Kang Sung K
USPTO Trademark & Patent Filings
Trademark applications and grants for Kang Sung K. Kang Sung K has 1 trademark applications. The latest application filed is for "BUCKER"
- Company Aliases
- Kang, Sung K.
- k sung kang
- Kang; Sung K. - Chappaqua NY
- Kang; Sung K. - Yorktown Heights NY
- KANG; SUNG K. - CHAPPAQUA NY
- Kang; Sung K. - Armonk NY
Trademarks Patents
| Patent Application | Date |
|---|---|
| SUBSTRATE VIA FILLING 20160219715 - 15/090656 Cordes; Steven A. ; et al. | 2016-07-28 |
| SUBSTRATE VIA FILLING 20160113119 - 14/515567 Cordes; Steven A. ; et al. | 2016-04-21 |
| AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION 20150334830 - 14/700850 Hougham; Gareth ; et al. | 2015-11-19 |
| ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES 20130252418 - 13/874509 ARVIN; CHARLES L. ; et al. | 2013-09-26 |
| ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES 20130249066 - 13/427940 ARVIN; CHARLES L. ; et al. | 2013-09-26 |
| Substrate via filling 9,872,394 - 15/090,656 Cordes , et al. January 16, 2 | 2018-01-16 |
| Axiocentric scrubbing land grid array contacts and methods for fabrication 9,565,759 - 14/700,850 Hougham , et al. February 7, 2 | 2017-02-07 |
| Substrate via filling 9,433,101 - 14/515,567 Cordes , et al. August 30, 2 | 2016-08-30 |
| Electromigration-resistant lead-free solder interconnect structures 9,379,007 - 13/874,509 Arvin , et al. June 28, 2 | 2016-06-28 |
| Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip 9,082,762 - 12/647,999 Kang , et al. July 14, 2 | 2015-07-14 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"BUCKER" 2387296 75671525 |
BUCKER 1999-03-31 |
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