Kang; Un-Byoung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Un-Byoung.The latest application filed is for "semiconductor package with increased thermal radiation efficiency".

Company Profile

24.65.87

Kang; Un-Byoung - Hwaseong-si KR
KANG; Un Byoung - Hwasung-si KR
Kang; Un-Byoung - Hwasung N/A KR
Kang; Un-Byoung - Gyeonggi-do KR
KANG; Un-byoung - Hwseong-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package With Increased Thermal Radiation Efficiency App 20220293566 - Park; Sang-Sick ; et al.	2022-09-15
Semiconductor Package App 20220293565 - SHIN; Seung Hun ; et al.	2022-09-15
Semiconductor Devices And Semiconductor Packages Including The Same App 20220208703 - CHOI; JU-IL ; et al.	2022-06-30
Semiconductor Package Having Dummy Pads And Method Of Manufacturing Semiconductor Package Having Dummy Pads App 20220173044 - JEE; YOUNG KUN ; et al.	2022-06-02
Semiconductor Package And Method Of Manufacturing The Same App 20220157757 - Seok; Seyeong ; et al.	2022-05-19
Semiconductor Packages App 20220130802 - JUN; Joonho ; et al.	2022-04-28
Method for manufacturing semiconductor package having redistribution layer Grant 11,315,802 - Kim , et al. April 26, 2	2022-04-26
Semiconductor devices and semiconductor packages including the same Grant 11,302,660 - Choi , et al. April 12, 2	2022-04-12
Semiconductor Package App 20220102315 - LEE; Jang-woo ; et al.	2022-03-31
Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads Grant 11,282,792 - Jee , et al. March 22, 2	2022-03-22
Semiconductor Package App 20220077040 - JIN; Jeonggi ; et al.	2022-03-10
Interconnection Structure, Method Of Fabricating The Same, And Semiconductor Package Including Interconnection Structure App 20220068785 - HONG; JI-SEOK ; et al.	2022-03-03
Semiconductor Package App 20220037261 - CHOI; Ju-Il ; et al.	2022-02-03
Semiconductor Package App 20220028834 - LEE; HYUEKJAE ; et al.	2022-01-27
Semiconductor Package App 20220020701 - KO; Yeongkwon ; et al.	2022-01-20
Semiconductor package Grant 11,227,855 - Lee , et al. January 18, 2	2022-01-18
Semiconductor packages including stacked substrates and penetration electrodes Grant 11,222,873 - Jun , et al. January 11, 2	2022-01-11
Semiconductor Package App 20210407949 - PARK; Sang-Sick ; et al.	2021-12-30
Semiconductor Package App 20210384143 - PARK; Jin-woo ; et al.	2021-12-09
Semiconductor Package App 20210384101 - KIM; Hee-Jeong ; et al.	2021-12-09
Semiconductor package Grant 11,114,364 - Kim , et al. September 7, 2	2021-09-07
Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same Grant 11,069,541 - Ko , et al. July 20, 2	2021-07-20
Semiconductor Packages App 20210183816 - JUN; Joonho ; et al.	2021-06-17
Interposer, semiconductor package, and method of fabricating interposer Grant 11,018,026 - Kang , et al. May 25, 2	2021-05-25
Stacked Semiconductor Package App 20210125955 - SUH; JIHWAN ; et al.	2021-04-29
Semiconductor package having recessed adhesive layer between stacked chips Grant 10,930,613 - Park , et al. February 23, 2	2021-02-23
Semiconductor Package Having Redistribution Layer App 20210020578 - JEE; Young Kun ; et al.	2021-01-21
Semiconductor Package Having Dummy Pads And Method Of Manufacturing Semiconductor Package Having Dummy Pads App 20210005553 - JEE; YOUNG KUN ; et al.	2021-01-07
Semiconductor Devices And Semiconductor Packages Including The Same App 20200402935 - CHOI; JU-IL ; et al.	2020-12-24
Method of fabricating semiconductor package Grant 10,868,073 - Kang , et al. December 15, 2	2020-12-15
Semiconductor package having redistribution layer Grant 10,818,603 - Jee , et al. October 27, 2	2020-10-27
Semiconductor device and package including modified region of less density at edge of device or substrate Grant 10,804,212 - Ko , et al. October 13, 2	2020-10-13
Semiconductor Package And Method Of Fabricating The Same App 20200303445 - KANG; Un-Byoung ; et al.	2020-09-24
