Kao; Chun-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kao; Chun-Yu.The latest application filed is for "patterning semiconductor devices and structures resulting therefrom".

Company Profile

6.4.9

Kao; Chun-Yu - Hsinchu TW
Kao; Chun-Yu - Yunlin County TW
Kao; Chun-Yu - Gukeng Shiang TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Patterning Semiconductor Devices And Structures Resulting Therefrom App 20220277958 - Kao; Chun-Yu ; et al.	2022-09-01
Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same Grant 11,408,087 - Sung , et al. August 9, 2	2022-08-09
Advanced electrodeposited copper foil and copper clad laminate using the same Grant 11,332,839 - Sung , et al. May 17, 2	2022-05-17
Micro-roughened Electrodeposited Copper Foil And Copper Clad Laminate App 20210321514 - SUNG; Yun-Hsing ; et al.	2021-10-14
Micro-roughened electrodeposited copper foil and copper foil substrate Grant 11,053,602 - Sung , et al. July 6, 2	2021-07-06
Micro-roughened electrodeposited copper foil and copper foil substrate Grant 11,047,061 - Sung , et al. June 29, 2	2021-06-29
Advanced Treated Electrodeposited Copper Foil Having Long And Island-shaped Structures And Copper Clad Laminate Using The Same App 20200399776 - SUNG; YUN-HSING ; et al.	2020-12-24
Advanced Reverse-treated Electrodeposited Copper Foil And Copper Clad Laminate Using The Same App 20200399775 - SUNG; YUN-HSING ; et al.	2020-12-24
Micro-roughened Electrodeposited Copper Foil And Copper Clad Laminate App 20200404784 - SUNG; Yun-Hsing ; et al.	2020-12-24
Advanced Reverse Treated Electrodeposited Copper Foil And Copper Clad Laminate Using The Same App 20200392640 - SUNG; YUN-HSING ; et al.	2020-12-17
Micro-roughened Electrodeposited Copper Foil And Copper Foil Substrate App 20200095701 - SUNG; YUN-HSING ; et al.	2020-03-26
Micro-roughened Electrodeposited Copper Foil And Copper Foil Substrate App 20200087811 - SUNG; YUN-HSING ; et al.	2020-03-19
Poison-filter Material And Production Method Thereof App 20100122515 - Kuo; Han-Wen ; et al.	2010-05-20

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