Kao; Nai-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kao; Nai-Hao.The latest application filed is for "package stack structure, method for fabricating the same, and carrier component".
- Kao; Nai-Hao - Taichung TW
- Kao; Nai-Hao - Taichung Hsien TW
| Patent | Date |
|---|---|
| Package Stack Structure, Method For Fabricating The Same, And Carrier Component App 20200328142 - Jiang; Don-Son ; et al. | 2020-10-15 |
| Flip-chip semiconductor package and chip carrier for preventing corner delamination Grant 8,207,620 - Tzeng , et al. June 26, 2 | 2012-06-26 |
| Flip-chip semiconductor package and chip carrier thereof App 20080017983 - Tzeng; Yuan-Lin ; et al. | 2008-01-24 |
| Cavity-down ball grid array semiconductor package with heat spreader Grant 6,819,565 - Kao , et al. November 16, 2 | 2004-11-16 |
| Cavity-down ball grid array semiconductor package with heat spreader App 20040070948 - Kao, Nai-Hao ; et al. | 2004-04-15 |
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