Kapusta; Christopher James

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kapusta; Christopher James.The latest application filed is for "mechanical punched via formation in electronics package and electronics package formed thereby".

Company Profile

35.75.79

Kapusta; Christopher James - Delanson NY
Kapusta; Christopher James - Niskayuna NY
Kapusta; Christopher James - Schenectady NY
Kapusta; Christopher James - Duanesburg NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mechanical Punched Via Formation In Electronics Package And Electronics Package Formed Thereby App 20220302063 - Kapusta; Christopher James ; et al.	2022-09-22
Mechanical punched via formation in electronics package and electronics package formed thereby Grant 11,398,445 - Kapusta , et al. July 26, 2	2022-07-26
Stackable electronic package and method of fabricating same Grant 11,309,304 - Sabatini , et al. April 19, 2	2022-04-19
Power Overlay Module And Method Of Assembling App 20220070996 - Esler; David Richard ; et al.	2022-03-03
Mechanical Punched Via Formation In Electronics Package And Electronics Package Formed Thereby App 20210375813 - Kapusta; Christopher James ; et al.	2021-12-02
Sensor System And Method App 20210325348 - Iannotti; Joseph Alfred ; et al.	2021-10-21
Sensor system and method Grant 11,079,359 - Iannotti , et al. August 3, 2	2021-08-03
Systems And Methods For Hybrid Glass And Organic Packaging For Radio Frequency Electronics App 20210204397 - Kapusta; Christopher James ; et al.	2021-07-01
Systems And Methods For Antenna Packaging For A Wireless Access Point App 20210104812 - Kapusta; Christopher James ; et al.	2021-04-08
Electronics package for light emitting semiconductor devices and method of manufacturing thereof Grant 10,957,832 - Kapusta , et al. March 23, 2	2021-03-23
Systems And Methods For Piston Rod Monitoring App 20210017979 - Iannotti; Joseph Alfred ; et al.	2021-01-21
Systems And Methods For Saw Wafer Level Assembly With Top Side Contacts App 20210013866 - Iannotti; Joseph Alfred ; et al.	2021-01-14
Methods of fabricating high voltage semiconductor devices having improved electric field suppression Grant 10,892,237 - Arthur , et al. January 12, 2	2021-01-12
Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof Grant 10,892,231 - Kapusta , et al. January 12, 2	2021-01-12
Electronics package with integrated interconnect structure and method of manufacturing thereof Grant 10,804,115 - Kapusta , et al. October 13, 2	2020-10-13
Non-magnetic package and method of manufacture Grant 10,804,174 - Kapusta , et al. October 13, 2	2020-10-13
Electronics package with integrated interconnect structure and method of manufacturing thereof Grant 10,804,116 - Kapusta , et al. October 13, 2	2020-10-13
True time delay beam former module and method of making the same Grant 10,784,576 - Iannotti , et al. Sept	2020-09-22
Low inductance stackable solid-state switching module and method of manufacturing thereof Grant 10,770,382 - Kapusta , et al. Sep	2020-09-08
Methods Of Fabricating High Voltage Semiconductor Devices Having Improved Electric Field Suppression App 20200194388 - Arthur; Stephen Daley ; et al.	2020-06-18
High Voltage Semiconductor Devices Having Improved Electric Field Uppression App 20200194387 - Arthur; Stephen Daley ; et al.	2020-06-18
Low Inductance Stackable Solid-state Switching Module And Method Of Manufacturing Thereof App 20200176360 - Kapusta; Christopher James ; et al.	2020-06-04
Embedded dry film battery module and method of manufacturing thereof Grant 10,660,208 - Kapusta , et al.	2020-05-19
Electronics Package For Light Emitting Semiconductor Devices And Method Of Manufacturing Thereof App 20200127178 - Kapusta; Christopher James ; et al.	2020-04-23
Sensor System And Method App 20200124573 - Iannotti; Joseph Alfred ; et al.	2020-04-23
