Kao; Huahung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kao; Huahung.The latest application filed is for "packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure".

Company Profile

1.36.17

Kao; Huahung - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat sink design for flip chip ball grid array Grant 11,282,762 - Kao , et al. March 22, 2	2022-03-22
Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure App 20220051963 - England; Luke ; et al.	2022-02-17
Heat Sink Design For Flip Chip Ball Grid Array App 20200258807 - A1	2020-08-13
Leadframe with improved half-etch layout to reduce defects caused during singulation Grant 10,128,171 - Kao , et al. November 13, 2	2018-11-13
Package-on-package structures Grant 9,666,571 - Kao , et al. May 30, 2	2017-05-30
Pad configurations for an electronic package assembly Grant 9,543,236 - Sutardja , et al. January 10, 2	2017-01-10
Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types Grant 9,524,927 - Leistiko , et al. December 20, 2	2016-12-20
Method For Forming A Via Structure Using A Double-side Laser Process App 20160353585 - Kao; Huahung ; et al.	2016-12-01
Pad Configurations For An Electronic Package Assembly App 20160240459 - Sutardja; Sehat ; et al.	2016-08-18
Interconnect layouts for electronic assemblies Grant 9,355,951 - Kao , et al. May 31, 2	2016-05-31
Pad configurations for an electronic package assembly Grant 9,331,052 - Sutardja , et al. May 3, 2	2016-05-03
Package-on-package Structures App 20160093602 - Kao; Huahung ; et al.	2016-03-31
Package-on-package structures Grant 9,209,163 - Kao , et al. December 8, 2	2015-12-08
Method For Forming A Via Structure Using A Double-side Laser Process App 20150257281 - Kao; Huahung ; et al.	2015-09-10
Formation of package pins in semiconductor packaging Grant 9,123,699 - Liu , et al. September 1, 2	2015-09-01
Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types Grant 8,963,342 - Leistiko , et al. February 24, 2	2015-02-24
Pad Configurations For An Electronic Package Assembly App 20150035160 - Sutardja; Sehat ; et al.	2015-02-05
Single layer BGA substrate process Grant 8,940,585 - Liou , et al. January 27, 2	2015-01-27
Leadless multi-chip module structure Grant 8,912,664 - Liou , et al. December 16, 2	2014-12-16
Pad configurations for an electronic package assembly Grant 8,860,193 - Sutardja , et al. October 14, 2	2014-10-14
Package-on-package Structures App 20140231993 - Kao; Huahung	2014-08-21
Single Layer Bga Substrate Process App 20140206152 - Liou; Shiann-Ming ; et al.	2014-07-24
Package-on-package Structures App 20140151880 - Kao; Huahung ; et al.	2014-06-05
Stack die structure for stress reduction and facilitation of electromagnetic shielding Grant 8,686,547 - Kao , et al. April 1, 2	2014-04-01
Single layer BGA substrate process Grant 8,673,689 - Liou , et al. March 18, 2	2014-03-18
Leadless multi-chip module structure Grant 8,669,139 - Liou , et al. March 11, 2	2014-03-11
Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types Grant 8,455,347 - Leistiko , et al. June 4, 2	2013-06-04
Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types Grant 8,405,220 - Loeb , et al. March 26, 2	2013-03-26
Package-on-package Structures App 20130043587 - Kao; Huahung ; et al.	2013-02-21
Leadless multi-chip module structure Grant 8,358,013 - Liou , et al. January 22, 2	2013-01-22
Pre-formed conductive bumps on bonding pads Grant 8,319,353 - Liou , et al. November 27, 2	2012-11-27
Single Layer Bga Substrate Process App 20120196407 - Liou; Shiann-Ming ; et al.	2012-08-02
Pad Configurations For An Electronic Package Assembly App 20110298117 - Sutardja; Sehat ; et al.	2011-12-08
Pre-formed conductive bumps on bonding pads Grant 8,030,098 - Liou , et al. October 4, 2	2011-10-04
Pillar structure on bump pad Grant 7,999,395 - Kao , et al. August 16, 2	2011-08-16
Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types Grant 7,956,474 - Leistiko , et al. June 7, 2	2011-06-07
Interconnect Layouts For Electronic Assemblies App 20110049710 - Kao; Huahung ; et al.	2011-03-03
Stack die packages Grant 7,825,521 - Wu , et al. November 2, 2	2010-11-02
Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types Grant 7,586,199 - Leistiko , et al. September 8, 2	2009-09-08
Stack Die Packages App 20090212410 - Wu; Albert ; et al.	2009-08-27
Drop-in heat sink and exposed die-back for molded flip die package Grant 7,560,309 - Kao , et al. July 14, 2	2009-07-14
Stack die packages Grant 7,535,110 - Wu , et al. May 19, 2	2009-05-19
Stack die packages App 20080006948 - Wu; Albert ; et al.	2008-01-10

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