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Patent applications and USPTO patent grants for Karasawa; Fumiaki.The latest application filed is for "stress sensor and assembly method thereof".
Patent | Date |
---|---|
Stress sensor and assembly method thereof Grant 8,146,440 - Lin , et al. April 3, 2 | 2012-04-03 |
Stress Sensor and Assembly Method Thereof App 20110000305 - Lin; Chun-Hua ;   et al. | 2011-01-06 |
Input Device And Its Manufacturing Method App 20090265927 - YAJIMA; Hiroshi ;   et al. | 2009-10-29 |
Input device and its manufacturing method App 20090100670 - Yajima; Hiroshi ;   et al. | 2009-04-23 |
Resistor element, stress sensor, and method for manufacturing them Grant 7,262,682 - Ooba , et al. August 28, 2 | 2007-08-28 |
Input device and its manufacturing method App 20070008281 - Yajima; Hiroshi ;   et al. | 2007-01-11 |
Resistor element, stress sensor and method for manufacturing them Grant 7,151,431 - Ooba , et al. December 19, 2 | 2006-12-19 |
Method of manufacturing a wiring board Grant 7,135,204 - Karasawa November 14, 2 | 2006-11-14 |
Resistor element, stress sensor, and method for manufacturing them App 20060218779 - Ooba; Etsuo ;   et al. | 2006-10-05 |
Semiconductor device, method of manufacturing the same, circuit board and electronic apparatus Grant 7,037,758 - Karasawa , et al. May 2, 2 | 2006-05-02 |
Stress sensor for electronic devices Grant 6,993,982 - Karasawa , et al. February 7, 2 | 2006-02-07 |
Resistor element, stress sensor and method for manufacturing them App 20050050959 - Ooba, Etsuo ;   et al. | 2005-03-10 |
Semiconductor device, method of manufacturing the same, circuit board and electronic apparatus App 20040180549 - Karasawa, Fumiaki ;   et al. | 2004-09-16 |
Wiring board, method of manufacturing the same, semiconductor device, electronic module, and electronic apparatus App 20040172819 - Karasawa, Fumiaki | 2004-09-09 |
Input device and its manufacturing method App 20040145577 - Yajima, Hiroshi ;   et al. | 2004-07-29 |
Stress sensor App 20040123676 - Karasawa, Fumiaki ;   et al. | 2004-07-01 |
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