Stacked image sensor package and stacked image sensor module including the same Grant 10,756,055 - Kang , et al. A	2020-08-25
Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same Grant 10,685,921 - Jee , et al.	2020-06-16
Interposer, Semiconductor Package, And Method Of Fabricating Interposer App 20200144076 - KANG; UN-BYOUNG ; et al.	2020-05-07
Semiconductor Device Package And Method Of Manufacturing Same App 20200126814 - KO; YEONG KWON ; et al.	2020-04-23
Semiconductor Package App 20200118972 - LEE; Jang-woo ; et al.	2020-04-16
Semiconductor Package And Method Of Manufacturing The Same App 20200098719 - PARK; Sang Sick ; et al.	2020-03-26
Method For Manufacturing Semiconductor Package Having Redistribution Layer App 20200066545 - KIM; Il Hwan ; et al.	2020-02-27
Semiconductor Device And Semiconductor Package Having The Same App 20200020641 - KO; YEONG-KWON ; et al.	2020-01-16
Semiconductor Chip Module Including A Channel For Controlling Warpage And Method Of Manufacturing The Same App 20200020647 - JEE; YOUNG KUN ; et al.	2020-01-16
Semiconductor Package App 20200020606 - Kim; Hee-Jeong ; et al.	2020-01-16
Method of fabricating an interposer Grant 10,535,534 - Kang , et al. Ja	2020-01-14
Semiconductor Package Having Redistribution Layer App 20200006242 - JEE; Young Kun ; et al.	2020-01-02
Stacked Image Sensor Package And Stacked Image Sensor Module Including The Same App 20190206832 - KANG; Un-Byoung ; et al.	2019-07-04
Stacked image sensor package and stacked image sensor module including the same Grant 10,262,971 - Kang , et al.	2019-04-16
Method Of Fabricating Semiconductor Package App 20190074316 - KANG; Un-Byoung ; et al.	2019-03-07
Semiconductor package and method of fabricating the same Grant 10,177,188 - Kang , et al. J	2019-01-08
Method of fabricating a semiconductor device Grant 10,157,766 - Kang , et al. Dec	2018-12-18
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 9,941,196 - Lee , et al. April 10, 2	2018-04-10
Semiconductor package and method of fabricating the same Grant 9,905,550 - Han , et al. February 27, 2	2018-02-27
Chip-stacked semiconductor package and method of manufacturing the same Grant 9,905,538 - Kang , et al. February 27, 2	2018-02-27
Semiconductor Package And Method Of Fabricating The Same App 20180040658 - KANG; Un-Byoung ; et al.	2018-02-08
Stacked Image Sensor Package And Stacked Image Sensor Module Including The Same App 20180040584 - KANG; Un-Byoung ; et al.	2018-02-08
Interposer, Semiconductor Package, And Method Of Fabricating Interposer App 20170330767 - Kang; Un-Byoung ; et al.	2017-11-16
Pre-package and methods of manufacturing semiconductor package and electronic device using the same Grant 9,761,477 - Chang , et al. September 12, 2	2017-09-12
Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate Grant 9,728,424 - Kim , et al. August 8, 2	2017-08-08
Chip-stacked Semiconductor Package And Method Of Manufacturing The Same App 20170125387 - KANG; UN-BYOUNG ; et al.	2017-05-04
Chip-stacked semiconductor package and method of manufacturing the same Grant 9,601,465 - Kang , et al. March 21, 2	2017-03-21
Methods of processing substrates Grant 9,595,446 - Lee , et al. March 14, 2	2017-03-14
Pre-package And Methods Of Manufacturing Semiconductor Package And Electronic Device Using The Same App 20170025302 - Chang; Gun-ho ; et al.	2017-01-26
Method Of Fabricating A Semiconductor Device App 20170004990 - Kang; Un-Byoung ; et al.	2017-01-05
Pre-package and methods of manufacturing semiconductor package and electronic device using the same Grant 9,478,514 - Chang , et al. October 25, 2	2016-10-25
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20160233155 - LEE; Ho-Jin ; et al.	2016-08-11
Methods for processing substrates Grant 9,412,636 - Lee , et al. August 9, 2	2016-08-09
Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package Grant 9,376,541 - Kang , et al. June 28, 2	2016-06-28
