loadpatents
name:-0.014027118682861
name:-0.01042103767395
name:-0.0020620822906494
Kapoor; Bikram Patent Filings

Kapoor; Bikram

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kapoor; Bikram.The latest application filed is for "oxygen plasma treatment for enhanced hdp-cvd gapfill".

Company Profile
0.7.8
  • Kapoor; Bikram - Santa Clara CA
  • Kapoor; Bikram - Santa Cruz CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Reactive ion etching for semiconductor device feature topography modification
Grant 7,628,897 - Mungekar , et al. December 8, 2
2009-12-08
Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology
Grant 7,595,088 - Kapoor , et al. September 29, 2
2009-09-29
Oxygen plasma treatment for enhanced HDP-CVD gapfill
Grant 7,229,931 - Mungekar , et al. June 12, 2
2007-06-12
HDP-CVD multistep gapfill process
Grant 7,205,240 - Karim , et al. April 17, 2
2007-04-17
Oxygen plasma treatment for enhanced HDP-CVD gapfill
App 20050282398 - Mungekar, Hemant P. ;   et al.
2005-12-22
Microcontamination abatement in semiconductor processing
App 20050260356 - Mungekar, Hemant P. ;   et al.
2005-11-24
HDP-CVD uniformity control
Grant 6,890,597 - Krishnaraj , et al. May 10, 2
2005-05-10
Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology
App 20050008790 - Kapoor, Bikram ;   et al.
2005-01-13
Hdp-cvd Multistep Gapfill Process
App 20040245091 - Karim, M Ziaul ;   et al.
2004-12-09
HDP-CVD uniformity control
App 20040224090 - Krishnaraj, Padmanabhan ;   et al.
2004-11-11
Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology
Grant 6,808,748 - Kapoor , et al. October 26, 2
2004-10-26
High density plasma CVD process for gapfill into high aspect ratio features
Grant 6,802,944 - Ahmad , et al. October 12, 2
2004-10-12
Hydrogen Assisted Hdp-cvd Deposition Process For Aggressive Gap-fill Technology
App 20040146661 - Kapoor, Bikram ;   et al.
2004-07-29
High density plasma CVD process for gapfill into high aspect ratio features
App 20040079632 - Ahmad, Farhan ;   et al.
2004-04-29
Reactive ion etching for semiconductor device feature topography modification
App 20040079728 - Mungekar, Hemant P. ;   et al.
2004-04-29

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