Electronics package having a self-aligning interconnect assembly and method of making same Grant 10,607,929 - Kapusta , et al.	2020-03-31
Sensor system and method Grant 10,605,785 - Iannotti , et al.	2020-03-31
Electronics Package With Integrated Interconnect Structure And Method Of Manufacturing Thereof App 20200066544 - Kapusta; Christopher James ; et al.	2020-02-27
Electronics Package Including Integrated Electromagnetic Interference Shield And Method Of Manufacturing Thereof App 20200066652 - Kapusta; Christopher James ; et al.	2020-02-27
Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof Grant 10,541,209 - Kapusta , et al. Ja	2020-01-21
Electronics package with integrated interconnect structure and method of manufacturing thereof Grant 10,541,153 - Kapusta , et al. Ja	2020-01-21
Stackable electronic package and method of fabricating same Grant RE47,651 - Sabatini , et al. Oc	2019-10-15
Systems and methods for quartz wafer bonding Grant 10,432,168 - Kapusta , et al. O	2019-10-01
Non-magnetic package and method of manufacture Grant 10,431,509 - Kapusta , et al. O	2019-10-01
Embedded RF filter package structure and method of manufacturing thereof Grant 10,333,493 - Nagarkar , et al.	2019-06-25
Method of manufacturing an electronics package using device-last or device-almost last placement Grant 10,332,832 - Kapusta , et al.	2019-06-25
Electronics Package Having A Self-aligning Interconnect Assembly And Method Of Making Same App 20190148279 - Kapusta; Christopher James ; et al.	2019-05-16
True Time Delay Beam Former Module And Method Of Making The Same App 20190115658 - Iannotti; Joseph Alfred ; et al.	2019-04-18
Non-magnetic Package And Method Of Manufacture App 20190103331 - Kapusta; Christopher James ; et al.	2019-04-04
Method for making a seam-sealable non-magnetic lid and package Grant 10,208,382 - Kapusta , et al. Feb	2019-02-19
Electronics Package Including Integrated Structure With Backside Functionality And Method Of Manufacturing Thereof App 20190043794 - Kapusta; Christopher James ; et al.	2019-02-07
Electronics Package Including Integrated Electromagnetic Interference Shield And Method Of Manufacturing Thereof App 20190043810 - Kapusta; Christopher James ; et al.	2019-02-07
Electronics Package With Integrated Interconnect Structure And Method Of Manufacturing Thereof App 20190043733 - Kapusta; Christopher James ; et al.	2019-02-07
Electronics Package With Integrated Interconnect Structure And Method Of Manufacturing Thereof App 20190043734 - Kapusta; Christopher James ; et al.	2019-02-07
Method Of Manufacturing An Electronics Package Using Device-last Or Device-almost Last Placement App 20190043802 - Kapusta; Christopher James ; et al.	2019-02-07
Electronics package having a self-aligning interconnect assembly and method of making same Grant 10,163,773 - Kapusta , et al. Dec	2018-12-25
Sensor System And Method App 20180356368 - Iannotti; Joseph ; et al.	2018-12-13
Stackable Electronic Package And Method Of Fabricating Same App 20180240789 - Sabatini; James ; et al.	2018-08-23
Stackable electronics package and method of fabricating same Grant 10,014,286 - Sabatini , et al. July 3, 2	2018-07-03
Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same Grant 9,954,263 - Lee , et al. April 24, 2	2018-04-24
Embedded Rf Filter Package Structure And Method Of Manufacturing Thereof App 20180062618 - Nagarkar; Kaustubh Ravindra ; et al.	2018-03-01
Embedded Dry Film Battery Module And Method Of Manufacturing Thereof App 20180020548 - Kapusta; Christopher James ; et al.	2018-01-18
Pulse oximetry devices and systems and methods of making the same Grant 9,814,419 - Karp , et al. November 14, 2	2017-11-14
Radio frequency die package with inverted ground plane and method of making same Grant 9,806,390 - Lee , et al. October 31, 2	2017-10-31
