| Patent | Date |
|---|
Low Cost Package Structure For High Performance ML Memory Interface To Improve Perf/TCO
App 20220238504 - Kim; Namhoon ; et al. | 2022-07-28 |
Backside Interconnection Interface Die For Integrated Circuits Package
App 20220189934 - Kim; Namhoon ; et al. | 2022-06-16 |
Backside Integrated Voltage Regulator For Integrated Circuits
App 20220157787 - Kim; Namhoon ; et al. | 2022-05-19 |
Asic Package With Photonics And Vertical Power Delivery
App 20220139876 - Kwon; Woon-Seong ; et al. | 2022-05-05 |
Backside integrated voltage regulator for integrated circuits
Grant 11,276,668 - Kim , et al. March 15, 2 | 2022-03-15 |
Integrated circuit substrate for containing liquid adhesive bleed-out
Grant 11,264,295 - Kwon , et al. March 1, 2 | 2022-03-01 |
ASIC package with photonics and vertical power delivery
Grant 11,264,358 - Kwon , et al. March 1, 2 | 2022-03-01 |
Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies
App 20210378106 - Iyengar; Madhusudan K. ; et al. | 2021-12-02 |
Deep Trench Capacitors Embedded In Package Substrate
App 20210273042 - Kim; Nam Hoon ; et al. | 2021-09-02 |
Backside Integrated Voltage Regulator For Integrated Circuits
App 20210249384 - Kim; Nam Hoon ; et al. | 2021-08-12 |
Device and method for direct liquid cooling via metal channels
Grant 10,964,625 - Jain , et al. March 30, 2 | 2021-03-30 |
Asic Package With Photonics And Vertical Power Delivery
App 20210074677 - Kwon; Woon-Seong ; et al. | 2021-03-11 |
Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-Out
App 20210074601 - Kwon; Woon-Seong ; et al. | 2021-03-11 |
Wafer level fan-out application specific integrated circuit bridge memory stack
Grant 10,930,592 - Kim , et al. February 23, 2 | 2021-02-23 |
Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications
Grant 10,896,873 - Kwon , et al. January 19, 2 | 2021-01-19 |
Wafer Level Fan-out Application Specific Integrated Circuit Bridge Memory Stack
App 20200357743 - Kim; Nam Hoon ; et al. | 2020-11-12 |
Integrated circuit substrate for containing liquid adhesive bleed-out
Grant 10,818,567 - Kwon , et al. October 27, 2 | 2020-10-27 |
Cooling Electronic Devices In A Data Center
App 20200296862 - Iyengar; Madhusudan Krishnan ; et al. | 2020-09-17 |
Device And Method For Direct Liquid Cooling Via Metal Channels
App 20200273777 - Jain; Padam ; et al. | 2020-08-27 |
Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-out
App 20200185292 - Kwon; Woon Seong ; et al. | 2020-06-11 |
Cooling electronic devices in a data center
Grant 10,681,846 - Iyengar , et al. | 2020-06-09 |
Massive Deep Trench Capacitor Die Fill For High Performance Application Specific Integrated Circuit (asic) Applications
App 20200161235 - Kwon; Woon Seong ; et al. | 2020-05-21 |
High bandwidth memory package for high performance processors
Grant 10,658,322 - Kwon , et al. | 2020-05-19 |
High Bandwidth Memory Package For High Performance Processors
App 20200098715 - Kwon; Woon Seong ; et al. | 2020-03-26 |
Cooling electronic devices in a data center
Grant 10,548,239 - Iyengar , et al. Ja | 2020-01-28 |
Cooling electronic devices in a data center
Grant 10,548,240 - Iyengar , et al. Ja | 2020-01-28 |
High bandwidth memory package for high performance processors
Grant 10,515,920 - Kwon , et al. Dec | 2019-12-24 |
Package stiffener for protecting semiconductor die
Grant 10,468,359 - Edwards , et al. No | 2019-11-05 |
Cooling Electronic Devices In A Data Center
App 20190327859 - Iyengar; Madhusudan Krishnan ; et al. | 2019-10-24 |
High Bandwidth Memory Package For High Performance Processors
App 20190312002 - Kwon; Woon Seong ; et al. | 2019-10-10 |
Package Stiffener For Protecting Semiconductor Die
App 20190237411 - Edwards; William ; et al. | 2019-08-01 |
Embedded air gap transmission lines
Grant 10,257,921 - Roy , et al. | 2019-04-09 |
Integration Of Silicon Photonics Ic For High Data Rate
App 20180299628 - Liu; Hong ; et al. | 2018-10-18 |
Package stiffener for protecting semiconductor die
Grant 10,083,920 - Edwards , et al. September 25, 2 | 2018-09-25 |
Chip package using interposer substrate with through-silicon vias
Grant 10,032,696 - Kang July 24, 2 | 2018-07-24 |
Integration of silicon photonics IC for high data rate
Grant 10,025,047 - Liu , et al. July 17, 2 | 2018-07-17 |
System, method, and computer program product for a cavity package-on-package structure
Grant 9,659,815 - Boja , et al. May 23, 2 | 2017-05-23 |
System, Method, And Computer Program Product For A Cavity Package-on-package Structure
App 20150206848 - Boja; Ronilo V. ; et al. | 2015-07-23 |
Chip Package Using Interposer Substrate With Through-silicon Vias
App 20140175665 - KANG; Teckgyu | 2014-06-26 |
Three Dimensional Through-silicon Via Construction
App 20140151892 - Kang; Teckgyu ; et al. | 2014-06-05 |
| 