KARASAHIN; Sengul
Patent Applications and Registrations
Patent applications and USPTO patent grants for KARASAHIN; Sengul.The latest application filed is for "method for depositing a copper seed layer onto a barrier layer and copper plating bath".
- KARASAHIN; Sengul - Berlin DE
| Patent | Date |
|---|---|
| Method For Depositing A Copper Seed Layer Onto A Barrier Layer And Copper Plating Bath App 20190024239 - DAMMASCH; Matthias ; et al. | 2019-01-24 |
| Method for depositing a copper seed layer onto a barrier layer and copper plating bath Grant 10,077,498 - Dammasch , et al. September 18, 2 | 2018-09-18 |
| Plating bath compositions for electroless plating of metals and metal alloys Grant 9,909,216 - Brunner , et al. March 6, 2 | 2018-03-06 |
| Plating Bath Compositions For Electroless Plating Of Metals And Metal Alloys App 20170327954 - BRUNNER; Heiko ; et al. | 2017-11-16 |
| Method For Depositing A Copper Seed Layer Onto A Barrier Layer And Copper Plating Bath App 20160194760 - DAMMASCH; Matthias ; et al. | 2016-07-07 |
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