Kang; Su Bin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kang; Su Bin.The latest application filed is for "vertical-type memory device".
- Kang; Su Bin - Suwon-si KR
- Kang; Su Bin - Gyeonggi-do KR
- Kang; Su Bin - Yongin KR
- Kang; Su Bin - Yongin-si KR
- Kang; Su Bin - Busan KR
- KANG; Su Bin - Seoul KR
| Patent | Date |
|---|---|
| Vertical-type memory device Grant 11,004,866 - Lee , et al. May 11, 2 | 2021-05-11 |
| Semiconductor device including separation lines Grant 10,998,327 - Kang , et al. May 4, 2 | 2021-05-04 |
| Vertical-type Memory Device App 20200185412 - LEE; TAK ; et al. | 2020-06-11 |
| Power module Grant 10,622,276 - Kim , et al. | 2020-04-14 |
| Vertical-type memory device Grant 10,566,346 - Lee , et al. Feb | 2020-02-18 |
| Semiconductor Device App 20190355736 - KANG; SU BIN ; et al. | 2019-11-21 |
| Vertical-type Memory Device App 20190244969 - Lee; Tak ; et al. | 2019-08-08 |
| Power Module App 20180350714 - Kim; Young Seok ; et al. | 2018-12-06 |
| Power module Grant 10,062,631 - Kim , et al. August 28, 2 | 2018-08-28 |
| Method of bonding with silver paste Grant 9,972,597 - Hong , et al. May 15, 2 | 2018-05-15 |
| Stretchable Conductive Fiber And Method Of Manufacturing The Same App 20180102201 - LEE; Tae Yoon ; et al. | 2018-04-12 |
| Power Module App 20170170091 - Kim; Young Seok ; et al. | 2017-06-15 |
| Method for bonding with a silver paste Grant 9,589,925 - Hong , et al. March 7, 2 | 2017-03-07 |
| Method For Bonding With A Silver Paste App 20160148900 - HONG; Kyoung-Kook ; et al. | 2016-05-26 |
| Method Of Bonding With Silver Paste App 20160141266 - HONG; Kyoung-Kook ; et al. | 2016-05-19 |
| Method Of Joining Silver Paste App 20150183063 - Hong; Kyoung-Kook ; et al. | 2015-07-02 |
| Method Of Joining Silver Paste App 20150187725 - Hong; Kyoung-Kook ; et al. | 2015-07-02 |
| Semiconductor Device And Method Of Manufacturing The Same App 20150179794 - HONG; Kyoung-Kook ; et al. | 2015-06-25 |
| Semiconductor Device Structure For Ohmic Contact And Method For Fabricating The Same App 20140183557 - KANG; Su Bin ; et al. | 2014-07-03 |
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