Kang; Sung Il

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Sung Il.The latest application filed is for "semiconductor package substrate and method of manufacturing the same, and semiconductor package and method of manufacturing the same".

Company Profile

6.20.25

Kang; Sung Il - Gyeongsangnam-do KR
Kang; Sung Il - Gimhae-si KR
Kang; Sung il - Sungnam-si KR
Kang; Sung Il - Changwon-si KR
Kang; Sung-il - Changwon N/A KR
Kang; Sung-il - Changwon-city KR
Kang; Sung-il - Taejeon KR
Kang; Sung Il - Seoul KR
Kang; Sung-IL - Gyeonggi-do KR
Kang, Sung Il - Ansan KR
Kang; Sung-il - Seo-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Substrate And Method Of Manufacturing The Same, And Semiconductor Package And Method Of Manufacturing The Same App 20220285251 - Kim; Wonbin ; et al.	2022-09-08
Apparatus For Grinding Surface Of Substrate App 20220274223 - Ku; Jong Hoe ; et al.	2022-09-01
Method of fabricating carrier for wafer level package by using lead frame Grant 11,227,775 - Pyeon , et al. January 18, 2	2022-01-18
Method Of Manufacturing Circuit Board App 20210217629 - YOON; Dong Jin ; et al.	2021-07-15
Apparatus For And Method Of Polishing Surface Of Substrate App 20210107094 - KANG; Sung Il ; et al.	2021-04-15
Method Of Fabricating Carrier For Wafer Level Package By Using Lead Frame App 20210098268 - PYEON; Dong Young ; et al.	2021-04-01
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the method Grant 10,910,299 - Bae , et al. February 2, 2	2021-02-02
Method Of Manufacturing Semiconductor Package Substrate And Semiconductor Package Substrate Manufactured Using The Same App 20200411362 - KANG; Sung Il ; et al.	2020-12-31
Semiconductor package substrate and method for manufacturing same Grant 10,840,170 - Bae , et al. November 17, 2	2020-11-17
Semiconductor Package Substrate And Method For Manufacturing Same App 20200227344 - BAE; In Seob ; et al.	2020-07-16
Semiconductor package substrate and method for manufacturing same Grant 10,643,932 - Bae , et al.	2020-05-05
Semiconductor package substrate and manufacturing method therefor Grant 10,643,933 - Bae , et al.	2020-05-05
Method Of Manufacturing Semiconductor Package Substrate And Semiconductor Package Substrate Manufactured Using The Method, And M App 20190267315 - BAE; In Seob ; et al.	2019-08-29
Semiconductor Package Substrate And Manufacturing Method Therefor App 20190122968 - BAE; In Seob ; et al.	2019-04-25
Method Of Manufacturing Semiconductor Package Substrate And Semiconductor Package Substrate Manufactured Using The Same App 20190067082 - KANG; Sung Il ; et al.	2019-02-28
Semiconductor Package Substrate And Method For Manufacturing Same App 20190057930 - BAE; In Seob ; et al.	2019-02-21
Cosmetic container with different types of mixed materials Grant 9,598,220 - Kim , et al. March 21, 2	2017-03-21
Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same Grant 9,460,986 - Kang , et al. October 4, 2	2016-10-04
Cosmetic container with different types of mixed materials App 20150274398 - Kim; Joon Young ; et al.	2015-10-01
Method Of Manufacturing Semiconductor Package Substrate And Semiconductor Package Substrate Manufactured Using The Same App 20150194323 - KANG; Sung Il ; et al.	2015-07-09
Printed circuit board with multiple metallic layers and method of manufacturing the same Grant 8,409,726 - Shim , et al. April 2, 2	2013-04-02
Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package Grant 8,354,741 - Kang , et al. January 15, 2	2013-01-15
Circuit Board Viaholes And Method Of Manufacturing The Same App 20120279775 - Shim; Chang-han ; et al.	2012-11-08
Circuit board viaholes and method of manufacturing the same Grant 8,278,564 - Shim , et al. October 2, 2	2012-10-02
Lead Frame Manufactured From Low-priced Material And Not Requiring Strict Process Control, Semiconductor Package Including The Same, And Method Of Manufacturing The Lead Frame And The Semiconductor Package App 20120098112 - KANG; Sung-il ; et al.	2012-04-26
Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package Grant 8,110,505 - Kang , et al. February 7, 2	2012-02-07
Printed Circuit Board With Multiple Metallic Layers And Method Of Manufacturing The Same App 20100116528 - Shim; Chang-han ; et al.	2010-05-13
Circuit Board Viaholes And Method Of Manufacturing The Same App 20090283316 - Shim; Chang-han ; et al.	2009-11-19
Lead Frame, Semiconductor Package Including The Same, And Method Of Manufacturing The Lead Frame And The Semiconductor Package App 20090283884 - Kang; Sung-il ; et al.	2009-11-19
Method for transferring variable isochronous data and apparatus therefore Grant 7,454,539 - Lee , et al. November 18, 2	2008-11-18
Cometic Bottle Structure for Discharging Fixed Quantity of Highly Viscosity Cosmetics App 20080116229 - Kang; Sung Il	2008-05-22
Lead frame for semiconductor package Grant 7,285,845 - Kang , et al. October 23, 2	2007-10-23
Method for distributing stream data based on multi-path scheme using tcp in real time App 20070002874 - Kang; Yong-Il ; et al.	2007-01-04
Method for transferring variable isochronous data and apparatus therefor Grant 7,155,543 - Lee , et al. December 26, 2	2006-12-26
Method for transferring variable isochronous data and apparatus therefore App 20060282570 - Lee; Yoon-jick ; et al.	2006-12-14
Lead frame for semiconductor package App 20060231931 - Kang; Sung-il ; et al.	2006-10-19
Hairdyeing apparatus App 20050199254 - Kang, Sung Il	2005-09-15
Method of extending channels for IEEE-1394 serial bus Grant 6,667,987 - Kwon , et al. December 23, 2	2003-12-23
Method for transferring variable isochronous data and apparatus therefor App 20030217220 - Lee, Yoon-Jick ; et al.	2003-11-20
Method for transferring variable isochronous data and apparatus therefor Grant 6,611,886 - Lee , et al. August 26, 2	2003-08-26
Lead frame and method of manufacturing the lead frame Grant 6,475,646 - Park , et al. November 5, 2	2002-11-05
Lead frame and method for plating the same Grant 6,469,386 - Lee , et al. October 22, 2	2002-10-22
Lead frame and method of manufacturing the lead frame App 20020020629 - Park, Se-Chul ; et al.	2002-02-21

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