KANG; Sien
Patent Applications and Registrations
Patent applications and USPTO patent grants for KANG; Sien.The latest application filed is for "bond and release layer transfer process".
- KANG; Sien - Dublin CA
- KANG; Sien - Santa Clara CA
| Patent | Date |
|---|---|
| Bond And Release Layer Transfer Process App 20190103507 - HENLEY; Francois J. ; et al. | 2019-04-04 |
| Techniques For Forming Optoelectronic Devices App 20190024259 - HENLEY; Francois J. ; et al. | 2019-01-24 |
| Bond and release layer transfer process Grant 10,164,144 - Henley , et al. Dec | 2018-12-25 |
| Techniques for forming optoelectronic devices Grant 10,041,187 - Henley , et al. August 7, 2 | 2018-08-07 |
| Bond And Release Layer Transfer Process App 20180040765 - HENLEY; Francois J. ; et al. | 2018-02-08 |
| Bond and release layer transfer process Grant 9,859,458 - Henley , et al. January 2, 2 | 2018-01-02 |
| Techniques For Forming Optoelectronic Devices App 20170358704 - HENLEY; Francois J. ; et al. | 2017-12-14 |
| Techniques For Forming Optoelectronic Devices App 20170084778 - HENLEY; Francois J. ; et al. | 2017-03-23 |
| Bond And Release Layer Transfer Process App 20160372628 - HENLEY; Francois J. ; et al. | 2016-12-22 |
| Techniques For Forming Optoelectronic Devices App 20160111500 - HENLEY; Francois J. ; et al. | 2016-04-21 |
| Techniques for forming optoelectronic devices Grant 9,257,339 - Henley , et al. February 9, 2 | 2016-02-09 |
| Techniques For Forming Optoelectronic Devices App 20140197419 - HENLEY; Francois J. ; et al. | 2014-07-17 |
| Techniques For Forming Optoelectronic Devices App 20130292691 - Henley; Francois J. ; et al. | 2013-11-07 |
| Free-standing thickness of single crystal material and method having carrier lifetimes Grant 8,133,800 - Henley , et al. March 13, 2 | 2012-03-13 |
| Free-standing thickness of single crystal material and method having carrier lifetimes App 20100052105 - Henley; Francois J. ; et al. | 2010-03-04 |
| Carrier Apparatus And Method For Shaped Sheet Materials App 20090152162 - TIAN; LU ; et al. | 2009-06-18 |
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