Method For Making A Seam-sealable Non-magnetic Lid And Package App 20170191167 - Kapusta; Christopher James ; et al.	2017-07-06
Radio Frequency Die Package With Inverted Ground Plane And Method Of Making Same App 20170155179 - Lee; Yongjae ; et al.	2017-06-01
Electronic packages and methods of making and using the same Grant 9,666,516 - Smith , et al. May 30, 2	2017-05-30
Flexible embedded sensor arrays and methods of making the same Grant 9,642,566 - Kapusta , et al. May 9, 2	2017-05-09
Radio Frequency Micro-electromechanical Systems Having Inverted Microstrip Transmission Lines And Method Of Making The Same App 20170062889 - Lee; Yongjae ; et al.	2017-03-02
Radio Frequency Micro-electromechanical Systems Having Inverted Microstrip Transmission Lines And Method Of Making The Same App 20170062890 - Lee; Yongjae ; et al.	2017-03-02
Systems And Methods For Quartz Wafer Bonding App 20170063326 - Kapusta; Christopher James ; et al.	2017-03-02
Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same Grant 9,570,783 - Lee , et al. February 14, 2	2017-02-14
Method And System For Monitoring Battery Cell Health App 20160380317 - Lin; Yizhen ; et al.	2016-12-29
Modular Flexible Sensor Array App 20160370210 - Kapusta; Christopher James ; et al.	2016-12-22
Pulse Oximetry Devices And Systems And Methods Of Making The Same App 20160220158 - Karp; Jason Harris ; et al.	2016-08-04
Electronic Packages And Methods Of Making And Using The Same App 20160155693 - Smith; Scott ; et al.	2016-06-02
Integrated circuit package and method of making same Grant 9,299,661 - Kapusta , et al. March 29, 2	2016-03-29
Battery Cell Health Monitoring Using Eddy Current Sensing App 20150340744 - KNOBLOCH; Aaron J. ; et al.	2015-11-26
Arrays Of Emitters For Pulse Oximetry Devices And Methods Of Making The Same App 20150133753 - Karp; Jason Harris ; et al.	2015-05-14
Stackable electronic package and method of making same Grant 9,024,447 - Kapusta , et al. May 5, 2	2015-05-05
Flexible Embedded Sensor Arrays And Methods Of Making The Same App 20150099948 - Kapusta; Christopher James ; et al.	2015-04-09
Stackable electronic package and method of fabricating same Grant 8,940,582 - Sabatini , et al. January 27, 2	2015-01-27
System and method of forming a patterned conformal structure Grant 8,748,754 - Kapusta , et al. June 10, 2	2014-06-10
Ultrasound acoustic assemblies and methods of manufacture Grant 8,742,646 - Wodnicki , et al. June 3, 2	2014-06-03
Stackable Electronic Package And Method Of Fabricating Same App 20130344653 - Sabatini; James ; et al.	2013-12-26
Ultrasound Acoustic Assemblies And Methods Of Manufacture App 20130257224 - Wodnicki; Robert Gideon ; et al.	2013-10-03
Stackable electronic package and method of fabricating same Grant 8,536,700 - Sabatini , et al. September 17, 2	2013-09-17
System and method of forming a patterned conformal structure Grant 8,276,268 - Kapusta , et al. October 2, 2	2012-10-02
Stackable Electronic Package And Method Of Making Same App 20120168941 - Kapusta; Christopher James ; et al.	2012-07-05
Integrated Circuit Package And Method Of Making Same App 20120171816 - Kapusta; Christopher James ; et al.	2012-07-05
Stackable electronic package and method of making same Grant 8,163,596 - Kapusta , et al. April 24, 2	2012-04-24
Method And System For Laser Patterning A Semiconductor Substrate App 20120080414 - Zhang; Wenwu ; et al.	2012-04-05
System And Method Of Forming A Patterned Conformal Structure App 20120069523 - Kapusta; Christopher James ; et al.	2012-03-22
System and method of forming isolated conformal shielding areas Grant 8,115,117 - Kapusta , et al. February 14, 2	2012-02-14
Stackable electronic package Grant 8,026,608 - Sabatini , et al. September 27, 2	2011-09-27
