loadpatents
Patent applications and USPTO patent grants for Kao; Shih-Chieh.The latest application filed is for "[cleaning method used in interconnect process]".
Patent | Date |
---|---|
Heat dissipation system and coolant distribution module thereof Grant 10,785,892 - Chen , et al. Sept | 2020-09-22 |
Structure of signal plug Grant 6,932,645 - Kao August 23, 2 | 2005-08-23 |
[cleaning Method Used In Interconnect Process] App 20050051191 - Kao, Shih-Chieh ;   et al. | 2005-03-10 |
Method of metal etching post cleaning Grant 6,833,081 - Chen , et al. December 21, 2 | 2004-12-21 |
Structure of speaker signal line Grant 6,713,673 - Kao March 30, 2 | 2004-03-30 |
Structure of signal line Grant 6,710,243 - Kao March 23, 2 | 2004-03-23 |
Structure Of Signal Line App 20040000417 - Kao, Shih-Chieh | 2004-01-01 |
Structure of speaker signal line App 20040000420 - Kao, Shih-Chieh | 2004-01-01 |
Method of metal etching post cleaning App 20030116534 - Chen, Yi-Nan ;   et al. | 2003-06-26 |
Via plug layout structure for connecting different metallic layers Grant 6,483,045 - Wang , et al. November 19, 2 | 2002-11-19 |
Gate dielectric breakdown test method App 20020158648 - Wang, Mu-Chun ;   et al. | 2002-10-31 |
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