KAO; Perre
Patent Applications and Registrations
Patent applications and USPTO patent grants for KAO; Perre.The latest application filed is for "method of forming conductive bumps for cooling device connection and semiconductor device".
- KAO; Perre - Tainan City TW
- Kao; Perre - Tainan TW
| Patent | Date |
|---|---|
| Method Of Forming Conductive Bumps For Cooling Device Connection And Semiconductor Device App 20200258814 - A1 | 2020-08-13 |
| Method of forming conductive bumps for cooling device connection Grant 10,651,111 - Chou , et al. | 2020-05-12 |
| Method Of Forming Conductive Bumps For Cooling Device Connection App 20180166361 - CHOU; You-Hua ; et al. | 2018-06-14 |
| Method of forming conductive bumps for cooling device connection Grant 9,899,296 - Chou , et al. February 20, 2 | 2018-02-20 |
| Metal Bumps For Cooling Device Connection App 20150125998 - CHOU; You-Hua ; et al. | 2015-05-07 |
| Metal bumps for cooling device connection Grant 8,941,232 - Chou , et al. January 27, 2 | 2015-01-27 |
| Metal Bumps For Cooling Device Connection App 20120217628 - CHOU; You-Hua ; et al. | 2012-08-30 |
| Control Wafer Reclamation Process App 20110223767 - Liang; Jin-Lin ; et al. | 2011-09-15 |
| Control Wafer Reclamation Process App 20090233447 - Liang; Jin-Lin ; et al. | 2009-09-17 |
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