loadpatents
name:-0.025779962539673
name:-0.017877101898193
name:-0.0018889904022217
Karasawa; Hajime Patent Filings

Karasawa; Hajime

Patent Applications and Registrations

Patent applications and USPTO patent grants for Karasawa; Hajime.The latest application filed is for "method of manufacturing semiconductor device, substrate processing apparatus, and recording medium".

Company Profile
2.25.23
  • Karasawa; Hajime - Toyama JP
  • KARASAWA; Hajime - Toyama-shi JP
  • Karasawa; Hajime - Tokyo JP
  • Karasawa; Hajime - Sagamihara JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
Grant 10,720,324 - Nakatani , et al.
2020-07-21
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
Grant 10,199,219 - Shimamoto , et al. Fe
2019-02-05
Method Of Manufacturing Semiconductor Device, Substrate Processing Apparatus, And Recording Medium
App 20180363138 - NAKATANI; Kimihiko ;   et al.
2018-12-20
Method of manufacturing semiconductor device
Grant 10,032,630 - Yamamoto , et al. July 24, 2
2018-07-24
Substrate processing apparatus for forming film including at least two different elements
Grant 10,026,607 - Takasawa , et al. July 17, 2
2018-07-17
Method Of Manufacturing Semiconductor Device, Substrate Processing Apparatus, And Recording Medium
App 20180033607 - NAKATANI; Kimihiko ;   et al.
2018-02-01
Method Of Manufacturing Semiconductor Device, Substrate Processing Apparatus, And Recording Medium
App 20170365467 - SHIMAMOTO; Satoshi ;   et al.
2017-12-21
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus For Forming Film Including At Least Two Different Elements
App 20170200599 - TAKASAWA; Yushin ;   et al.
2017-07-13
Substrate Processing Apparatus For Forming Film Including At Least Two Different Elements
App 20160329208 - TAKASAWA; Yushin ;   et al.
2016-11-10
Substrate processing apparatus capable of forming films including at least two different elements
Grant 9,487,861 - Takasawa , et al. November 8, 2
2016-11-08
Method of manufacturing semiconductor device for forming film including at least two different elements
Grant 9,478,417 - Takasawa , et al. October 25, 2
2016-10-25
Subtrate Processing Apparatus Capable Forming Film Including At Least Two Different Elements
App 20160298236 - TAKASAWA; Yushin ;   et al.
2016-10-13
Method of manufacturing semiconductor device for forming film including at least two different elements
Grant 9,443,720 - Takasawa , et al. September 13, 2
2016-09-13
Method of manufacturing semiconductor device for forming film including at least two different elements
Grant 9,443,719 - Takasawa , et al. September 13, 2
2016-09-13
Method Of Manufacturing Semiconductor Device
App 20160211132 - TAKASAWA; Yushin ;   et al.
2016-07-21
Method Of Manufacturing Semiconductor Device
App 20160211134 - TAKASAWA; Yushin ;   et al.
2016-07-21
Method Of Manufacturing Semiconductor Device
App 20160211133 - TAKASAWA; Yushin ;   et al.
2016-07-21
Method and apparatus of manufacturing a semiconductor device by forming a film on a substrate
Grant 9,385,013 - Takasawa , et al. July 5, 2
2016-07-05
Method of manufacturing semiconductor device by forming a film on a substrate
Grant 9,384,970 - Takasawa , et al. July 5, 2
2016-07-05
Method of manufacturing a semiconductor device by forming a film on a substrate
Grant 9,384,967 - Takasawa , et al. July 5, 2
2016-07-05
Method of manufacturing semiconductor device by forming a film on a substrate
Grant 9,384,971 - Takasawa , et al. July 5, 2
2016-07-05
Method of manufacturing a semiconductor device by forming a film on a substrate
Grant 9,384,966 - Takasawa , et al. July 5, 2
2016-07-05
Method of manufacturing semiconductor device by forming a film on a substrate
Grant 9,384,969 - Takasawa , et al. July 5, 2
2016-07-05
Method of manufacturing semiconductor device by forming a film on a substrate
Grant 9,384,972 - Takasawa , et al. July 5, 2
2016-07-05
Method of manufacturing a semiconductor device by forming a film on a substrate
Grant 9,384,968 - Takasawa , et al. July 5, 2
2016-07-05
Method and Apparatus of Manufacturing a Semiconductor Device by Forming a Film on a Substrate
App 20160148824 - TAKASAWA; Yushin ;   et al.
2016-05-26
Method of manufacturing semiconductor device and substrate processing apparatus
Grant 9,330,904 - Takasawa , et al. May 3, 2
2016-05-03
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elements
Grant 9,318,316 - Takasawa , et al. April 19, 2
2016-04-19
Method of manufacturing semiconductor device and substrate processing apparatus
Grant 9,312,123 - Takasawa , et al. April 12, 2
2016-04-12
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150371843 - TAKASAWA; Yushin ;   et al.
2015-12-24
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150221495 - TAKASAWA; Yushin ;   et al.
2015-08-06
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150214024 - TAKASAWA; Yushin ;   et al.
2015-07-30
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150214032 - TAKASAWA; Yushin ;   et al.
2015-07-30
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150214034 - TAKASAWA; Yushin ;   et al.
2015-07-30
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150214031 - TAKASAWA; Yushin ;   et al.
2015-07-30
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150214033 - TAKASAWA; Yushin ;   et al.
2015-07-30
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150206742 - TAKASAWA; Yushin ;   et al.
2015-07-23
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20150206737 - TAKASAWA; Yushin ;   et al.
2015-07-23
Method of manufacturing semiconductor device and substrate processing apparatus
Grant 8,409,988 - Takasawa , et al. April 2, 2
2013-04-02
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20110294280 - TAKASAWA; Yushin ;   et al.
2011-12-01
Method Of Manufacturing Semiconductor Device And Substrate Processing Apparatus
App 20100130024 - TAKASAWA; Yushin ;   et al.
2010-05-27
Semiconductor device manufacturing method and semiconductor manufacturing apparatus
Grant 6,943,089 - Takasawa , et al. September 13, 2
2005-09-13
Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatus
Grant 6,821,871 - Nomura , et al. November 23, 2
2004-11-23
Semiconductor device manufacturing method and semiconductor manufacturing apparatus
App 20020025651 - Takasawa, Yushin ;   et al.
2002-02-28
Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatus
App 20020016051 - Nomura, Hisashi ;   et al.
2002-02-07
Method for conflict detection in parallel processing system
Grant 5,473,774 - Childers , et al. December 5, 1
1995-12-05

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