| Patent | Date |
|---|
Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method
Grant 10,615,072 - Kar-Roy , et al. | 2020-04-07 |
Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method
Grant 10,615,071 - Kar-Roy , et al. | 2020-04-07 |
Structure Having Isolated Deep Substrate Vias With Decreased Pitch And Increased Aspect Ratio And Related Method
App 20180247856 - Kar-Roy; Arjun ; et al. | 2018-08-30 |
Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method
Grant 9,887,123 - Kar-Roy , et al. February 6, 2 | 2018-02-06 |
Structure Having Isolated Deep Substrate Vias With Decreased Pitch And Increased Aspect Ratio And Related Method
App 20170330789 - Kar-Roy; Arjun ; et al. | 2017-11-16 |
Scalable self-supported MEMS structure and related method
Grant 9,458,011 - Howard , et al. October 4, 2 | 2016-10-04 |
Light sensor with chemically resistant and robust reflector stack
Grant 9,377,350 - Howard , et al. June 28, 2 | 2016-06-28 |
Robust MEMS structure with via cap and related method
Grant 9,346,669 - Howard , et al. May 24, 2 | 2016-05-24 |
Structure Having Isolated Deep Substrate Vias with Decreased Pitch and Increased Aspect Ratio and Related Method
App 20160118339 - Kar-Roy; Arjun ; et al. | 2016-04-28 |
Light Sensor with Chemically Resistant and Robust Reflector Stack
App 20160069739 - Howard; David J. ; et al. | 2016-03-10 |
Scalable Self-Supported MEMS Structure and Related Method
App 20150368092 - Howard; David J. ; et al. | 2015-12-24 |
Robust MEMS Structure with Via Cap and Related Method
App 20150368094 - Howard; David J. ; et al. | 2015-12-24 |
Deep N wells in triple well structures
Grant 9,136,157 - Kar-Roy , et al. September 15, 2 | 2015-09-15 |
Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
Grant 9,105,681 - Blaschke , et al. August 11, 2 | 2015-08-11 |
Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
Grant 8,598,713 - Blaschke , et al. December 3, 2 | 2013-12-03 |
Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
App 20130109176 - Blaschke; Volker ; et al. | 2013-05-02 |
Method for fabricating a backside through-wafer via in a processed wafer and related structure
Grant 8,212,331 - Kar-Roy , et al. July 3, 2 | 2012-07-03 |
Self-planarized passivation dielectric for liquid crystal on silicon structure and related method
Grant 8,098,351 - Kar-Roy January 17, 2 | 2012-01-17 |
Fabricating a top conductive layer in a semiconductor die
Grant 7,897,484 - Kar-Roy , et al. March 1, 2 | 2011-03-01 |
Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
App 20110018109 - Blaschke; Volker ; et al. | 2011-01-27 |
Deep trench isolation and method for forming same
Grant 7,772,673 - Yin , et al. August 10, 2 | 2010-08-10 |
Method for fabricating a frontside through-wafer via in a processed wafer and related structure
Grant 7,704,874 - Kar-Roy , et al. April 27, 2 | 2010-04-27 |
Fabricating a Top Conductive Layer in a Semiconductor Die
App 20090298285 - Kar-Roy; Arjun ; et al. | 2009-12-03 |
Method for fabricating a top conductive layer in a semiconductor die and related structure
Grant 7,589,009 - Kar-Roy , et al. September 15, 2 | 2009-09-15 |
Self-planarized passivation dielectric for liquid crystal on silicon structure and related method
App 20090128768 - Kar-Roy; Arjun | 2009-05-21 |
Method for fabricating a high density composite MIM capacitor with flexible routing in semiconductor dies
Grant 7,078,310 - Kar-Roy , et al. July 18, 2 | 2006-07-18 |
Deep N wells in triple well structures and method for fabricating same
Grant 7,052,966 - Kar-Roy , et al. May 30, 2 | 2006-05-30 |
Method for fabricating a high density composite MIM capacitor with reduced voltage dependence in semiconductor dies
Grant 7,041,569 - Kar-Roy , et al. May 9, 2 | 2006-05-09 |
Method for fabricating a metal resistor in an IC chip and related structure
Grant 6,943,414 - Kar Roy , et al. September 13, 2 | 2005-09-13 |
Deep N wells in triple well structures and method for fabricating same
App 20040201065 - Kar-Roy, Arjun ; et al. | 2004-10-14 |
High density composite MIM capacitor with flexible routing in semiconductor dies
Grant 6,777,777 - Kar-Roy , et al. August 17, 2 | 2004-08-17 |
High density composite MIM capacitor with reduced voltage dependence in semiconductor dies
Grant 6,680,521 - Kar-Roy , et al. January 20, 2 | 2004-01-20 |
Method for fabricating a metal resistor in an IC chip and related structure
App 20020132442 - Kar Roy, Arjun ; et al. | 2002-09-19 |
Method for fabrication of an MIM capacitor and related structure
Grant 6,430,028 - Kar-Roy , et al. August 6, 2 | 2002-08-06 |
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