Kanno, Masao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kanno, Masao.The latest application filed is for "osteospermum plant named 'kakegawa au7'".
- Kanno, Masao - Chigasaki City JP
- Kanno; Masao - Oyama JP
- Kanno; Masao - Shimodate JP
| Patent | Date |
|---|---|
| Osteospermum Plant Named 'kakegawa Au8' App 20030070199 - Kanno, Masao | 2003-04-10 |
| Osteospermum Plant Named 'kakegawa Au7' App 20030070198 - Kanno, Masao | 2003-04-10 |
| Circuit boards using heat resistant resin for adhesive layers Grant 6,121,553 - Shinada , et al. September 19, 2 | 2000-09-19 |
| Process for producing printed wiring board Grant 5,309,632 - Takahashi , et al. May 10, 1 | 1994-05-10 |
| Process for producing printed wiring boards Grant 5,153,987 - Takahashi , et al. October 13, 1 | 1992-10-13 |
| High-density wired circuit board using insulated wires Grant 4,791,238 - Kanno , et al. December 13, 1 | 1988-12-13 |
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