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name:-0.008357048034668
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Kao; Shih-Chieh Patent Filings

Kao; Shih-Chieh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kao; Shih-Chieh.The latest application filed is for "[cleaning method used in interconnect process]".

Company Profile
1.6.5
  • Kao; Shih-Chieh - New Taipei TW
  • Kao; Shih-Chieh - San Diego CA
  • Kao, Shih-Chieh - Keelung TW
  • Kao; Shih-Chieh - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat dissipation system and coolant distribution module thereof
Grant 10,785,892 - Chen , et al. Sept
2020-09-22
Structure of signal plug
Grant 6,932,645 - Kao August 23, 2
2005-08-23
[cleaning Method Used In Interconnect Process]
App 20050051191 - Kao, Shih-Chieh ;   et al.
2005-03-10
Method of metal etching post cleaning
Grant 6,833,081 - Chen , et al. December 21, 2
2004-12-21
Structure of speaker signal line
Grant 6,713,673 - Kao March 30, 2
2004-03-30
Structure of signal line
Grant 6,710,243 - Kao March 23, 2
2004-03-23
Structure Of Signal Line
App 20040000417 - Kao, Shih-Chieh
2004-01-01
Structure of speaker signal line
App 20040000420 - Kao, Shih-Chieh
2004-01-01
Method of metal etching post cleaning
App 20030116534 - Chen, Yi-Nan ;   et al.
2003-06-26
Via plug layout structure for connecting different metallic layers
Grant 6,483,045 - Wang , et al. November 19, 2
2002-11-19
Gate dielectric breakdown test method
App 20020158648 - Wang, Mu-Chun ;   et al.
2002-10-31

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