KAO; Sam

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAO; Sam.The latest application filed is for "selenization or sulfurization method of roll to roll metal substrates".

Company Profile

0.22.28

KAO; Sam - Los Altos CA
Kao; Sam - San Mateo CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Selenization Or Sulfurization Method Of Roll To Roll Metal Substrates App 20170167028 - WALL; Arthur C. ; et al.	2017-06-15
Method For Monitoring Se Vapor In Vacuum Reactor Apparatus App 20160273097 - WALL; Arthur C. ; et al.	2016-09-22
Thin-film absorber formation method Grant 8,603,575 - Kao December 10, 2	2013-12-10
Formation of solar cells with conductive barrier layers and foil substrates Grant 8,525,152 - Leidholm , et al. September 3, 2	2013-09-03
Optoelectronic Architecture Having Compound Conducting Substrate App 20130032851 - Sheats; James R. ; et al.	2013-02-07
Optoelectronic architecture having compound conducting substrate Grant 8,309,949 - Sheats , et al. November 13, 2	2012-11-13
Low-cost High-power Battery And Enabling Bipolar Substrate App 20120237816 - Roscheisen; Martin R. ; et al.	2012-09-20
Photovoltaic devices with conductive barrier layers and foil substrates Grant 8,198,117 - Leidholm , et al. June 12, 2	2012-06-12
Optoelectronic Architecture Having Compound Conducting Substrate App 20120052613 - Sheats; James R. ; et al.	2012-03-01
Optoelectronic architecture having compound conducting substrate Grant 7,968,869 - Sheats , et al. June 28, 2	2011-06-28
Optoelectronic Architecture Having Compound Conducting Substrate App 20110121353 - Sheats; James R. ; et al.	2011-05-26
Optoelectronic architecture having compound conducting substrate Grant 7,919,337 - Sheats , et al. April 5, 2	2011-04-05
Optoelectronic architecture having compound conducting substrate Grant 7,838,868 - Sheats , et al. November 23, 2	2010-11-23
Formation Of Solar Cells With Conductive Barrier Layers And Foil Substrates App 20100243049 - Leidholm; Craig ; et al.	2010-09-30
Series interconnected optoelectronic device module assembly Grant 7,732,232 - Sheats , et al. June 8, 2	2010-06-08
Formation of solar cells with conductive barrier layers and foil substrates Grant 7,732,229 - Leidholm , et al. June 8, 2	2010-06-08
Optoelectronic Architecture Having Compound Conducting Substrate App 20090178706 - Sheats; James R. ; et al.	2009-07-16
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby Grant 7,521,360 - Halahan , et al. April 21, 2	2009-04-21
Photovoltaic Devices With Conductive Barrier Layers and Foil Substrates App 20080308148 - Leidholm; Craig R. ; et al.	2008-12-18
Optoelectronic Architecture Having Compound Conducting Substrate App 20080142073 - Sheats; James R. ; et al.	2008-06-19
Series Interconnected Optoelectronic Device Module Assembly App 20080020503 - Sheats; James R. ; et al.	2008-01-24
Series interconnected optoelectronic device module assembly Grant 7,276,724 - Sheats , et al. October 2, 2	2007-10-02
Attachment of integrated circuit structures and other substrates to substrates with vias Grant 7,241,675 - Savastiouk , et al. July 10, 2	2007-07-10
Attachment of integrated circuit structures and other substrates to substrates with vias Grant 7,241,641 - Savastiouk , et al. July 10, 2	2007-07-10
Electroplating And Electroless Plating Of Conductive Materials Into Openings, And Structures Obtained Thereby App 20070128868 - Halahan; Patrick A. ; et al.	2007-06-07
Formation Of Solar Cells With Conductive Barrier Layers And Foil Substrates App 20070000537 - Leidholm; Craig ; et al.	2007-01-04
Series interconnected optoelectronic device module assembly App 20060160261 - Sheats; James R. ; et al.	2006-07-20
Optoelectronic architecture having compound conducting substrate cross-reference to related application App 20060157103 - Sheats; James R. ; et al.	2006-07-20
Packaging substrates for integrated circuits and soldering methods Grant 7,060,601 - Savastiouk , et al. June 13, 2	2006-06-13
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities Grant 7,049,170 - Savastiouk , et al. May 23, 2	2006-05-23
Packaging substrates for integrated circuits and soldering methods Grant 7,034,401 - Savastiouk , et al. April 25, 2	2006-04-25
Attachment of integrated circuit structures and other substrates to substrates with vias App 20060076661 - Savastiouk; Sergey ; et al.	2006-04-13
Attachment of integrated circuit structures and other substrates to substrates with vias App 20060040423 - Savastibuk; Sergey ; et al.	2006-02-23
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities App 20060035416 - Savastiouk; Sergey ; et al.	2006-02-16
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities App 20050212127 - Savastiouk, Sergey ; et al.	2005-09-29
Packaging substrates for integrated circuits and soldering methods App 20050189636 - Savastiouk, Sergey ; et al.	2005-09-01
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby App 20050170647 - Halahan, Patrick A. ; et al.	2005-08-04
Packaging substrates for integrated circuits and soldering methods App 20050133930 - Savastisuk, Sergey ; et al.	2005-06-23
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities App 20050136634 - Savastiouk, Sergey ; et al.	2005-06-23
Attachment of integrated circuit structures and other substrates to substrates with vias App 20050136635 - Savastiouk, Sergey ; et al.	2005-06-23
Article holders that use gas vortices to hold an article in a desired position Grant 6,899,788 - Kao May 31, 2	2005-05-31
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby Grant 6,897,148 - Halahan , et al. May 24, 2	2005-05-24
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby App 20040203224 - Halahan, Patrick A. ; et al.	2004-10-14
Plasma processing comprising three rotational motions of an article being processed Grant 6,749,764 - Siniaguine , et al. June 15, 2	2004-06-15
Plasma processing comprising three rotational motions of an article being processed App 20040016406 - Siniaguine, Oleg ; et al.	2004-01-29
Article holders that use gas vortices to hold an article in a desired position App 20030178146 - Kao, Sam	2003-09-25
Article holders that use gas vortices to hold an article in a desired position App 20020185230 - Kao, Sam	2002-12-12
Non-contact workpiece holder using vortex chuck with central gas flow Grant 6,427,991 - Kao August 6, 2	2002-08-06

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