Kang; Yonghee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Yonghee.The latest application filed is for "irreversible additive comprised in cathode material for secondary battery, cathode material comprising the same, and secondary battery comprising cathode material".

Company Profile

7.15.20

Kang; Yonghee - Daejeon KR
KANG; Yonghee - Suwon-si KR
Kang; YongHee - Kyoungki-Do KR
Kang; YongHee - Kyoung-gi-Do N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Irreversible Additive Comprised in Cathode Material for Secondary Battery, Cathode Material Comprising the Same, and Secondary Battery Comprising Cathode Material App 20220231291 - Lim; Sung Chul ; et al.	2022-07-21
Quantum Dot, Curable Composition Comprising The Same, Cured Layer Using The Composition, And Color Filter Including The Cured Layer App 20220213380 - KANG; Yonghee ; et al.	2022-07-07
Curable Composition, Cured Layer Using The Same, And Display Device Including Cured Layer App 20220056334 - LEE; Injae ; et al.	2022-02-24
Porous Separator And Lithium Secondary Battery Comprising Same App 20220052421 - CHOI; Woongchul ; et al.	2022-02-17
Quantum Dot, Curable Composition Comprising The Same, Cured Layer Using The Composition And Color Filter Including The Cured Layer App 20210108135 - KANG; Yonghee ; et al.	2021-04-15
Photosensitive resin composition, photosensitive resin layer using same and color filter Grant 10,915,020 - Jeong , et al. February 9, 2	2021-02-09
Quantum Dot, Curable Composition Comprising The Same, Cured Layer Using The Composition, Color Filter Including The Cured Layer, And Display Device Including The Cured Layer App 20210024819 - KANG; Yonghee ; et al.	2021-01-28
Non-solvent Type Curable Composition, Cured Layer Using The Same, Color Filter Including The Cured Layer, Display Device Includi App 20200248068 - Kind Code	2020-08-06
Quantum Dot, Curable Composition Comprising The Same, Cured Layer Using The Composition, Color Filter Including The Cured Layer, App 20200231871 - KIM; Jonggi ; et al.	2020-07-23
Photosensitive Resin Composition, Photosensitive Resin Layer Using Same And Color Filter App 20190278177 - JEONG; Jiyoung ; et al.	2019-09-12
Composition Including Quantum Dot, Manufacturing Method Quantum Dot And Color Filter App 20190129302 - YOUN; Jinsuop ; et al.	2019-05-02
Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding Grant 9,524,958 - Choi , et al. December 20, 2	2016-12-20
Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration Grant 8,994,048 - Choi , et al. March 31, 2	2015-03-31
Semiconductor Device and Method of Individual Die Bonding Followed by Simultaneous Multiple Die Thermal Compression Bonding App 20150001703 - Choi; JoonYoung ; et al.	2015-01-01
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate Grant 8,896,133 - Cho , et al. November 25, 2	2014-11-25
Semiconductor device and method of forming a thermally reinforced semiconductor die Grant 8,786,076 - Kim , et al. July 22, 2	2014-07-22
Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers Grant 8,742,566 - Jang , et al. June 3, 2	2014-06-03
Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate App 20130234324 - Cho; SungWon ; et al.	2013-09-12
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate Grant 8,492,197 - Cho , et al. July 23, 2	2013-07-23
Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers App 20130134586 - Jang; KiYoun ; et al.	2013-05-30
Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers Grant 8,389,398 - Jang , et al. March 5, 2	2013-03-05
Semiconductor Device and Method of Forming a Thermally Reinforced Semiconductor Die App 20120241941 - Kim; OhHan ; et al.	2012-09-27
Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers App 20120181690 - Jang; KiYoun ; et al.	2012-07-19
Semiconductor Device and Method of Forming Recesses in Substrate for Same Size or Different Sized Die with Vertical Integration App 20120146177 - Choi; JoonYoung ; et al.	2012-06-14
Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers Grant 8,169,071 - Jang , et al. May 1, 2	2012-05-01
Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate App 20120043672 - Cho; SungWon ; et al.	2012-02-23
Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers App 20110121452 - Jang; KiYoun ; et al.	2011-05-26
Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers Grant 7,897,502 - Jang , et al. March 1, 2	2011-03-01
Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding Grant 7,851,345 - Shim , et al. December 14, 2	2010-12-14
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers App 20100059866 - Jang; KiYoun ; et al.	2010-03-11
Semiconductor Device and Method of Forming Oxide Layer on Signal Traces for Electrical Isolation in Fine Pitch Bonding App 20090236738 - Shim; SeongBo ; et al.	2009-09-24

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