Pre-package And Methods Of Manufacturing Semiconductor Package And Electronic Device Using The Same App 20160141260 - Chang; Gun-ho ; et al.	2016-05-19
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 9,343,361 - Lee , et al. May 17, 2	2016-05-17
Semiconductor Package And Method Of Fabricating The Same App 20160013174 - HAN; Sang-Uk ; et al.	2016-01-14
Semiconductor Package And Method Of Manufacturing The Same App 20160013091 - Kim; Ji-hwang ; et al.	2016-01-14
Semiconductor device and method of forming the same Grant 9,196,505 - Kang , et al. November 24, 2	2015-11-24
Method Of Manufacturing Semiconductoe Device App 20150221517 - Kim; Eun-mi ; et al.	2015-08-06
Methods For Processing Substrates App 20150214089 - LEE; CHUNGSUN ; et al.	2015-07-30
Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Grant 9,076,881 - Im , et al. July 7, 2	2015-07-07
Methods for processing substrates Grant 9,023,716 - Lee , et al. May 5, 2	2015-05-05
Chip-stacked Semiconductor Package And Method Of Manufacturing The Same App 20150102468 - KANG; Un-Byoung ; et al.	2015-04-16
Non-conductive Film And Non-conductive Paste Including Zinc Particles, Semiconductor Package Including The Same, And Method Of Manufacturing The Semiconductor Package App 20150102485 - Kang; Un-byoung ; et al.	2015-04-16
Heterojunction structures of different substrates joined and methods of fabricating the same Grant 8,890,325 - Kang , et al. November 18, 2	2014-11-18
Multi-chip package and method of manufacturing the same Grant 8,884,421 - Kang , et al. November 11, 2	2014-11-11
Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip Grant 8,884,416 - Lee , et al. November 11, 2	2014-11-11
Semiconductor package and method of manufacturing the same Grant 8,852,988 - Jang , et al. October 7, 2	2014-10-07
Semiconductor Package And Method Of Fabricating The Same App 20140252626 - KANG; Un-Byoung ; et al.	2014-09-11
Methods Of Processing Substrates App 20140213039 - LEE; Chungsun ; et al.	2014-07-31
Methods For Processing Substrates App 20140210075 - LEE; CHUNGSUN ; et al.	2014-07-31
Bump Structure Including Nano-wires And A Body Connecting Ends Of The Nano-wires, Semiconductor Package Having The Bump Structure And Method Of Manufacturing The Semiconductor Package App 20140147974 - IM; Yun-Hyeok ; et al.	2014-05-29
Multi-chip Package And Method Of Manufacturing The Same App 20140110831 - KANG; Un-Byoung ; et al.	2014-04-24
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20140057430 - LEE; Ho-Jin ; et al.	2014-02-27
Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Grant 8,643,179 - Im , et al. February 4, 2	2014-02-04
Multi-chip package and method of manufacturing the same Grant 8,633,579 - Kang , et al. January 21, 2	2014-01-21
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 8,592,991 - Lee , et al. November 26, 2	2013-11-26
Method of forming semiconductor device Grant 8,563,349 - Myung , et al. October 22, 2	2013-10-22
Method for wafer level package and semiconductor device fabricated using the same Grant 8,558,371 - Hong , et al. October 15, 2	2013-10-15
Semiconductor Package And Method Of Manufacturing The Same App 20130267057 - Jang; Hyung-Sun ; et al.	2013-10-10
Semiconductor Device And Method Of Forming The Same App 20130260551 - Kang; Un-Byoung ; et al.	2013-10-03
Semiconductor package and method of manufacturing the same Grant 8,466,527 - Jang , et al. June 18, 2	2013-06-18
Semiconductor device and method of forming the same Grant 8,450,856 - Kang , et al. May 28, 2	2013-05-28
Heterojunction Structures Of Different Substrates Joined And Methods Of Fabricating The Same App 20120168792 - KANG; Un-Byoung ; et al.	2012-07-05
Semiconductor Device and Method of Forming the Same App 20120153498 - Kang; Un-Byoung ; et al.	2012-06-21
Method Of Forming Semiconductor Device App 20120156823 - MYUNG; Jong-Yun ; et al.	2012-06-21
