KAO; YI-FAN

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAO; YI-FAN.The latest application filed is for "compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof".

Company Profile

0.5.5

KAO; YI-FAN - Taoyuan City TW
Kao; Yi-Fan - Taoyuan TW
Kao; Yi-Fan - Taoyuan County TW
Kao; Yi-Fan - New Taipei City TW
Kao; Yi-Fan - New Taipei TW
KAO; YI-FAN - TAOYUAN COUNTY 327 TW
Kao; Yi-Fan - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Compound Carrier Board Structure Of Flip-chip Chip-scale Package And Manufacturing Method Thereof App 20170345748 - LIN; TING-HAO ; et al.	2017-11-30
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof Grant 9,831,167 - Lin , et al. November 28, 2	2017-11-28
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof Grant 9,754,870 - Lin , et al. September 5, 2	2017-09-05
Method For Manufacturing A Circuit Board With Buried Element Having High Density Pin Count And The Circuit Board Structure App 20160262267 - Lin; Ting-Hao ; et al.	2016-09-08
Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure Grant 9,439,292 - Lin , et al. September 6, 2	2016-09-06
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof Grant 9,406,641 - Lin , et al. August 2, 2	2016-08-02
Compound Carrier Board Structure Of Flip-chip Chip-scale Package And Manufacturing Method Thereof App 20160197033 - LIN; TING-HAO ; et al.	2016-07-07
Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole Grant 9,301,405 - Lin , et al. March 29, 2	2016-03-29
Compound Carrier Board Structure Of Flip-chip Chip-scale Package And Manufacturing Method Thereof App 20150014031 - LIN; TING-HAO ; et al.	2015-01-15
Method For Fabricating Carrier Board Having No Conduction Line App 20110061234 - Hsu; Jun-Chung ; et al.	2011-03-17

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