Kang; Sien G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Sien G..The latest application filed is for "surface finishing of soi substrates using an epi process".

Company Profile

0.12.5

Kang; Sien G. - Dublin CA
Kang; Sien G. - Pleasanton CA
Kang; Sien G. - Tracy CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Non-contact etch annealing of strained layers Grant 8,187,377 - Malik , et al. May 29, 2	2012-05-29
Surface finishing of SOI substrates using an EPI process App 20070259526 - Kang; Sien G. ; et al.	2007-11-08
Surface finishing of SOI substrates using an EPI process Grant 7,253,081 - Kang , et al. August 7, 2	2007-08-07
Treatment method of film quality for the manufacture of substrates Grant 6,969,668 - Kang , et al. November 29, 2	2005-11-29
Smoothing method for cleaved films made using a release layer Grant 6,881,644 - Malik , et al. April 19, 2	2005-04-19
Non-contact etch annealing of strained layers App 20040067644 - Malik, Igor J. ; et al.	2004-04-08
Smoothing method for cleaved films made using a release layer App 20030008477 - Kang, Sien G. ; et al.	2003-01-09
Smoothing method for cleaved films made using thermal treatment Grant 6,455,399 - Malik , et al. September 24, 2	2002-09-24
Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer Grant 6,448,152 - Henley , et al. September 10, 2	2002-09-10
Surface finishing of SOI substrates using an EPI process App 20020022344 - Kang, Sien G. ; et al.	2002-02-21
Surface finishing of SOI substrates using an EPI process Grant 6,287,941 - Kang , et al. September 11, 2	2001-09-11
Smoothing method for cleaved films made using thermal treatment App 20010016402 - Malik, Igor J. ; et al.	2001-08-23
Smoothing method for cleaved films made using thermal treatment Grant 6,204,151 - Malik , et al. March 20, 2	2001-03-20
Treatment method of cleaved film for the manufacture of substrates Grant 6,171,965 - Kang , et al. January 9, 2	2001-01-09
Purge gas in wafer coating area selection Grant 5,447,570 - Schmitz , et al. September 5, 1	1995-09-05
Film uniformity by selective pressure gradient control Grant 5,387,289 - Schmitz , et al. February 7, 1	1995-02-07
Low-temperature low-stress blanket tungsten film Grant 5,272,112 - Schmitz , et al. December 21, 1	1993-12-21

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.