Stackable Electronic Package And Method Of Fabricating Same App 20110210440 - Sabatini; James ; et al.	2011-09-01
Photonic power devices and methods of manufacturing the same Grant 7,993,064 - Shaddock , et al. August 9, 2	2011-08-09
Integrated Circuit Package And Method Of Making Same App 20110156261 - Kapusta; Christopher James ; et al.	2011-06-30
System and method of forming a wafer scale package Grant 7,952,187 - Kapusta , et al. May 31, 2	2011-05-31
Affordable high performance high frequency multichip module fabrication and apparatus Grant 7,952,196 - Iannotti , et al. May 31, 2	2011-05-31
Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components Grant 7,901,970 - Zribi , et al. March 8, 2	2011-03-08
System And Method Of Forming Isolated Conformal Shielding Areas App 20100319981 - Kapusta; Christopher James ; et al.	2010-12-23
Stackable Electronic Package And Method Of Fabricating Same App 20100244226 - Sabatini; James ; et al.	2010-09-30
Stackable Electronic Package And Method Of Making Same App 20100244240 - Kapusta; Christopher James ; et al.	2010-09-30
Stackable Electronic Pagkage And Method Of Fabricating Same App 20100244225 - Sabatini; James ; et al.	2010-09-30
Integrated Circuit Package And Method Of Making Same App 20100244235 - Kapusta; Christopher James ; et al.	2010-09-30
System and method of forming a low profile conformal shield Grant 7,752,751 - Kapusta , et al. July 13, 2	2010-07-13
Micro-electromechanical system (MEMS) based current and magnetic field sensor using tunneling current sensing Grant 7,741,832 - Berkcan , et al. June 22, 2	2010-06-22
Ultra thin die electronic package Grant 7,727,808 - Kapusta , et al. June 1, 2	2010-06-01
System And Method Of Forming A Patterned Conformal Structure App 20100108370 - Kapusta; Christopher James ; et al.	2010-05-06
Piezoelectric composite apparatus and related methods Grant 7,696,676 - Berkcan , et al. April 13, 2	2010-04-13
Ultra Thin Die Electronic Package App 20090309241 - Kapusta; Christopher James ; et al.	2009-12-17
Apparatus and method of forming high performance integrated RF optical module Grant 7,633,667 - Koste , et al. December 15, 2	2009-12-15
Sealed wafer packaging of microelectromechanical systems Grant 7,605,466 - Aimi , et al. October 20, 2	2009-10-20
System And Method Of Forming A Wafer Scale Package App 20090243081 - Kapusta; Christopher James ; et al.	2009-10-01
System And Method Of Forming A Low Profile Conformal Shield App 20090242263 - Kapusta; Christopher James ; et al.	2009-10-01
Photonic Power Devices And Methods Of Manufacturing The Same App 20090245735 - Shaddock; David Mulford ; et al.	2009-10-01
Wideband passive amplitude compensated time delay module Grant 7,570,133 - Taft , et al. August 4, 2	2009-08-04
Apparatus And Method Of Forming High Performance Integrated Rf Optical Module App 20090103160 - Koste; Glen Peter ; et al.	2009-04-23
Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities Grant 7,508,189 - Berkcan , et al. March 24, 2	2009-03-24
MEMS based current sensor using magnetic-to-mechanical conversion and reference components Grant 7,495,430 - Berkcan , et al. February 24, 2	2009-02-24
MEMS based current sensor using magnetic-to-mechanical conversion and reference components Grant 7,466,121 - Berkcan , et al. December 16, 2	2008-12-16
Method of making an electronic device cooling system Grant 7,427,566 - Durocher , et al. September 23, 2	2008-09-23
Crosslinkable and crosslinked polymers Grant 7,390,857 - Cella , et al. June 24, 2	2008-06-24
Piezoelectric composite apparatus and related methods App 20080143216 - Berkcan; Ertugrul ; et al.	2008-06-19
Micro-electromechanical System (mems) Based Current & Magnetic Field Sensor Having Improved Sensitivities App 20080122431 - BERKCAN; ERTUGRUL ; et al.	2008-05-29
