi; Yasushi ; et al.	2009-09-17
Mounted Body And Method For Manufacturing The Same App 20090230546 - Komatsu; Shingo ; et al.	2009-09-17
Electronic Component Mounting Method and Electronic Circuit Device App 20090223705 - Yamashita; Yoshihisa ; et al.	2009-09-10
Flip Chip Mounting Body And Method For Mounting Such Flip Chip Mounting Body And Bump Forming Method App 20090203169 - Tomita; Yoshihiro ; et al.	2009-08-13
Flip Chip Mounting Method, Flip Chip Mounting Apparatus And Flip Chip Mounting Body App 20090203170 - Nakatani; Seiichi ; et al.	2009-08-13
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same App 20090200522 - NAKATANI; Seiichi ; et al.	2009-08-13
Method For Forming Conductive Pattern And Wiring Board App 20090133901 - Karashima; Seiji ; et al.	2009-05-28
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same Grant 7,537,961 - Nakatani , et al. May 26, 2	2009-05-26
Flip chip mounting method and method for connecting substrates App 20090126876 - Karashima; Seiji ; et al.	2009-05-21
Flip chip mounting method and bump forming method Grant 7,531,387 - Karashima , et al. May 12, 2	2009-05-12
Flip chip mounting method and method for connecting substrates Grant 7,531,385 - Karashima , et al. May 12, 2	2009-05-12
Flexible substrate having interlaminar junctions, and process for producing the same Grant 7,531,754 - Yamashita , et al. May 12, 2	2009-05-12
Flip Chip Mounting Method And Method For Connecting Substrates App 20090115071 - Karashima; Seiji ; et al.	2009-05-07
Flip Chip Mounting Method And Bump Forming Method App 20090117688 - Karashima; Seiji ; et al.	2009-05-07
Connection Structure And Method Of Producing The Same App 20090102064 - Sawada; Susumu ; et al.	2009-04-23
Portable information terminal apparatus Grant 7,522,938 - Tomita , et al. April 21, 2	2009-04-21
Flip-chip Mounting Body And Flip-chip Mounting Method App 20090085227 - Shiraishi; Tsukasa ; et al.	2009-04-02
Bump Forming Method And Bump Forming Apparatus App 20090078746 - Karashima; Seiji ; et al.	2009-03-26
Flip Chip Mounting Method And Bump Forming Method App 20090023245 - Kitae; Takashi ; et al.	2009-01-22
Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method App 20090008776 - Kitae; Takashi ; et al.	2009-01-08
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus App 20090008800 - Nakatani; Seiichi ; et al.	2009-01-08
Flip chip mounting method and bump forming method App 20080284046 - Karashima; Seiji ; et al.	2008-11-20
Package Equipped with Semiconductor Chip and Method for Producing Same App 20080265437 - Shiraishi; Tsukasa ; et al.	2008-10-30
Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles App 20080165518 - Ichiryu; Takashi ; et al.	2008-07-10
Metal Particles-Dispersed Composition and Flip Chip Mounting Process and Bump-Forming Process Using the Same App 20080142966 - Hirano; Koichi ; et al.	2008-06-19
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composition App 20080128664 - Kitae; Takashi ; et al.	2008-06-05
Connection member and mount assembly and production method of the same App 20080047137 - Asahi; Toshiyuki ; et al.	2008-02-28
Flip Chip Mounting Process and Flip Chip Assembly App 20080017995 - Karashima; Seiji ; et al.	2008-01-24
Process for Forming Bumps and Solder Bump App 20070257362 - Karashima; Seiji ; et al.	2007-11-08
Flip-Chip Mounting Method and Bump Formation Method App 20070243664 - Hirano; Koichi ; et al.	2007-10-18
Optical Transmission Channel Board, Board With Built-in Optical Transmission Channel, And Data Processing Apparatus App 20070224735 - Karashima; Seiji ; et al.	2007-09-27
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same App 20070216023 - Nakatani; Seiichi ; et al.	2007-09-20
Connection member and mount assembly and production method of the same Grant 7,258,549 - Asahi , et al. August 21, 2	2007-08-21
Electronic component transporting method App 20070175024 - Nakatani; Seiichi ; et al.	2007-08-02
Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus Grant 7,242,823 - Karashima , et al. July 10, 2	2007-07-10
Flexible substrate having interlaminar junctions, and process for producing the same App 20070151756 - Yamashita; Yoshihisa ; et al.	2007-07-05
Flexible substrate having interlaminar junctions, and process for producing the same Grant 7,205,483 - Yamashita , et al. April 17, 2	2007-04-17
Portable device Grant 7,184,617 - Korenaga , et al. February 27, 2	2007-02-27
Mount assembly, optical transmission line and photoelectric circuit board Grant 7,136,543 - Nishiyama , et al. November 14, 2	2006-11-14
Semiconductor module, process for producing the same, and film interposer App 20060091524 - Karashima; Seiji ; et al.	2006-05-04
Multiprocessor App 20060036831 - Karashima; Seiji ; et al.	2006-02-16
Portable information terminal apparatus App 20050281555 - Tomita, Yoshihiro ; et al.	2005-12-22
Flexible substrate having interlaminar junctions, and process for producing the same App 20050205291 - Yamashita, Yoshihisa ; et al.	2005-09-22
Portable device App 20050201693 - Korenaga, Tsuguhiro ; et al.	2005-09-15
Fabrication method for optical transmission channel board, optical transmission channel board, board with built-in optical transmission channel, fabrication method for board with built-in optical transmission channel, and data processing apparatus App 20050196095 - Karashima, Seiji ; et al.	2005-09-08
Connection member and mount assembly and production method of the same App 20050184381 - Asahi, Toshiyuki ; et al.	2005-08-25
Module with a built-in component, and electronic device with the same App 20050168960 - Asahi, Toshiyuki ; et al.	2005-08-04
Mount assembly, optical transmission line and photoelectric circuit board App 20050002608 - Nishiyama, Tousaku ; et al.	2005-01-06