Kao; Ta-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kao; Ta-Wei.The latest application filed is for "highly strained source/drain trenches in semiconductor devices".

Company Profile

2.7.2

Kao; Ta-Wei - Sijhih TW
KAO; Ta-Wei - Sijhih City TW
Kao; Ta-Wei - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Highly strained source/drain trenches in semiconductor devices Grant 10,868,166 - Kao , et al. December 15, 2	2020-12-15
Highly Strained Source/drain Trenches In Semiconductor Devices App 20120018786 - KAO; Ta-Wei ; et al.	2012-01-26
Method for forming highly strained source/drain trenches Grant 8,071,481 - Kao , et al. December 6, 2	2011-12-06
Method For Forming Highly Strained Source/drain Trenches App 20100270598 - KAO; Ta-Wei ; et al.	2010-10-28
Storage box for screwdriver bits Grant D580,655 - Kao November 18, 2	2008-11-18
Tool handle with bit storage Grant D573,862 - Kao July 29, 2	2008-07-29
Brush Grant D567,509 - Kao April 29, 2	2008-04-29
Compact tool Grant D470,738 - Kao February 25, 2	2003-02-25

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