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Patent applications and USPTO patent grants for KARASAWA; Yusuke.The latest application filed is for "multilayer capacitor".
Patent | Date |
---|---|
Multilayer Capacitor App 20220238279 - ONOUE; Toru ;   et al. | 2022-07-28 |
Wiring Board App 20220053648 - NAKAMURA; Junichi ;   et al. | 2022-02-17 |
Method of manufacturing wiring substrate Grant 10,811,348 - Kobayashi , et al. October 20, 2 | 2020-10-20 |
Method Of Manufacturing Wiring Substrate App 20180151486 - KOBAYASHI; Kazuhiro ;   et al. | 2018-05-31 |
Interconnection substrate and method of inspecting interconnection substrate Grant 9,974,162 - Obinata , et al. May 15, 2 | 2018-05-15 |
Interconnection Substrate And Method Of Inspecting Interconnection Substrate App 20170273175 - OBINATA; Tsukasa ;   et al. | 2017-09-21 |
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