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20120133048 - LEE; Ho-Jin ; et al.	2012-05-31
Bump Structure And Semiconductor Package Having The Bump Structure App 20120119359 - Im; Yun-Hyeok ; et al.	2012-05-17
Multi-chip Package And Method Of Manufacturing The Same App 20120049352 - KANG; Un-Byoung ; et al.	2012-03-01
Semiconductor package and method of manufacturing the same Grant 8,125,042 - Kim , et al. February 28, 2	2012-02-28
Camera modules and methods of fabricating the same Grant 8,114,701 - Kwon , et al. February 14, 2	2012-02-14
Semiconductor Apparatus Having Through Vias App 20120018885 - Lee; Go Eun ; et al.	2012-01-26
Method For Wafer Level Package and Semiconductor Device Fabricated Using The Same App 20110233706 - Hong; JiSun ; et al.	2011-09-29
Semiconductor Package And Method Of Manufacturing The Same App 20110180892 - JANG; Hyung-Sun ; et al.	2011-07-28
Camera module and electronic apparatus having the same Grant 7,948,555 - Kwon , et al. May 24, 2	2011-05-24
Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package Grant 7,893,514 - Kwon , et al. February 22, 2	2011-02-22
Image sensor having through via Grant 7,884,392 - Lee , et al. February 8, 2	2011-02-08
Method Of Manufacturing A Semiconductor Device Having An Even Coating Thickness Using Electro-less Plating And Related Device App 20100320500 - KANG; UN BYOUNG ; et al.	2010-12-23
Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device Grant 7,786,581 - Kang , et al. August 31, 2	2010-08-31
Semiconductor Package And Method Of Manufacturing The Same App 20100117181 - Kim; Jung-Hwan ; et al.	2010-05-13
Stack Type Semiconductor Chip Package Having Different Type Of Chips And Fabrication Method Thereof App 20100019338 - KWON; Woon-Seong ; et al.	2010-01-28
Stack type semiconductor chip package having different type of chips and fabrication method thereof Grant 7,619,315 - Kwon , et al. November 17, 2	2009-11-17
Camera module, method of manufacturing the same, and electronic system having the same App 20090256931 - Lee; Chung-Sun ; et al.	2009-10-15
Image Sensor Having Through Via App 20090200632 - LEE; Hyuek-Jae ; et al.	2009-08-13
Camera Modules And Methods Of Fabricating The Same App 20090130791 - KWON; Woon-Seong ; et al.	2009-05-21
Camera Module And Electronic Apparatus Having The Same App 20090122178 - KWON; Yong-Hwan ; et al.	2009-05-14
Semiconductor package with ferrite shielding structure Grant 7,495,317 - Song , et al. February 24, 2	2009-02-24
Semiconductor Package With Through Silicon Via And Related Method Of Fabrication App 20080284041 - JANG; Hyung-sun ; et al.	2008-11-20
Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device App 20080258299 - Kang; Un Byoung ; et al.	2008-10-23
Image Sensor Package, Method Of Manufacturing The Same, And Image Sensor Module Including The Image Sensor Package App 20080251872 - KWON; Woon-Seong ; et al.	2008-10-16
Stack Type Semiconductor Chip Package Having Different Type Of Chips And Fabrication Method Thereof App 20080169546 - KWON; Woon-Seong ; et al.	2008-07-17
Bump Electrode Including Plating Layers And Method Of Fabricating The Same App 20080083983 - JANG; Hyang-sun ; et al.	2008-04-10
Semiconductor Package Including Silver Bump And Method For Fabricating The Same App 20080054456 - KANG; Un-byoung ; et al.	2008-03-06
Image Sensor Package, Related Method Of Manufacture And Image Sensor Module App 20080055438 - Lee; Chung-sun ; et al.	2008-03-06
Image sensor package and method of fabricating the same App 20080012084 - Kwon; Yong-Hwan ; et al.	2008-01-17
Semiconductor package with ferrite shielding structure App 20070023902 - Song; Eun-Seok ; et al.	2007-02-01
Multi-path printed circuit board having heterogeneous layers and power delivery system including the same App 20060157826 - Lee; Hee-seok ; et al.	2006-07-20
Film circuit substrate having Sn-In alloy layer App 20060091504 - Kang; Un-Byoung ; et al.	2006-05-04