Karasawa; Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Karasawa; Jun.The latest application filed is for "semiconductor device".

Company Profile

1.8.14

Karasawa; Jun - Shinagawa JP
Karasawa; Jun - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power module Grant 11,410,914 - Matsuo , et al. August 9, 2	2022-08-09
Semiconductor device Grant 11,289,408 - Yamaguchi , et al. March 29, 2	2022-03-29
Semiconductor Device App 20210090976 - YAMAGUCHI; Kakeru ; et al.	2021-03-25
Power Module App 20210090974 - MATSUO; Keiichiro ; et al.	2021-03-25
Thermoelectric device and thermoelectric module Grant 8,895,833 - Ukita , et al. November 25, 2	2014-11-25
Thermoelectric module and power generation apparatus Grant 8,648,246 - Ohmura , et al. February 11, 2	2014-02-11
Thermoelectric Module And Power Generation Apparatus App 20110247670 - OHMURA; Mio ; et al.	2011-10-13
Thermoelectric Device And Thermoelectric Module App 20110139206 - UKITA; Yasunari ; et al.	2011-06-16
Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device Grant 7,872,874 - Karasawa , et al. January 18, 2	2011-01-18
Printed Wiring Board, Printed Circuit Board, And Electronic Device App 20080156521 - Karasawa; Jun ; et al.	2008-07-03
Method Of Inspecting Printed Wiring Board And Printed Wiring Board App 20080149382 - Karasawa; Jun ; et al.	2008-06-26
Multilayered Printed-wiring Board And Inter-layer Connecting Method Thereof App 20080121422 - Karasawa; Jun ; et al.	2008-05-29
Printed wiring board, its manufacturing method, and electronic equipment App 20070277998 - Suzuki; Daigo ; et al.	2007-12-06
Component-embedded printed wiring board, manufacturing method for component-embedded printed wiring board, and electronic apparatus App 20070278000 - Suzuki; Daigo ; et al.	2007-12-06
Printed wiring board, its bending method, and electronic apparatus App 20070281499 - Muro; Kiyomi ; et al.	2007-12-06
Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus Grant 7,304,684 - Segawa , et al. December 4, 2	2007-12-04
Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device App 20070230146 - Suzuki; Daigo ; et al.	2007-10-04
Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device App 20070221398 - Karasawa; Jun ; et al.	2007-09-27
Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device App 20070200232 - Suzuki; Daigo ; et al.	2007-08-30
Image pickup apparatus, method thereof, and electric apparatus App 20020057468 - Segawa, Masao ; et al.	2002-05-16

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