Micro-electromechanical System (mems) Based Current & Magnetic Field Sensor Having Capacitive Sense Components App 20080070338 - Zribi; Anis ; et al.	2008-03-20
Interconnect device Grant 7,316,512 - Shih , et al. January 8, 2	2008-01-08
Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components Grant 7,315,161 - Zribi , et al. January 1, 2	2008-01-01
Micro-electromechanical System (mems) Based Current And Magnetic Field Sensor Using Tunneling Current Sensing App 20070181963 - Berkcan; Ertugrul ; et al.	2007-08-09
Method of making an electronic device cooling system App 20070131659 - Durocher; Kevin Matthew ; et al.	2007-06-14
Method of making an electronic device cooling system App 20070131645 - Matthew Durocher; Kevin ; et al.	2007-06-14
Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities Grant 7,221,144 - Berkcan , et al. May 22, 2	2007-05-22
MEMS based current sensor using magnetic-to-mechanical conversion and reference components App 20070052410 - Berkcan; Ertugrul ; et al.	2007-03-08
MEMS based current sensor using magnetic-to-mechanical conversion and reference components App 20070040547 - Berkcan; Ertugrul ; et al.	2007-02-22
MEMS based current sensor using magnetic-to-mechanical conversion and reference components Grant 7,112,951 - Berkcan , et al. September 26, 2	2006-09-26
Micro-electromechanical system (MEMS) based current & magnetic field sensor having improved sensitivities App 20060076947 - Berkcan; Ertugrul ; et al.	2006-04-13
Method and apparatus for forming tapered waveguide structures Grant 7,018,580 - Gorczyca , et al. March 28, 2	2006-03-28
Crosslinkable and crosslinked polymers App 20060047031 - Cella; James Anthony ; et al.	2006-03-02
Novel folded Mach-Zehnder interferometers and optical sensor arrays App 20060034569 - Shih; Min-Yi ; et al.	2006-02-16
Method of processing high-resolution flex circuits with low distortion Grant 6,994,897 - Durocher , et al. February 7, 2	2006-02-07
Interconnect device App 20060023990 - Shih; Min-Yi ; et al.	2006-02-02
Piezoelectric microvalve Grant 6,988,706 - Seeley , et al. January 24, 2	2006-01-24
Micro-electromechanical system (MEMS) based current & magnetic field sensor having capacitive sense components App 20050270014 - Zribi, Anis ; et al.	2005-12-08
MEMS based current sensor using magnetic-to-mechanical conversion and reference components App 20050270013 - Berkcan, Ertugrul ; et al.	2005-12-08
Optoelectronic package and fabrication method Grant 6,935,792 - Saia , et al. August 30, 2	2005-08-30
Piezoelectric microvalve App 20050133751 - Seeley, Charles Erklin ; et al.	2005-06-23
Microelectromechanical system device packaging method Grant 6,773,962 - Saia , et al. August 10, 2	2004-08-10
Microelectromechanical system device packaging method Grant 6,767,764 - Saia , et al. July 27, 2	2004-07-27
Method of processing high-resolution flex circuits with low distortion App 20040094329 - Durocher, Kevin Matthew ; et al.	2004-05-20
Fabrication of plastic module with exposed backside contact Grant 6,737,002 - Rose , et al. May 18, 2	2004-05-18
Optoelectronic package and fabrication method App 20040076382 - Saia, Richard Joseph ; et al.	2004-04-22
Method for making multichip module substrates by encapsulating electrical conductors Grant 6,706,624 - Kapusta , et al. March 16, 2	2004-03-16
Method for making multichip module substrates by encapsulating electrical conductors and filling gaps Grant 6,602,739 - Rose , et al. August 5, 2	2003-08-05
Microelectromechanical system device package and packaging method App 20020173080 - Saia, Richard Joseph ; et al.	2002-11-21
Microelectromechanical system device package and packaging method App 20020132391 - Saia, Richard Joseph ; et al.	2002-09-19

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