loadpatents
name:-0.0069558620452881
name:-0.0032329559326172
name:-0.00065493583679199
Kao; Chung-Yao Patent Filings

Kao; Chung-Yao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kao; Chung-Yao.The latest application filed is for "semiconductor package".

Company Profile
0.2.7
  • Kao; Chung-Yao - Kaohsiung TW
  • KAO; Chung-Yao - Kaohsiung City TW
  • Kao; Chung-Yao - Ping Tung Hsien TW
  • Kao, Chung-Yao - Pingtung City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor package and manufacturing method thereof and encapsulating method thereof
Grant 8,212,368 - Kao , et al. July 3, 2
2012-07-03
Semiconductor Package
App 20120032351 - KAO; Chung-Yao ;   et al.
2012-02-09
Semiconductor Package
App 20120025369 - KAO; Chung-Yao ;   et al.
2012-02-02
Semiconductor Package And Manufacturing Method Thereof And Encapsulating Method Thereof
App 20110169156 - KAO; Chung-Yao ;   et al.
2011-07-14
Semiconductor package and manufacturing method thereof and encapsulating method thereof
Grant 7,932,617 - Kao , et al. April 26, 2
2011-04-26
Semiconductor Package And Manufacturing Method Thereof And Encapsulating Method Thereof
App 20100213595 - KAO; Chung-Yao ;   et al.
2010-08-26
Manufacturing Method For Package Structure
App 20100184255 - LIU; Chien ;   et al.
2010-07-22
Ball grid array package
App 20070194436 - Kao; Chung-Yao ;   et al.
2007-08-23
Flip Chip Package Structure And Chip Structure Thereof
App 20050146050 - Chen, Yu-Wen ;   et al.
2005-07-07

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