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Patent applications and USPTO patent grants for Kapoor; Bikram.The latest application filed is for "oxygen plasma treatment for enhanced hdp-cvd gapfill".
Patent | Date |
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Reactive ion etching for semiconductor device feature topography modification Grant 7,628,897 - Mungekar , et al. December 8, 2 | 2009-12-08 |
Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology Grant 7,595,088 - Kapoor , et al. September 29, 2 | 2009-09-29 |
Oxygen plasma treatment for enhanced HDP-CVD gapfill Grant 7,229,931 - Mungekar , et al. June 12, 2 | 2007-06-12 |
HDP-CVD multistep gapfill process Grant 7,205,240 - Karim , et al. April 17, 2 | 2007-04-17 |
Oxygen plasma treatment for enhanced HDP-CVD gapfill App 20050282398 - Mungekar, Hemant P. ;   et al. | 2005-12-22 |
Microcontamination abatement in semiconductor processing App 20050260356 - Mungekar, Hemant P. ;   et al. | 2005-11-24 |
HDP-CVD uniformity control Grant 6,890,597 - Krishnaraj , et al. May 10, 2 | 2005-05-10 |
Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology App 20050008790 - Kapoor, Bikram ;   et al. | 2005-01-13 |
Hdp-cvd Multistep Gapfill Process App 20040245091 - Karim, M Ziaul ;   et al. | 2004-12-09 |
HDP-CVD uniformity control App 20040224090 - Krishnaraj, Padmanabhan ;   et al. | 2004-11-11 |
Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology Grant 6,808,748 - Kapoor , et al. October 26, 2 | 2004-10-26 |
High density plasma CVD process for gapfill into high aspect ratio features Grant 6,802,944 - Ahmad , et al. October 12, 2 | 2004-10-12 |
Hydrogen Assisted Hdp-cvd Deposition Process For Aggressive Gap-fill Technology App 20040146661 - Kapoor, Bikram ;   et al. | 2004-07-29 |
High density plasma CVD process for gapfill into high aspect ratio features App 20040079632 - Ahmad, Farhan ;   et al. | 2004-04-29 |
Reactive ion etching for semiconductor device feature topography modification App 20040079728 - Mungekar, Hemant P. ;   et al. | 2004-04-29 |
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